JPS6375083U - - Google Patents
Info
- Publication number
- JPS6375083U JPS6375083U JP16995086U JP16995086U JPS6375083U JP S6375083 U JPS6375083 U JP S6375083U JP 16995086 U JP16995086 U JP 16995086U JP 16995086 U JP16995086 U JP 16995086U JP S6375083 U JPS6375083 U JP S6375083U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- wiring board
- lead wire
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005491 wire drawing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図および第２図は本考案の１実施例に係り
、第１図はリード線の引き出し状態を示す要部斜
視図、第２図はプリント配線板の要部斜視図、第
３図は従来例を示す要部断面図、第４図は他の従
来例を示す要部斜視図である。
１……プリント配線板、３……リード線、４…
…他の基板、５……チツプ部品、５ａ……導電部
、６，７……配線パターン、８……半田、９……
溝穴。
1 and 2 relate to one embodiment of the present invention, in which FIG. 1 is a perspective view of the main part showing the lead wire drawn out state, FIG. 2 is a perspective view of the main part of the printed wiring board, and FIG. 3 is the main part perspective view of the printed wiring board. FIG. 4 is a sectional view of a main part showing a conventional example, and FIG. 4 is a perspective view of a main part showing another conventional example. 1...Printed wiring board, 3...Lead wire, 4...
...Other board, 5... Chip component, 5a... Conductive part, 6, 7... Wiring pattern, 8... Solder, 9...
Groove hole.
Claims (1)
が密着配置される構成において、プリント配線板
の表側の配線パターンにその一端を接続・固着さ
れ、且つプリント配線板の板厚より小なる外径を
もつ絶縁被覆付きのリード線の一部を、プリント
配線板に穿設した溝穴内に完全に挿入すると共に
、該溝穴内へのリード線の挿入部分上に跨るよう
載置されたチツプ部品の両端の導電部を、プリン
ト配線板の配線パターンに接続・固着してなるこ
とを特徴とするプリント配線板におけるリード線
引き出し構造。 In a configuration in which another board such as a metal plate is placed in close contact with the back side of the printed wiring board, one end of the board is connected and fixed to the wiring pattern on the front side of the printed wiring board, and the outside is smaller than the board thickness of the printed wiring board. A chip component in which a part of a lead wire with an insulating coating having a diameter is completely inserted into a slot drilled in a printed wiring board, and is placed so as to straddle the part of the lead wire inserted into the slot. A lead wire drawing structure for a printed wiring board, characterized in that conductive parts at both ends of the board are connected and fixed to the wiring pattern of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16995086U JPS6375083U (en) | 1986-11-05 | 1986-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16995086U JPS6375083U (en) | 1986-11-05 | 1986-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375083U true JPS6375083U (en) | 1988-05-19 |
Family
ID=31104224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16995086U Pending JPS6375083U (en) | 1986-11-05 | 1986-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375083U (en) |
-
1986
- 1986-11-05 JP JP16995086U patent/JPS6375083U/ja active Pending
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