JP2521334Y2 - Printed board - Google Patents
Printed boardInfo
- Publication number
- JP2521334Y2 JP2521334Y2 JP10636691U JP10636691U JP2521334Y2 JP 2521334 Y2 JP2521334 Y2 JP 2521334Y2 JP 10636691 U JP10636691 U JP 10636691U JP 10636691 U JP10636691 U JP 10636691U JP 2521334 Y2 JP2521334 Y2 JP 2521334Y2
- Authority
- JP
- Japan
- Prior art keywords
- spring
- circuit board
- printed circuit
- contact
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、ＦＧ接点用バネを取り
付けたプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board to which a spring for FG contact is attached.
【０００２】[0002]
【従来の技術】ＦＧ接点用バネを取り付けたプリント基
板は、例えば、ノート型パソコン又はブック型パソコン
として通称される携帯型パソコン等に使用されるＩＣカ
ード等に用いられている。2. Description of the Related Art A printed circuit board to which a spring for an FG contact is attached is used, for example, in an IC card used in a portable personal computer or the like commonly known as a notebook personal computer or a book personal computer.
【０００３】例えば、図５に示す如く、ＩＣカード３０
としては、携帯型パソコン３１の側部３２に設けられた
コネクタ部３３に差し込まれて使用される拡張ＲＡＭカ
ード等が知られている。For example, as shown in FIG. 5, an IC card 30
For example, an expansion RAM card or the like which is used by being inserted into a connector portion 33 provided on the side portion 32 of the portable personal computer 31 is known.
【０００４】従来、このＩＣカード３０に用いられるプ
リント基板としては、例えば、図６に示す如く、貫通孔
３６にリード４２を挿通すると共に半田付けしてＦＧ接
点用バネ４０が取り付けられている。Conventionally, as a printed circuit board used for this IC card 30, for example, as shown in FIG. 6, a lead 42 is inserted into the through hole 36 and soldered to attach an FG contact spring 40.
【０００５】ＦＧ接点用バネ４０は、ＦＧ接点用バネ本
体４１の底部を打ち抜き、折曲げにより形成したリード
４２と、ＦＧ接点用バネ本体４１の一部を折曲して形成
したバネ４３を有し、プリント基板３５の一面側３５ａ
からリード４２を貫通孔３６に挿通し、プリント基板３
５の他面側３５ｂで半田付け（３７）することによっ
て、プリント基板３５に固着されている。The FG contact spring 40 has a lead 42 formed by punching and bending the bottom of the FG contact spring body 41, and a spring 43 formed by bending a part of the FG contact spring body 41. Then, one surface side 35a of the printed circuit board 35
The lead 42 through the through hole 36,
It is fixed to the printed circuit board 35 by soldering (37) on the other surface side 35b of 5.
【０００６】[0006]
【考案が解決しようとする課題】然し、上述した従来の
プリント基板３５では、図６に示す如く、ＦＧ接点用バ
ネ４０は、ＦＧ接点用バネ本体４１の底部を打ち抜き、
折曲げにより形成したリード４２を、プリント基板３５
の一面側３５ａからリード４２を貫通孔３６に挿通した
後、プリント基板３５の他面側３５ｂで半田付け３７す
るため、プリント基板３５にＦＧ接点用バネ４０を載置
した後に、プリント基板３５を裏返して半田付け３７し
なければならなかった。However, in the above-mentioned conventional printed circuit board 35, as shown in FIG. 6, the FG contact spring 40 is formed by punching out the bottom portion of the FG contact spring main body 41.
The lead 42 formed by bending is connected to the printed circuit board 35.
After inserting the lead 42 from the one surface side 35a into the through hole 36 and soldering 37 on the other surface side 35b of the printed circuit board 35, after mounting the FG contact spring 40 on the printed circuit board 35, the printed circuit board 35 is mounted. I had to turn it over and solder 37.
【０００７】従って、従来のＦＧ接点用バネ４０では、
プリント基板３５への載置と、半田付け３７が逆になる
ため、作業が煩雑となり、而も、ＦＧ接点用バネ４０を
プリント基板３５に載置した後に、仮固定用の治具で固
定する必要があった。Therefore, in the conventional FG contact spring 40,
Since the mounting on the printed circuit board 35 and the soldering 37 are reversed, the work becomes complicated, and after the FG contact spring 40 is mounted on the printed circuit board 35, it is fixed by a temporary fixing jig. There was a need.
【０００８】而も、従来のＦＧ接点用バネ４０では、プ
リント基板３５の裏面側からリード４２が突出するた
め、その高さｃが取れない構造物には、適用できないと
いう不具合があった。Further, the conventional FG contact spring 40 has a problem that it cannot be applied to a structure in which the height c cannot be taken because the lead 42 projects from the back surface side of the printed circuit board 35.
