JPS58189540U - High-density packaging hybrid integrated circuit - Google Patents
High-density packaging hybrid integrated circuitInfo
- Publication number
- JPS58189540U JPS58189540U JP8615682U JP8615682U JPS58189540U JP S58189540 U JPS58189540 U JP S58189540U JP 8615682 U JP8615682 U JP 8615682U JP 8615682 U JP8615682 U JP 8615682U JP S58189540 U JPS58189540 U JP S58189540U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- density packaging
- packaging hybrid
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図は従来のフラット・パッケージ形あるい
はデュアルインライン形のハイブリッドＩＣの構造を示
す断面図。第３図、第４図は本考案の実施例を示す断面
図及び斜視図。
１：ハイブリ・クドＩＣ基板、２：搭載部品、３ニブリ
ント基板、４：ハイブリッドＩＣのリード、５：モール
ド材、６：はんだ、７：接着剤。1 and 2 are cross-sectional views showing the structure of a conventional flat package type or dual-inline type hybrid IC. 3 and 4 are a sectional view and a perspective view showing an embodiment of the present invention. 1: Hybrid IC board, 2: Mounting components, 3 Niblint board, 4: Hybrid IC lead, 5: Mold material, 6: Solder, 7: Adhesive.
Claims (1)
において、これを２個組合せ、部品を搭載しない面どう
しを張り合わせると共に、外部との接続のためのリード
を基板面と垂直方向に曲げることにより、フラットパッ
ケージ形構造としたことを特徴とする混成集積回路。Hybrid IC with a structure in which components are mounted on one side of the board
, by combining two of these, pasting the surfaces on which no components are mounted, and bending the leads for connection with the outside in a direction perpendicular to the board surface, a flat package structure is created. integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8615682U JPS58189540U (en) | 1982-06-11 | 1982-06-11 | High-density packaging hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8615682U JPS58189540U (en) | 1982-06-11 | 1982-06-11 | High-density packaging hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58189540U true JPS58189540U (en) | 1983-12-16 |
Family
ID=30094986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8615682U Pending JPS58189540U (en) | 1982-06-11 | 1982-06-11 | High-density packaging hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189540U (en) |
-
1982
- 1982-06-11 JP JP8615682U patent/JPS58189540U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58189540U (en) | High-density packaging hybrid integrated circuit | |
| JPS6115746U (en) | Packages for integrated circuits | |
| JPS5844871U (en) | wiring board | |
| JPS6049662U (en) | Chip component mounting structure | |
| JPS59158336U (en) | semiconductor equipment | |
| JPS5872871U (en) | electronic components | |
| JPS6078158U (en) | hybrid integrated circuit board | |
| JPS594642U (en) | Hybrid integrated circuit board encapsulation | |
| JPS6061740U (en) | Hybrid integrated circuit device | |
| JPS6054340U (en) | integrated circuit | |
| JPS60146351U (en) | Hybrid integrated circuit device | |
| JPS59115663U (en) | Flat integrated circuit package | |
| JPS60179065U (en) | printed circuit board | |
| JPS58184860U (en) | circuit board | |
| JPS59111052U (en) | Hybrid integrated circuit device | |
| JPS5983044U (en) | hybrid integrated circuit | |
| JPS58187151U (en) | High density package | |
| JPS59176152U (en) | Hybrid integrated circuit structure | |
| JPS6068659U (en) | hybrid integrated circuit | |
| JPS5965571U (en) | Parts mounting device | |
| JPS58191651U (en) | integrated circuit | |
| JPS60119757U (en) | integrated circuit device | |
| JPS59185851U (en) | Semiconductor integrated circuit device | |
| JPS5918466U (en) | printed circuit board | |
| JPS5952662U (en) | printed wiring board |