JPH0650373U - Laser diode mounting structure - Google Patents
Laser diode mounting structureInfo
- Publication number
- JPH0650373U JPH0650373U JP046850U JP4685092U JPH0650373U JP H0650373 U JPH0650373 U JP H0650373U JP 046850 U JP046850 U JP 046850U JP 4685092 U JP4685092 U JP 4685092U JP H0650373 U JPH0650373 U JP H0650373U
- Authority
- JP
- Japan
- Prior art keywords
- laser diode
- mounting structure
- circuit board
- printed circuit
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
Landscapes
- Die Bonding (AREA)
- Semiconductor Lasers (AREA)
Abstract
(57)【要約】
【目的】 精密機器等に使用するレーザーダイオードの
取付け精度を向上させる。
【構成】 レーザーダイオード１の放熱器２を、プリン
ト基板３のランド部分に直接ハンダ付けする事で取付け
精度及び耐振性を向上させるとともに、ランドの広さで
レーザーダイオードの放熱を行う構造である。
(57) [Abstract] [Purpose] To improve the mounting accuracy of laser diodes used in precision equipment. [Structure] The radiator 2 of the laser diode 1 is directly soldered to the land portion of the printed circuit board 3 to improve the mounting accuracy and vibration resistance, and at the same time, the heat dissipation of the laser diode is performed by the size of the land.
Description
【０００１】[0001]
本考案は高い装着精度を要求されるレーザーダイオードの取付構造に関する。 The present invention relates to a laser diode mounting structure that requires high mounting accuracy.
【０００２】[0002]
従来のレーザーダイオードの取付構造は図４で示した取付け構造になっている 。図中１はレーザーダイオードで、２はその放熱器である。３は取付けられるプ リント基板、５は放熱板、６は保持金具である。このレーザーダイオード１に取 付ける放熱板５は図５に示すようにレーザーダイオード１が挿入されると放熱器 ２の部分が密接する穴を設けた放熱板５と、レーザーダイオード１を放熱板５に 挿入した状態でレーザーダイオード１の放熱器２を放熱板５に圧接させる保持金 具６をビス７で放熱板５に固着させる。図５に示す組立方法によって放熱板５を 取付けたレーザーダイオード１はレーザーダイオード装着用のプリント基板３の 配線回路に接続端子をハンダ付けにより取付けていた。 The conventional laser diode mounting structure is the mounting structure shown in FIG. In the figure, 1 is a laser diode and 2 is its radiator. 3 is a printed board to be attached, 5 is a heat sink, and 6 is a holding metal fitting. As shown in FIG. 5, the heat dissipation plate 5 attached to the laser diode 1 includes a heat dissipation plate 5 having a hole in which the radiator 2 comes into close contact with the heat dissipation plate 5 when the laser diode 1 is inserted. In the inserted state, the holding tool 6 for pressing the radiator 2 of the laser diode 1 against the radiator plate 5 is fixed to the radiator plate 5 with the screw 7. In the laser diode 1 having the heat sink 5 attached by the assembling method shown in FIG. 5, the connection terminals were attached to the wiring circuit of the printed circuit board 3 for mounting the laser diode by soldering.
【０００３】[0003]
しかし、上述のような従来技術においては、外部からの振動、あるいは温度又 は湿度等の変化により取付け位置がずれてしまい、１／１００ｍｍ以内の位置精 度を保持することは非常に困難であった。之を解決しようとしてプリント基板を 放熱器と保持金具の間に挟んで締付ける方法も考えられるが、放熱板を取付けた レーザーダイオードのハンダ付に比べてハンダ付段階での放熱板の装着には工数 が多くかかるものである。 However, in the conventional technique as described above, it is very difficult to maintain the position accuracy within 1/100 mm because the mounting position is displaced due to external vibration or changes in temperature or humidity. It was In order to solve the problem, it is conceivable to sandwich the printed circuit board between the heat sink and the holding bracket and tighten it, but compared to soldering the laser diode with the heat sink attached, it takes more time to attach the heat sink at the soldering stage. It costs a lot.
