JPS59158336U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS59158336U JPS59158336U JP5371683U JP5371683U JPS59158336U JP S59158336 U JPS59158336 U JP S59158336U JP 5371683 U JP5371683 U JP 5371683U JP 5371683 U JP5371683 U JP 5371683U JP S59158336 U JPS59158336 U JP S59158336U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor device
- external lead
- bonded
- bonded portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは従来の半導体装置の実装時の斜視図、第１図
すは第１図ａの１−１′線における断面図であり、第２
図は本考案実施例による半導体装置を実装した時の斜視
図、第２図すは第２図ａのｍ−ｍ′線における断面図で
ある。
なお図において、１．１１・・・・・・外部リード、２
゜１２・・・・・・基板の金属配線、３，１３・・曲ろ
う材、４．１４・・・・・・ＩＣパッケージ、５．１５
・・・・・・基板１．１６・・・・・・貫通孔、を各々
示す。FIG. 1a is a perspective view of a conventional semiconductor device when it is mounted, and FIG. 1a is a sectional view taken along line 1-1' of FIG.
The figure is a perspective view of a mounted semiconductor device according to an embodiment of the present invention, and a sectional view taken along the line m-m' in FIG. 2a. In the figure, 1.11...external lead, 2
゜12...Metal wiring on board, 3,13...Bending brazing material, 4.14...IC package, 5.15
. . . Substrate 1.16 . . . Through holes are shown respectively.
Claims (1)
の実装時に、ろう材により接着される該外部リードと回
斑基板またはＩＣパッケージとの接着部に於いて、該外
部リードの接着部に貫通孔を設けたことを特徴とする半
導体装置。In a semiconductor device having an external lead, a through hole is provided in the bonded portion of the external lead at the bonded portion of the external lead and the blemish board or IC package that is bonded with a brazing material when the semiconductor device is mounted. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5371683U JPS59158336U (en) | 1983-04-11 | 1983-04-11 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5371683U JPS59158336U (en) | 1983-04-11 | 1983-04-11 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59158336U true JPS59158336U (en) | 1984-10-24 |
Family
ID=30184060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5371683U Pending JPS59158336U (en) | 1983-04-11 | 1983-04-11 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158336U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02152243A (en) * | 1988-12-02 | 1990-06-12 | Rohm Co Ltd | Semiconductor device |
-
1983
- 1983-04-11 JP JP5371683U patent/JPS59158336U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02152243A (en) * | 1988-12-02 | 1990-06-12 | Rohm Co Ltd | Semiconductor device |
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