JPS5825051U - lead pin - Google Patents

lead pin

Info

Publication number
JPS5825051U
JPS5825051U JP11952281U JP11952281U JPS5825051U JP S5825051 U JPS5825051 U JP S5825051U JP 11952281 U JP11952281 U JP 11952281U JP 11952281 U JP11952281 U JP 11952281U JP S5825051 U JPS5825051 U JP S5825051U
Authority
JP
Japan
Prior art keywords
lead pin
view
recorded
exerting
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11952281U
Other languages
Japanese (ja)
Inventor
宇和　完
Original Assignee
富士通テン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通テン株式会社 filed Critical 富士通テン株式会社
Priority to JP11952281U priority Critical patent/JPS5825051U/en
Publication of JPS5825051U publication Critical patent/JPS5825051U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例のリードピン１を備えた半導
体素子２の斜視図、第２図はリードピン１の正面図、第
３図はリードピン１を製造する工程を説明するための斜
視図、第４図は第２図の切断面線■−■から見た断面図
、第５図は半導体素子２をプリント配線基板７に実装し
た状態を示す一部断面図、第６図は本考案の他の実施例
のリードピン１１の正面図、第７図はそのリードピン１
１の側面図である。 １．１１・・・リードピン、２・・・半導体素子、３・
・・パッケージ、４，１４・・・基部、５．１５・・・
接続部、７・・・プリント配線基板、訃・・透孔、９・
・・導電性被覆。FIG. 1 is a perspective view of a semiconductor element 2 equipped with a lead pin 1 according to an embodiment of the present invention, FIG. 2 is a front view of the lead pin 1, and FIG. 3 is a perspective view for explaining the process of manufacturing the lead pin 1. , FIG. 4 is a sectional view taken along the cutting plane line ■-■ in FIG. FIG. 7 is a front view of the lead pin 11 of another embodiment.
1 is a side view of FIG. 1.11...Lead pin, 2...Semiconductor element, 3.
...Package, 4,14...Base, 5.15...
Connection part, 7...Printed wiring board, end...Through hole, 9.
...Conductive coating.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 長手方向に対して直角な外方に向ってばね力を発揮する
ことを特徴とするリードピン。A lead pin that is characterized by exerting a spring force outward perpendicular to the longitudinal direction.
JP11952281U 1981-08-11 1981-08-11 lead pin Pending JPS5825051U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11952281U JPS5825051U (en) 1981-08-11 1981-08-11 lead pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11952281U JPS5825051U (en) 1981-08-11 1981-08-11 lead pin

Publications (1)

Publication Number Publication Date
JPS5825051U true JPS5825051U (en) 1983-02-17

Family

ID=29913581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11952281U Pending JPS5825051U (en) 1981-08-11 1981-08-11 lead pin

Country Status (1)

Country Link
JP (1) JPS5825051U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166565U (en) * 1985-04-01 1986-10-16
JP2016115623A (en) * 2014-12-17 2016-06-23 ダイキン工業株式会社 Module-terminal block connection structure and connection method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166565U (en) * 1985-04-01 1986-10-16
JP2016115623A (en) * 2014-12-17 2016-06-23 ダイキン工業株式会社 Module-terminal block connection structure and connection method
WO2016098475A1 (en) * 2014-12-17 2016-06-23 ダイキン工業株式会社 Module-terminal block connection structure and connection method
CN107112654A (en) * 2014-12-17 2017-08-29 大金工业株式会社 Module terminals platform attachment structure and connection method
EP3236533A4 (en) * 2014-12-17 2018-06-13 Daikin Industries, Ltd. Module-terminal block connection structure and connection method
US10038256B2 (en) 2014-12-17 2018-07-31 Daikin Industries, Ltd. Module-terminal block connection structure and connection method
CN107112654B (en) * 2014-12-17 2019-11-22 大金工业株式会社 Module-terminal board connection structure and connection method

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