JPS5881960U - Film carrier for semiconductor devices - Google Patents
Film carrier for semiconductor devicesInfo
- Publication number
- JPS5881960U JPS5881960U JP1981176496U JP17649681U JPS5881960U JP S5881960 U JPS5881960 U JP S5881960U JP 1981176496 U JP1981176496 U JP 1981176496U JP 17649681 U JP17649681 U JP 17649681U JP S5881960 U JPS5881960 U JP S5881960U
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- semiconductor devices
- carrier
- film
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はポリイミドテープに銅箔を接着した状態を示し
た平面図である。第２図はフィルムキャリアの平面図で
ある。第３図は従来のフィルムキャリアの断面図である
。第４図は本考案の実施例によるフィルムキャリア断面
図である。第５図はリードのポ・リイミド枠部に接着さ
れる部分にメッキを施し、位置合せ用のマークを設けた
銅箔の平面図である。第６図はポリイミドテープに第５
図の銅箔を接着し、フォトレジストにリードパターンを
露出して現像した状態の裏面からみた図である。
尚、図に都いて、１・・・・・・ポリイミドテープ、２
・・・・・・銅箔（リード）、３・・・・・・ポリイミ
ド枠、４・・・・・・接着剤、５・・・・・・リードメ
ッキ部、６・・・・・・位置合せ用マーク、７・・・・
・・テープ開口部である。FIG. 1 is a plan view showing a state in which copper foil is adhered to a polyimide tape. FIG. 2 is a plan view of the film carrier. FIG. 3 is a sectional view of a conventional film carrier. FIG. 4 is a sectional view of a film carrier according to an embodiment of the present invention. FIG. 5 is a plan view of a copper foil in which the portion to be bonded to the polyimide frame of the lead is plated and marks for alignment are provided. Figure 6 shows the polyimide tape.
This is a view from the back of a state in which the copper foil shown in the figure is adhered and a lead pattern is exposed and developed on a photoresist. In addition, in the figure, 1... polyimide tape, 2
......Copper foil (lead), 3...Polyimide frame, 4...Adhesive, 5...Lead plating part, 6... Alignment mark, 7...
...This is the tape opening.
Claims (1)
ィルムとの接着面側にメッキが施されていることを特徴
とする半導体装置用フィルムキャリア。1. A film carrier for a semiconductor device, characterized in that a lead provided on the carrier film is plated on the adhesive side with the carrier film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981176496U JPS5881960U (en) | 1981-11-27 | 1981-11-27 | Film carrier for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981176496U JPS5881960U (en) | 1981-11-27 | 1981-11-27 | Film carrier for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5881960U true JPS5881960U (en) | 1983-06-03 |
Family
ID=29969534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981176496U Pending JPS5881960U (en) | 1981-11-27 | 1981-11-27 | Film carrier for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5881960U (en) |
-
1981
- 1981-11-27 JP JP1981176496U patent/JPS5881960U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5881960U (en) | Film carrier for semiconductor devices | |
| JPS58105167U (en) | Flexible circuit board with aluminum pipe | |
| JPS58499U (en) | Semiconductor device carrier | |
| JPS5999467U (en) | Recognition pattern for positioning flexible printed circuits | |
| JPS6052656U (en) | circuit board | |
| JPS58175668U (en) | printed wiring board | |
| JPS6232550U (en) | ||
| JPS6054331U (en) | Mounting board for semiconductor devices | |
| JPS5944073U (en) | Adhesive structure of flexible printed board | |
| JPS60179065U (en) | printed circuit board | |
| JPS5972745U (en) | Thick film hybrid integrated circuit | |
| JPS5939940U (en) | Hybrid integrated circuit device | |
| JPS5829868U (en) | integrated circuit mounting structure | |
| JPS6134750U (en) | semiconductor equipment | |
| JPS60158774U (en) | Chip parts mounting device | |
| JPS5952662U (en) | printed wiring board | |
| JPS5853160U (en) | Amorphous semiconductor device | |
| JPS5897848U (en) | Outer lead bonding structure | |
| JPS5963456U (en) | printed wiring board | |
| JPS59188880U (en) | Chip parts taping type storage device | |
| JPS6081674U (en) | Ceramic hybrid integrated circuit device | |
| JPS59117143U (en) | semiconductor equipment | |
| JPS5970373U (en) | Connection structure of flexible printed board | |
| JPS5991754U (en) | Transfer sheet for thick film IC circuit formation | |
| JPS58105151U (en) | Film carrier flexible tape |