JPS5846454U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5846454U
JPS5846454U JP14205281U JP14205281U JPS5846454U JP S5846454 U JPS5846454 U JP S5846454U JP 14205281 U JP14205281 U JP 14205281U JP 14205281 U JP14205281 U JP 14205281U JP S5846454 U JPS5846454 U JP S5846454U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor
recorded
electronic filing
before electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14205281U
Other languages
Japanese (ja)
Inventor
「よし」成　昭平
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP14205281U priority Critical patent/JPS5846454U/en
Publication of JPS5846454U publication Critical patent/JPS5846454U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　　ｂはそれぞれ一般的なフラットパッケー
ジ型ＩＣの平面図および側面図、第２図は第１図のＩＣ
を実装した後の側面図、第３図ａ、　ｂはそれぞれ本考
案の一実施例を示す裏面図および側面図である。 １・・・パッケージ容器、２・・・外部リード、３・・
・プリント板、４・・・半田、５・・・接着材。Figures 1a and b are a plan view and a side view of a typical flat package IC, respectively, and Figure 2 is the IC of Figure 1.
3a and 3b are a back view and a side view, respectively, showing an embodiment of the present invention. 1...Package container, 2...External lead, 3...
・Printed board, 4...Solder, 5...Adhesive material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体容器に接着剤が塗布されてなる半導体装置。A semiconductor device made of a semiconductor container coated with adhesive.
JP14205281U 1981-09-25 1981-09-25 semiconductor equipment Pending JPS5846454U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14205281U JPS5846454U (en) 1981-09-25 1981-09-25 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14205281U JPS5846454U (en) 1981-09-25 1981-09-25 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5846454U true JPS5846454U (en) 1983-03-29

Family

ID=29935100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14205281U Pending JPS5846454U (en) 1981-09-25 1981-09-25 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5846454U (en)

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