【０００４】 他方、レーザーダイオードは静電気に弱いため、その取扱いには十分な注意が 必要であった。例えば保持金具を該レーザーダイオードとともに放熱板へ取付け る際に電極と接触してしまうことがあり、このため該レーザーダイオードが静電 破壊されるという問題点があった。On the other hand, since the laser diode is sensitive to static electricity, it must be handled with sufficient care. For example, there is a problem that the holding metal may come into contact with the electrode when it is attached to the heat dissipation plate together with the laser diode, so that the laser diode is electrostatically destroyed.
【０００５】[0005]
本考案は、上記のような問題点を解決しようとするもので、図１及び図２に示 すようにプリント基板３に設けたランド４へレーザーダイオード１の放熱器２を 直接ハンダ付けするものである。 上記のような構造であるから、レーザーダイオードは確実にプリント基板に取 付けられ、位置精度はこのプリント基板に設けられたランドの位置精度によって 決定される。また、レーザーダイオードの取付け平面度もプリント基板の平面度 により決定される。 更にプリント基板に設けられたランドを利用することにより、放熱作用が行え る。 The present invention is intended to solve the above-mentioned problems, in which the radiator 2 of the laser diode 1 is directly soldered to the land 4 provided on the printed circuit board 3 as shown in FIGS. Is. With the above structure, the laser diode is securely mounted on the printed circuit board, and the positional accuracy is determined by the positional accuracy of the land provided on the printed circuit board. The flatness of the laser diode mounting is also determined by the flatness of the printed circuit board. Furthermore, by utilizing the land provided on the printed circuit board, heat dissipation can be performed.
【０００６】[0006]
次に、本考案の実施例を図面に基づいて詳細に説明すると、図１に示すとおり レーザーダイオード１をプリント基板３に挿通し、更にこのプリント基板３に設 けてあるランド４の部分に該レーザーダイオード１の放熱器２をハンダ付する。 このとき、レーザーダイオード１をランド４にハンダ付けする手法として、プ リント基板３に描かれた該レーザーダイオード１のパターン部分とレーザーダイ オード本体とを正確に密着させた上で、その境界にクリームハンダ等を塗布し、 ハンダゴテで加熱する。これによりクリームハンダは密着面に浸透し、放熱器２ とランド４とがハンダ付される。 Next, an embodiment of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, the laser diode 1 is inserted into a printed circuit board 3, and the land 4 provided on the printed circuit board 3 is connected to the laser diode 1. The radiator 2 of the laser diode 1 is soldered. At this time, as a method of soldering the laser diode 1 to the land 4, the pattern portion of the laser diode 1 drawn on the printed board 3 and the laser diode body are accurately brought into close contact with each other, and the cream is applied to the boundary. Apply solder etc. and heat with a soldering iron. As a result, the cream solder penetrates the contact surface, and the radiator 2 and the land 4 are soldered.
【０００７】 また、他の実施例として図２のようにプリント基板３のランド４とレーザーダ イオード１に電源を供給する回路パターンが基板の前面と背面に分かれたプリン ト基板３の場合でもハンダ付けの手法は図１で説明したものと同じ手法で実施で きる。Further, as another embodiment, as shown in FIG. 2, even in the case of the printed board 3 in which the circuit pattern for supplying power to the land 4 of the printed board 3 and the laser diode 1 is divided into the front surface and the back surface of the board, soldering is performed. This method can be implemented by the same method as described in FIG.