【０００９】本考案は斯かる従来の問題点を解決するた
めに為されたもので、その目的は、ＦＧ接点用バネの取
付性を良好にすると共に半田付けを容易にし、且つＦＧ
接点用バネの裏面側への張出を小さくすることができる
プリント基板を提供することにある。The present invention has been made in order to solve such a conventional problem, and an object thereof is to improve the mountability of a spring for an FG contact, to facilitate the soldering, and to improve the FG.
An object of the present invention is to provide a printed circuit board that can reduce the protrusion of the contact spring to the back surface side.
【００１０】[0010]
【課題を解決するための手段】本考案は、貫通孔にリー
ドを挿通すると共に半田付けしてＦＧ接点用バネを取り
付けたプリント基板に於て、前記ＦＧ接点用バネは、バ
ネ本体と、このバネ本体から立設するリードと、このリ
ードと同じ方向へ前記バネ本体から立設する略Ｌ字状の
バネで構成され、前記リードは、前記プリント基板の一
面側から貫通孔に挿通され該プリント基板の他面側で半
田付けされ、前記略Ｌ字状のバネは、その立上部を前記
プリント基板の先端部に当接しているものである。According to the present invention, in a printed circuit board in which a lead is inserted into a through hole and a FG contact spring is attached by soldering, the FG contact spring includes a spring body and a spring body. The lead is erected from the spring main body and a substantially L-shaped spring erected from the spring main body in the same direction as the lead, and the lead is inserted into the through hole from one surface side of the printed circuit board. The substantially L-shaped spring is soldered on the other surface side of the board, and the rising portion of the spring is in contact with the tip portion of the printed board.
【００１１】[0011]
【作用】本考案に於ては、プリント基板をＦＧ接点用バ
ネのリードとバネとの間を通し、プリント基板の先端部
をバネの立上部を当接した後、ＦＧ接点用バネ又はプリ
ント基板を回動すると、プリント基板の貫通孔にリード
が挿通する。これによって、ＦＧ接点用バネは、プリン
ト基板に仮固定される。その後、プリント基板の一面側
から貫通孔に挿通されたリードは、略Ｌ字状のバネ側で
半田付けされる。In the present invention, the printed circuit board is passed between the lead of the FG contact spring and the spring, and the leading end of the printed circuit board is brought into contact with the rising part of the spring, and then the spring for the FG contact or the printed circuit board. When is rotated, the lead is inserted into the through hole of the printed board. As a result, the FG contact spring is temporarily fixed to the printed board. After that, the leads inserted into the through holes from the one surface side of the printed board are soldered on the substantially L-shaped spring side.
【００１２】[0012]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図１乃至図４は、本考案に係るプリント基板の一
実施例を示すものである。Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an embodiment of a printed circuit board according to the present invention.
【００１３】プリント基板１０には、端部１０ｃに設け
た２つの貫通孔１１にリード２２を挿通すると共に半田
付け２５してＦＧ接点用バネ２０が取り付けられてい
る。このＦＧ接点用バネ２０は、図４に示す如く、バネ
本体２１と、このバネ本体２１の一端部から同じ方向に
立設する２つのリード２２と、これらのリード２２と同
じ方向へバネ本体２１から立設する略Ｌ字状のバネ２３
とで構成されている。The FG contact spring 20 is attached to the printed circuit board 10 by inserting the leads 22 into the two through holes 11 provided in the end portion 10c and soldering 25. As shown in FIG. 4, the FG contact spring 20 includes a spring body 21, two leads 22 standing in the same direction from one end of the spring body 21, and the spring body 21 in the same direction as the leads 22. L-shaped spring 23 standing upright
It consists of and.
【００１４】そして、このＦＧ接点用バネ２０は、次の
如くして、プリント基板１０の先端部１０ｃに取り付け
られる。先ず、図３に示す如く、プリント基板１０をＦ
Ｇ接点用バネ２０のリード２２と略Ｌ字状のバネ２３と
の間を通し、プリント基板１０の先端部１０ｃを略Ｌ字
状のバネ２３の立上部２３ａを当接した後、ＦＧ接点用
バネ２０又はプリント基板１０を矢印の如く回動する
と、プリント基板１０の貫通孔１１にリード２２が挿通
する。The FG contact spring 20 is attached to the tip portion 10c of the printed board 10 as follows. First, as shown in FIG.
After passing between the lead 22 of the G contact spring 20 and the substantially L-shaped spring 23, and contacting the leading end portion 10c of the printed circuit board 10 with the rising portion 23a of the substantially L-shaped spring 23, the FG contact When the spring 20 or the printed circuit board 10 is rotated as shown by the arrow, the lead 22 is inserted into the through hole 11 of the printed circuit board 10.
