JPS58103159U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS58103159U JPS58103159U JP19814081U JP19814081U JPS58103159U JP S58103159 U JPS58103159 U JP S58103159U JP 19814081 U JP19814081 U JP 19814081U JP 19814081 U JP19814081 U JP 19814081U JP S58103159 U JPS58103159 U JP S58103159U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead wire
- board
- printed board
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示す斜視図であり、第2図はその縦断
面図であり、第3図はその横断面図である。第4図は本
考案の一実施例を示す斜視図であ一す、第5図はその縦
断面図であり、第6図はランド部を示す平面図であり、
第7図は実装部品の実装状態を示す斜視図である。
11・・・絶縁性基板、13・・・実装部品、14・・
・スルーホール、15・・・リード線、16・・・ラン
ド部。FIG. 1 is a perspective view showing a conventional example, FIG. 2 is a longitudinal cross-sectional view thereof, and FIG. 3 is a cross-sectional view thereof. FIG. 4 is a perspective view showing an embodiment of the present invention, FIG. 5 is a longitudinal sectional view thereof, and FIG. 6 is a plan view showing a land portion.
FIG. 7 is a perspective view showing the mounted state of the mounted components. 11... Insulating board, 13... Mounted components, 14...
-Through hole, 15...Lead wire, 16...Land part.
Claims (1)
記基板上に実装される実装部品の上記スルーホールに挿
通されたクリンチカットされるリード線の折曲げ方向に
のみ上記スルーホールの穴径と同幅若しくは上記穴径よ
り小さい幅のランド部を上記基板上に設け、このランド
部にリード線を接続して実装部品を実装するよ□うにし
てなるプリント基板。The hole diameter of the through hole is determined only in the bending direction of the lead wire that is inserted into the through hole of the mounted component to be mounted on the board by inserting the lead wire into the through hole drilled in the board and is to be clinch cut. A printed circuit board in which a land portion having a width equal to or smaller than the hole diameter is provided on the substrate, and a lead wire is connected to the land portion to mount a mounted component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19814081U JPS58103159U (en) | 1981-12-29 | 1981-12-29 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19814081U JPS58103159U (en) | 1981-12-29 | 1981-12-29 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58103159U true JPS58103159U (en) | 1983-07-13 |
Family
ID=30111335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19814081U Pending JPS58103159U (en) | 1981-12-29 | 1981-12-29 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58103159U (en) |
-
1981
- 1981-12-29 JP JP19814081U patent/JPS58103159U/en active Pending
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