JPH07202089A - Substrate holder - Google Patents
Substrate holderInfo
- Publication number
- JPH07202089A JPH07202089A JP33538193A JP33538193A JPH07202089A JP H07202089 A JPH07202089 A JP H07202089A JP 33538193 A JP33538193 A JP 33538193A JP 33538193 A JP33538193 A JP 33538193A JP H07202089 A JPH07202089 A JP H07202089A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- circuit board
- printed
- mounting frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、放熱板を必要とする
電気回路部品などを固着したプリント基板の取付保持装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting and holding a printed circuit board to which an electric circuit component requiring a heat sink is fixed.
【０００２】[0002]
【従来の技術】図９は例えば実開昭５６−３２４９５号
公報に示された第１の従来例の基板保持装置を示す斜視
図、図１０は図９の線Ｘ−Ｘの断面図、図１１は図９の
スリットを示す拡大図である。図において、１は集積回
路、２は集積回路１から発生する熱を放熱する放熱板、
３は集積回路１を放熱板２に固着するネジ、４は集積回
路１の端子１ａおよびその他の電気回路部品１Ａを固着
して回路構成したプリント基板、５は放熱板２に設けた
スリットで、プリント基板４の端部４ａの両端側が挿入
できるようにプリント基板４の厚みより若干幅が広くな
っていると共に放熱板２の両端側に２個設けられてい
る。2. Description of the Related Art FIG. 9 is a perspective view showing a substrate holding device of a first conventional example disclosed in, for example, Japanese Utility Model Laid-Open No. 56-32495, and FIG. 10 is a sectional view taken along line XX in FIG. 11 is an enlarged view showing the slit of FIG. In the figure, 1 is an integrated circuit, 2 is a radiator plate for radiating heat generated from the integrated circuit 1,
3 is a screw for fixing the integrated circuit 1 to the heat sink 2, 4 is a printed circuit board on which the terminals 1a of the integrated circuit 1 and other electric circuit components 1A are fixed, and 5 is a slit provided in the heat sink 2. The width is slightly larger than the thickness of the printed board 4 so that both ends of the end 4a of the printed board 4 can be inserted, and two heat sinks 2 are provided on both ends.
【０００３】次に作用について説明する。プリント基板
４の端部４ａをスリット５に差し込み、集積回路１を放
熱板２にネジ３により固定する。この時、プリント基板
４は端部４ａの両端側をスリット５により支持されると
共に集積回路１の端子１ａにより中央部を押えられて放
熱板２に固定され、温度上昇によるプリント基板４のソ
リや伸びを吸収できるようになっている。Next, the operation will be described. The end portion 4a of the printed board 4 is inserted into the slit 5 and the integrated circuit 1 is fixed to the heat sink 2 with the screw 3. At this time, the printed circuit board 4 is supported by the slits 5 on both ends of the end portion 4a and is fixed to the heat radiating plate 2 by pressing the central portion by the terminals 1a of the integrated circuit 1 to prevent warpage of the printed circuit board 4 due to temperature rise. It can absorb the growth.
【０００４】図１２は第２の従来例の基板保持装置を示
す斜視図、図１３は図１２の線XIII−XIIIの断面図であ
り、前記第１の従来例と同一部分には同一符号を付して
説明を省略する。図において、６は集積回路１から発生
する熱を放熱する放熱板で、基板取付用フレーム６ａを
兼ねている。７はプリント基板４の端部４ａの両端側を
放熱板６に取り付けるネジである。FIG. 12 is a perspective view showing a substrate holding device of a second conventional example, and FIG. 13 is a sectional view taken along the line XIII-XIII of FIG. 12, and the same parts as those of the first conventional example are designated by the same reference numerals. The description is omitted. In the figure, reference numeral 6 denotes a heat radiating plate for radiating heat generated from the integrated circuit 1, which also serves as a board mounting frame 6a. Reference numeral 7 is a screw for attaching both ends of the end portion 4a of the printed board 4 to the heat dissipation plate 6.
【０００５】放熱板６に集積回路１をネジ３で固定し、
プリント基板４もネジ７で放熱板６に取り付ける。こう
することにより放熱作用と基板保持機能を果している。The integrated circuit 1 is fixed to the heat sink 6 with screws 3.
The printed circuit board 4 is also attached to the heat sink 6 with screws 7. By doing so, the heat dissipation function and the substrate holding function are achieved.
【０００６】[0006]
【発明が解決しようとする課題】従来の基板保持装置は
以上のように構成されているので、第１の従来例の装置
では２個のスリット５によりプリント基板４の端部４ａ
の両端部のみを部分的にはさみ込むことでしかプリント
基板４を支持していないため、また第２の従来例の装置
では両端部に位置するネジ７によりプリント基板４の端
部４ａの両端部のみを部分的に押え込むことでしかプリ
ント基板４を支持していないため、プリント基板４の端
部４ａの中央部の経時によるソリまたは半田付け熱処理
後における中央部のソリを強制的に押えることができ
ず、プリント基板４の端部４ａが変形したり、また中央
部の振動により集積回路１の端子１ａが折れたりするな
どの問題点があった。Since the conventional substrate holding device is constructed as described above, the end 4a of the printed circuit board 4 is formed by the two slits 5 in the first conventional device.