【００１５】これによって、ＦＧ接点用バネ２０は、図
２に示す如く、プリント基板１０に仮固定される。その
後、プリント基板１０の一面側１０ａから貫通孔１１に
挿通されたリード２２は、略Ｌ字状のバネ２３側で半田
付けされる。As a result, the FG contact spring 20 is temporarily fixed to the printed circuit board 10 as shown in FIG. After that, the leads 22 inserted into the through holes 11 from the one surface side 10a of the printed board 10 are soldered on the side of the spring 23 having a substantially L shape.
【００１６】尚、略Ｌ字状のバネ２３の立上部２３ａの
高さａは、プリント基板１０の板厚よりも僅かに大きく
し、又、プリント基板１０の貫通孔１１の直径φｂをリ
ード２２の巾よりも僅かに大きくしておくことにより、
上述したＦＧ接点用バネ２０の仮固定が可能となる。The height a of the rising portion 23a of the substantially L-shaped spring 23 is slightly larger than the plate thickness of the printed board 10, and the diameter φb of the through hole 11 of the printed board 10 is set to the lead 22. By making it slightly larger than the width of
The FG contact spring 20 described above can be temporarily fixed.
【００１７】以上の如く、本実施例によれば、例えば、
図３に示す如く、プリント基板１０の端部１０ｃにＦＧ
接点用バネ２０を取り付けた後、プリント基板１０又は
ＦＧ接点用バネ２０を回動することにより、プリント基
板１０の貫通孔１１にＦＧ接点用バネ２０のリード２２
を嵌入すると共に、プリント基板１０がＦＧ接点用バネ
２０の略Ｌ字状のバネ２３の立上部２３ａに当接して挟
持されるので、ＦＧ接点用バネ２０がプリント基板１０
から容易に脱落することがない。As described above, according to this embodiment, for example,
As shown in FIG. 3, the FG is formed on the end portion 10c of the printed circuit board 10.
After the contact spring 20 is attached, the printed circuit board 10 or the FG contact spring 20 is rotated so that the lead 22 of the FG contact spring 20 is inserted into the through hole 11 of the printed circuit board 10.
Since the printed circuit board 10 is held in contact with the rising portion 23a of the substantially L-shaped spring 23 of the FG contact spring 20, the FG contact spring 20 is inserted into the printed circuit board 10.
It does not fall off easily.
【００１８】そのため、図２に示す仮固定状態でプリン
ト基板１０を搬送することが可能となり、従来の如く、
仮固定するための治具を用意する必要が無くなる。又、
ＦＧ接点用バネ２０のリード２２の半田付け２５は、Ｆ
Ｇ接点用バネ２０の略Ｌ字状のバネ２３側で行われるた
め、半田付け時にプリント基板１０を裏返しにする作業
が不要となる。Therefore, the printed circuit board 10 can be transported in the temporarily fixed state shown in FIG.
There is no need to prepare a jig for temporary fixing. or,
The soldering 25 of the lead 22 of the FG contact spring 20 is F
Since it is performed on the substantially L-shaped spring 23 side of the G contact spring 20, it is not necessary to turn over the printed circuit board 10 during soldering.
【００１９】更に、プリント基板１０の一面側１０ａへ
の突出は、ＦＧ接点用バネ２０の肉厚だけであるから、
例えば、図６に示す如く、ＦＧ接点用バネ２０の肉厚よ
り遙かに突出する半田部位を形成することが無くなる。Further, since the protrusion of the printed circuit board 10 to the one surface side 10a is only the thickness of the FG contact spring 20,
For example, as shown in FIG. 6, it is not necessary to form a solder portion that projects far beyond the wall thickness of the FG contact spring 20.
【００２０】そのため、プリント基板１０の一面側１０
ａと他部品との距離を取れないＩＣカード等の如き薄肉
製品に有効に利用できる。又、ＦＧ接点用バネ２０を載
置する側にだけ実装面となっているプリント基板にとっ
ては、半田付けが実装面だけで済むため、作業効率が一
層向上する。Therefore, one surface side 10 of the printed circuit board 10
It can be effectively used for thin-walled products such as IC cards in which a can be kept away from other parts. Further, for a printed circuit board having a mounting surface only on the side on which the FG contact spring 20 is mounted, soldering is required only on the mounting surface, which further improves work efficiency.
【００２１】[0021]
【考案の効果】以上説明した如く、本考案によれば、Ｆ
Ｇ接点用バネのリードをプリント基板の一面側から貫通
孔に挿通すると、プリント基板の端部がＦＧ接点用バネ
の略Ｌ字状のバネの立上部と当接した状態となって挟持
されるため、治具等の補助具を要することなく、ＦＧ接
点用バネをプリント基板に仮固定することができる。As described above, according to the present invention, the F
When the lead of the G contact spring is inserted into the through hole from the one surface side of the printed circuit board, the end of the printed circuit board is held in contact with the rising portion of the substantially L-shaped spring of the FG contact spring. Therefore, the spring for the FG contact can be temporarily fixed to the printed circuit board without the need for auxiliary tools such as jigs.
