JPS58499U - Semiconductor device carrier - Google Patents
Semiconductor device carrierInfo
- Publication number
- JPS58499U JPS58499U JP6497682U JP6497682U JPS58499U JP S58499 U JPS58499 U JP S58499U JP 6497682 U JP6497682 U JP 6497682U JP 6497682 U JP6497682 U JP 6497682U JP S58499 U JPS58499 U JP S58499U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- device carrier
- holes
- main body
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係るフィルム状キャリアの斜視図、第
２図は第１図のキャリアにＩＣパッケージを取付けた状
態を示す拡大図、第３図は第２図の横断面側面図、第４
図はＩＣパッケージの検査工程を示す図、第５図はＩＣ
パッケージの実装工程を示す図。 □
１・・・フィルム、２・・・位置決孔、３・・・受容孔
、４・・・開口、５・・・接着層、１０・・・キャリア
、２ｏ・・・ＩＣパッケージ、２１・・・パッケージ本
体、２３・・・外部リード。Fig. 1 is a perspective view of a film carrier according to the present invention, Fig. 2 is an enlarged view showing an IC package attached to the carrier of Fig. 1, and Fig. 3 is a cross-sectional side view of Fig. 2; 4
The figure shows the IC package inspection process, and Figure 5 shows the IC package inspection process.
FIG. 3 is a diagram showing a package mounting process. □ 1... Film, 2... Positioning hole, 3... Receiving hole, 4... Opening, 5... Adhesive layer, 10... Carrier, 2o... IC package, 21... ...Package body, 23...External lead.
Claims (1)
外形と略同−の形状を有し該本体部を受容する複数の受
容溝ないしは孔とこれら各受容溝ないしは孔の周囲に半
導体用パッケージの外部リードに対応する開口を具備す
ることを特徴とする半導体装置のキャリア。A plurality of receiving grooves or holes having a shape approximately the same as the external shape of the main body of the semiconductor package on a single-sided adhesive strip film and receiving the main body, and external leads of the semiconductor package are arranged around each of the receiving grooves or holes. A carrier for a semiconductor device, characterized in that it is provided with an opening corresponding to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6497682U JPS58499U (en) | 1982-05-06 | 1982-05-06 | Semiconductor device carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6497682U JPS58499U (en) | 1982-05-06 | 1982-05-06 | Semiconductor device carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58499U true JPS58499U (en) | 1983-01-05 |
Family
ID=29861018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6497682U Pending JPS58499U (en) | 1982-05-06 | 1982-05-06 | Semiconductor device carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58499U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6092700A (en) * | 1983-10-26 | 1985-05-24 | 株式会社東芝 | Flat package integrated circuit element containing device |
-
1982
- 1982-05-06 JP JP6497682U patent/JPS58499U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6092700A (en) * | 1983-10-26 | 1985-05-24 | 株式会社東芝 | Flat package integrated circuit element containing device |
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