JPS59177929U - Resin-clad electronic components - Google Patents
Resin-clad electronic componentsInfo
- Publication number
- JPS59177929U JPS59177929U JP7177683U JP7177683U JPS59177929U JP S59177929 U JPS59177929 U JP S59177929U JP 7177683 U JP7177683 U JP 7177683U JP 7177683 U JP7177683 U JP 7177683U JP S59177929 U JPS59177929 U JP S59177929U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- clad
- electronic components
- electronic component
- flattened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は樹脂外装形電子部品の従来の二側を
示す各断面図、第３図は第１図の電子部品の実装例を示
す側面図、第４図は本考案の前提゛となる電子部品の斜
視図、第５図乃至第７図は本考案の第１実施例を示す斜
視図キ側面図及び背面図、第８図乃至第１０図は第５図
の電子部品の各製造工程での側面図、第１１図及び第１
２図は本考案の第２実施例を示す斜視図、及び側面図、
第１３図は本考案の第３実施例を示す斜視図、第１４図
は第１３図の電子部品の製造に使用するタイバ一部品の
正面図、第１５図及び第１６図は本考案の第４実施例を
示す斜視図及び背面図、第１７図は第１５図の電子部品
の一製造工程での部分正面図である。
１３・・・部品本体、１４： １４’、１５．１５′
・・・外部リード部材、１６．１６’・・・外装樹脂材
、ｍｌ・・・平担側面、ｍ２・・・反対側の一側面。
第１４図
第１５図Figures 1 and 2 are sectional views showing conventional two sides of a resin-clad electronic component, Figure 3 is a side view showing an example of mounting the electronic component in Figure 1, and Figure 4 is the premise of the present invention. FIGS. 5 to 7 are perspective views, side and rear views showing the first embodiment of the present invention, and FIGS. 8 to 10 are perspective views of the electronic components shown in FIG. 5. Side view of each manufacturing process, Figure 11 and Figure 1
2 is a perspective view and a side view showing a second embodiment of the present invention,
FIG. 13 is a perspective view showing a third embodiment of the present invention, FIG. 14 is a front view of a tie bar part used in manufacturing the electronic component shown in FIG. 13, and FIGS. A perspective view and a rear view showing the fourth embodiment, and FIG. 17 is a partial front view of the electronic component shown in FIG. 15 in one manufacturing process. 13... Part body, 14: 14', 15.15'
...External lead member, 16.16'...Exterior resin material, ml...Flat side surface, m2...One side surface on the opposite side. Figure 14 Figure 15
Claims (1)
外装した電子部品において、未硬化状態にある外装樹脂
材の一方向側面を平担化すると共に、当該平担側面と反
対側の一側面に沿って外部リード部材を折曲形成したこ
とを特徴とする樹脂外装形電子部品。In an electronic component in which an external lead member is derived and the component body is resin-clad by a resin dipping method, one side surface of the uncured exterior resin material is flattened, and one side surface opposite to the flat side surface is flattened. A resin-clad electronic component characterized in that an external lead member is bent along the following lines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7177683U JPS59177929U (en) | 1983-05-13 | 1983-05-13 | Resin-clad electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7177683U JPS59177929U (en) | 1983-05-13 | 1983-05-13 | Resin-clad electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59177929U true JPS59177929U (en) | 1984-11-28 |
Family
ID=30201928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7177683U Pending JPS59177929U (en) | 1983-05-13 | 1983-05-13 | Resin-clad electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59177929U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532280A (en) * | 2005-02-25 | 2008-08-14 | ヴィスハイ デール エレクトロニクス，インコーポレーテッド | Surface mount electrical resistor with thermally conductive and electrically non-conductive filler and method of making the same |
| WO2019117128A1 (en) * | 2017-12-12 | 2019-06-20 | Koa株式会社 | Method for manufacturing resistor |
| JP2019106448A (en) * | 2017-12-12 | 2019-06-27 | Koa株式会社 | Manufacturing method of resistor |
| US11011290B2 (en) | 2017-12-12 | 2021-05-18 | Koa Corporation | Method for manufacturing resistor, and resistor |
-
1983
- 1983-05-13 JP JP7177683U patent/JPS59177929U/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532280A (en) * | 2005-02-25 | 2008-08-14 | ヴィスハイ デール エレクトロニクス，インコーポレーテッド | Surface mount electrical resistor with thermally conductive and electrically non-conductive filler and method of making the same |
| JP4806421B2 (en) * | 2005-02-25 | 2011-11-02 | ヴィスハイ デール エレクトロニクス，インコーポレーテッド | Surface mount electrical resistor with thermally conductive and electrically non-conductive filler and method of making the same |
| WO2019117128A1 (en) * | 2017-12-12 | 2019-06-20 | Koa株式会社 | Method for manufacturing resistor |
| JP2019106449A (en) * | 2017-12-12 | 2019-06-27 | Koa株式会社 | Manufacturing method of resistor |
| JP2019106448A (en) * | 2017-12-12 | 2019-06-27 | Koa株式会社 | Manufacturing method of resistor |
| CN111465999A (en) * | 2017-12-12 | 2020-07-28 | Koa株式会社 | Method for manufacturing resistor |
| US10892074B2 (en) | 2017-12-12 | 2021-01-12 | Koa Corporation | Method for manufacturing resistor |
| US11011290B2 (en) | 2017-12-12 | 2021-05-18 | Koa Corporation | Method for manufacturing resistor, and resistor |
| CN111465999B (en) * | 2017-12-12 | 2022-04-15 | Koa株式会社 | Method for manufacturing resistor |
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