【００２２】その結果、ＦＧ接点用バネの組付と半田付
けとを分離して操作することが可能となる。又、ＦＧ接
点用バネのリードの突出側と略Ｌ字状のバネとは同じ平
面であるから、半田付け時にプリント基板を裏返す必要
が無くなり、半田付け作業が容易となる。As a result, it becomes possible to operate the FG contact spring assembly and the soldering separately. Further, since the projecting side of the lead of the FG contact spring and the substantially L-shaped spring are on the same plane, it is not necessary to turn over the printed circuit board at the time of soldering, which facilitates the soldering work.
【００２３】更に、ＦＧ接点用バネのリードの突出側と
略Ｌ字状のバネとの反対側の突出量は、ＦＧ接点用バネ
の肉厚分だけであるから、他部品との距離が無い薄肉，
小型化製品には好適である。Furthermore, since the protrusion amount of the lead of the FG contact spring and the opposite side of the substantially L-shaped spring is only the thickness of the FG contact spring, there is no distance from other parts. Thin,
Suitable for miniaturized products.
【図１】本考案の一実施例に係るプリント基板の要部を
示す斜視図である。FIG. 1 is a perspective view showing a main part of a printed circuit board according to an embodiment of the present invention.
【図２】図１の要部を示す側面図である。FIG. 2 is a side view showing a main part of FIG.
【図３】本考案の一実施例に係るプリント基板の組立状
態を示す側面図である。FIG. 3 is a side view showing an assembled state of a printed circuit board according to an embodiment of the present invention.
【図４】図１に於けるＦＧ接点用バネを示す斜視図であ
る。FIG. 4 is a perspective view showing an FG contact spring in FIG.
【図５】携帯型パソコンを示す斜視図である。FIG. 5 is a perspective view showing a portable personal computer.
【図６】従来のプリント基板を示す側面図である。FIG. 6 is a side view showing a conventional printed circuit board.
１０ プリント基板 １１ 貫通孔 １０ａ 一面側 １０ｂ 他面側 １０ｃ 端部 ２０ ＦＧ接点用バネ ２１ バネ本体 ２２ リード ２３ 略Ｌ字状のバネ ２３ａ 立上部 ２５ 半田付け 10 Printed Circuit Board 11 Through Hole 10a One Side 10b Other Side 10c End 20 Spring for FG Contact 21 Spring Main Body 22 Lead 23 Almost L-shaped Spring 23a Standing 25 Soldering
Claims (1)
すると共に半田付けしてＦＧ接点用バネ（２０）を取り
付けたプリント基板に於て、 前記ＦＧ接点用バネ（２０）は、バネ本体（２１）と、
このバネ本体（２１）から立設するリード（２２）と、
このリード（２２）と同じ方向へ前記バネ本体（２１）
から立設する略Ｌ字状のバネ（２３）で構成され、 前記リード（２２）は、前記プリント基板（１０）の一
面側（１０ａ）から貫通孔（１１）に挿通され該プリン
ト基板（１０）の他面側（１０ｂ）で半田付け（２５）
され、 前記略Ｌ字状のバネ（２３）は、その立上部（２３ａ）
を前記プリント基板（１０）の先端部（１０ｃ）に当接
していることを特徴とするプリント基板。1. A printed circuit board in which a lead (22) is inserted into a through hole (11) and soldered to attach an FG contact spring (20), wherein the FG contact spring (20) is a spring. Body (21),
A lead (22) standing from the spring body (21),
In the same direction as the lead (22), the spring body (21)
The lead (22) is inserted into the through hole (11) from one surface side (10a) of the printed circuit board (10) and is formed of a substantially L-shaped spring (23) standing upright from the printed circuit board (10). ) Solder on the other side (10b) (25)
The substantially L-shaped spring (23) has a rising portion (23a).
Is in contact with the tip portion (10c) of the printed circuit board (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10636691U JP2521334Y2 (en) | 1991-12-24 | 1991-12-24 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10636691U JP2521334Y2 (en) | 1991-12-24 | 1991-12-24 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0555588U JPH0555588U (en) | 1993-07-23 |
| JP2521334Y2 true JP2521334Y2 (en) | 1996-12-25 |
Family
ID=14431733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10636691U Expired - Lifetime JP2521334Y2 (en) | 1991-12-24 | 1991-12-24 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2521334Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2806902B2 (en) * | 1996-08-09 | 1998-09-30 | 静岡日本電気株式会社 | Grounding structure of electronic equipment |
-
1991
- 1991-12-24 JP JP10636691U patent/JP2521334Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0555588U (en) | 1993-07-23 |
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