【０００８】 図１及び図２によってハンダ付した位置精度は１／１００ｍｍ以内にする。こ の位置精度を得るハンダ付作業の歩留まりが悪い場合には図３に示す治具Ａ，治 具Ｂを用いても良い。ハンダ付時に位置精度が狂う原因として、ハンダ付個所が 冷却して硬化する迄の時間差によってハンダの収縮が部分的に異なり、従ってレ ーザーダイオード１の取付方向が狂ってしまう場合がある。この治具Ａは紙挟み の通称目玉クリップの一方の挟部分をレーザーダイオード１の頭部の大きさ程度 に加工したもので良い。この治具Ａの挟圧力は２〜３Ｋｇ以上の力が必要である 。治具Ｂでプリント基板３を固定して、治具Ｂとレーザーダイオード１の頭部間 に治具Ａの挟圧部を当接してハンダ付けを行う。ハンダが冷えてから治具Ａ、治 具Ｂから取りはずすと、レーザーダイオード１とプリント基板３の位置精度は熟 達者でなくても容易に基準レベルに作れるものである。The position accuracy soldered according to FIGS. 1 and 2 is within 1/100 mm. When the yield of soldering work for obtaining this positional accuracy is low, the jig A and the jig B shown in FIG. 3 may be used. The reason why the positional accuracy becomes incorrect when soldering is that the shrinkage of the solder partly differs due to the time difference between the place where the solder is applied and the point where it cools and hardens, so that the mounting direction of the laser diode 1 may become incorrect. The jig A may be one in which one side of a commonly known eyeball clip, which is a paper clip, is processed into a size approximately the size of the head of the laser diode 1. The clamping force of the jig A requires a force of 2 to 3 kg or more. The printed circuit board 3 is fixed with the jig B, and the pinching portion of the jig A is brought into contact between the jig B and the head of the laser diode 1 for soldering. If the solder is cooled and then removed from the jig A and the jig B, the positional accuracy of the laser diode 1 and the printed circuit board 3 can be easily made to the reference level even if not a skilled person.
【０００９】 プリント基板３に取付けられたレーザーダイオード１の放熱は機器の構造や機 器の放熱手段によって異なるからレーザーダイオード１の放熱器２をハンダ付け したランド４の広さを必要に応じて広くするか狭くするかを決めればよい。Since the heat radiation of the laser diode 1 mounted on the printed board 3 differs depending on the structure of the device and the heat radiation means of the device, the size of the land 4 to which the heat radiator 2 of the laser diode 1 is soldered is widened as necessary. You can decide whether to do it or narrow it.
【００１０】[0010]
本考案は以上説明したように、レーザーダイオードの位置精度がよく、しかも 狂いのない取付けが容易に行なえ経年変化や振動に対しても安定しており、また 小型で安価な取付け構造を有し、かつ、放熱器の作用をプリント基板によって行 えるため、機器設計の自由度を拡大し得る効果がある。 As described above, the present invention has a good positioning accuracy of the laser diode, can be easily installed without distortion, is stable against secular change and vibration, and has a small and inexpensive mounting structure. Moreover, since the function of the radiator can be performed by the printed circuit board, there is an effect that the degree of freedom in equipment design can be expanded.
【図１】本考案に係わる取付構造の断面図。FIG. 1 is a sectional view of a mounting structure according to the present invention.
【図２】本考案に係わる取付構造の他の実施態様を示す
側面図。FIG. 2 is a side view showing another embodiment of the mounting structure according to the present invention.
【図３】ハンダ付け時の位置安定の為に治具を用いた作
業態様を示す斜視図。FIG. 3 is a perspective view showing a working mode in which a jig is used to stabilize the position when soldering.
【図４】従来の取付構造の断面図。FIG. 4 is a sectional view of a conventional mounting structure.
【図５】従来の取付構造の分解斜視図。FIG. 5 is an exploded perspective view of a conventional mounting structure.
１ ・・・・・ レーザーダイオード ２ ・・・・・ 放熱器 ３ ・・・・・ プリント基板 ４ ・・・・・ ランド ５ ・・・・・ 放熱板 ６ ・・・・・ 保持金具 ７ ・・・・・ ネジ 1 ・ ・ ・ Laser diode 2 ・ ・ ・ ・ ・ Radiator 3 ・ ・ ・ ・ ・ Printed circuit board 4 ・ ・ ・ ・ ・ Land 5 ・ ・ ・ Heat sink 6 ・ ・ ・ ・ ・ Holding metal 7 ・ ・··· screw
Claims (1)
ザーダイオード１の放熱器２を直接ハンダ付けすること
を特徴とするレーザーダイオードの取付構造。1. A mounting structure for a laser diode, wherein a radiator 2 of the laser diode 1 is directly soldered to a land 4 portion of a printed circuit board 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP046850U JPH0650373U (en) | 1992-06-12 | 1992-06-12 | Laser diode mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP046850U JPH0650373U (en) | 1992-06-12 | 1992-06-12 | Laser diode mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0650373U true JPH0650373U (en) | 1994-07-08 |
Family
ID=12758820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP046850U Pending JPH0650373U (en) | 1992-06-12 | 1992-06-12 | Laser diode mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650373U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100458127B1 (en) * | 2002-08-31 | 2004-11-18 | (주)애니람다 | An apparatus for heat venting of a laser diode in an optical module |
| JP2005317925A (en) * | 2004-04-02 | 2005-11-10 | Ricoh Co Ltd | Light source device, recording device, platemaking device, and image forming apparatus |
| JP2006278361A (en) * | 2005-03-28 | 2006-10-12 | Sharp Corp | Semiconductor light-emitting device module |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6337677A (en) * | 1986-07-31 | 1988-02-18 | Pioneer Electronic Corp | Printed board carrying optical element |
| JPH0220367B2 (en) * | 1985-03-18 | 1990-05-09 | Niigata Engineering Co Ltd | |
| JPH0322554A (en) * | 1989-06-20 | 1991-01-30 | Matsushita Electric Ind Co Ltd | Heat dissipation device for electronic component |
| JPH03177095A (en) * | 1989-12-06 | 1991-08-01 | Hitachi Ltd | Method of dissipating heat of electronic component |
| JPH03214763A (en) * | 1990-01-19 | 1991-09-19 | Nec Corp | Lead frame for semiconductor integrated circuit device and the device using the same |
| JPH03241795A (en) * | 1990-02-19 | 1991-10-28 | Nec Corp | Power amplification module structure |
| JPH03245586A (en) * | 1990-02-23 | 1991-11-01 | Nec Corp | Optical transmission circuit |
| JPH0448662A (en) * | 1990-06-14 | 1992-02-18 | Hitachi Cable Ltd | Mount method of light emitting diode/microchip, light emitting diode/microchip device and light emitting diode/ microchip |
| JPH04134894A (en) * | 1990-09-27 | 1992-05-08 | Ricoh Co Ltd | Light source device |
-
1992
- 1992-06-12 JP JP046850U patent/JPH0650373U/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0220367B2 (en) * | 1985-03-18 | 1990-05-09 | Niigata Engineering Co Ltd | |
| JPS6337677A (en) * | 1986-07-31 | 1988-02-18 | Pioneer Electronic Corp | Printed board carrying optical element |
| JPH0322554A (en) * | 1989-06-20 | 1991-01-30 | Matsushita Electric Ind Co Ltd | Heat dissipation device for electronic component |
| JPH03177095A (en) * | 1989-12-06 | 1991-08-01 | Hitachi Ltd | Method of dissipating heat of electronic component |
| JPH03214763A (en) * | 1990-01-19 | 1991-09-19 | Nec Corp | Lead frame for semiconductor integrated circuit device and the device using the same |
| JPH03241795A (en) * | 1990-02-19 | 1991-10-28 | Nec Corp | Power amplification module structure |
| JPH03245586A (en) * | 1990-02-23 | 1991-11-01 | Nec Corp | Optical transmission circuit |
| JPH0448662A (en) * | 1990-06-14 | 1992-02-18 | Hitachi Cable Ltd | Mount method of light emitting diode/microchip, light emitting diode/microchip device and light emitting diode/ microchip |
| JPH04134894A (en) * | 1990-09-27 | 1992-05-08 | Ricoh Co Ltd | Light source device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100458127B1 (en) * | 2002-08-31 | 2004-11-18 | (주)애니람다 | An apparatus for heat venting of a laser diode in an optical module |
| JP2005317925A (en) * | 2004-04-02 | 2005-11-10 | Ricoh Co Ltd | Light source device, recording device, platemaking device, and image forming apparatus |
| JP2006278361A (en) * | 2005-03-28 | 2006-10-12 | Sharp Corp | Semiconductor light-emitting device module |
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