The printed circuit board 4 is supported only by partially sandwiching both end portions of the printed circuit board 4. Therefore, in the device of the second conventional example, both ends of the end portion 4a of the printed circuit board 4 are fixed by the screws 7 located at both end portions. Since the printed circuit board 4 is supported only by partially pressing only the part thereof, it is necessary to forcibly press down the warp of the center part of the end part 4a of the printed circuit board 4 over time or the center part after the soldering heat treatment. However, there is a problem that the end portion 4a of the printed circuit board 4 is deformed and the terminal 1a of the integrated circuit 1 is broken due to the vibration of the central portion.
【０００７】この発明は上記のような問題点を解消する
ためになされたもので、プリント基板の端部中央部のソ
リを強制的に押えてプリント基板の端部の変形を押える
と共にこの中央部の振動による集積回路などのＩＣの端
子の損傷を防止することのできる基板保持装置を得るこ
とを目的とする。The present invention has been made in order to solve the above-mentioned problems, and forcibly presses the warp at the central portion of the end portion of the printed circuit board to suppress the deformation of the end portion of the printed circuit board and the central portion. An object of the present invention is to obtain a substrate holding device capable of preventing damage to the terminals of ICs such as integrated circuits due to the vibration of.
【０００８】[0008]
【課題を解決するための手段】この発明に係る基板保持
装置は、基板取付用フレームを兼ねる放熱板と、この放
熱板に設けられてプリント基板の端部の中央部を含むほ
ぼ全てが挿入されるＵ溝と、このＵ溝からはみ出た前記
基板取付用フレームにあるプリント基板の固定手段とを
備えたものである。SUMMARY OF THE INVENTION A substrate holding device according to the present invention includes a heat radiating plate which also serves as a board mounting frame, and a heat radiating plate which is provided on the heat radiating plate and in which almost the entire end portion including the central portion of the printed circuit board is inserted. And a fixing means for the printed circuit board in the board mounting frame protruding from the U groove.
【０００９】[0009]
【作用】この発明における基板保持装置は、放熱板にＵ
溝と固定手段とを設けることにより、プリント基板の端
部中央部の経時によるソリまたは半田付け熱処理後にお
ける中央部のソリを強制的に押えてプリント基板の端部
の変形を押えると共にこの中央部の振動による集積回路
の端子の折れを防ぐことができる。In the substrate holding device according to the present invention, the heat dissipation plate has a U
By providing the groove and the fixing means, the warp of the center part of the end of the printed board over time or the warp of the center part after the soldering heat treatment is forcibly pressed to suppress the deformation of the end part of the printed board and the center part. It is possible to prevent the terminals of the integrated circuit from being broken due to the vibration of.
【００１０】[0010]
実施例１．以下、この発明の一実施例を図１，図２につ
いて説明する。図１は斜視図、図２は図１の線II−IIの
断面図であり、前記従来例と同一または相当部分には同
一符号を付して説明を省略する。図において、８は放熱
板で、下部に基板取付用フレーム８Ａが形成されてい
る。９は放熱板８の下部に形成したＵ溝で、プリント基
板４の端部４ａの中央部を含むほぼ全てが挿入できる長
さを有してる。Example 1. An embodiment of the present invention will be described below with reference to FIGS. 1 is a perspective view, and FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1. The same or corresponding parts as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted. In the figure, reference numeral 8 is a heat radiating plate, and a board mounting frame 8A is formed in the lower part thereof. Reference numeral 9 denotes a U groove formed in the lower portion of the heat dissipation plate 8 and has a length such that almost all of the printed circuit board 4 including the central portion of the end portion 4a can be inserted.
【００１１】このように構成された基板保持装置は、Ｕ
溝９にプリント基板４の端部４ａの中央部を含むほぼ全
てを差し込みさらにネジ７によりプリント基板４を基板
取付用フレーム８Ａに固定することにより、プリント基
板４の端部４ａの全幅にわたり押えられるので、プリン
ト基板４の端部４ａの中央部の経時によるソリまたは半
田付け熱処理後における中央部のソリを強制的に押え
て、プリント基板４の端部４ａの変形を押えると共にこ
の中央部の振動による集積回路１の端子１ａの損傷を防
ぐことができる。The substrate holding device having the above structure is U
By inserting substantially all of the end portion 4a of the printed board 4 into the groove 9 and fixing the printed board 4 to the board mounting frame 8A with the screw 7, the printed board 4 is pressed over the entire width of the end portion 4a. Therefore, the central portion of the end portion 4a of the printed circuit board 4 is forcibly pressed against the warp of the central portion after the heat treatment for soldering or the deformation of the end portion 4a of the printed circuit board 4 and the vibration of this central portion is suppressed. It is possible to prevent the terminal 1a of the integrated circuit 1 from being damaged.
【００１２】実施例２．上記実施例ではプリント基板４
の固定手段としてネジ７を示したが、図３，図４に示す
ように基板取付用フレーム８Ａに設けたダボ１０にプリ
ント基板４の孔１１を嵌めることによりプリント基板４
を基板自身の弾性を利用してパッチン止めにより固定し
ても、上記実施例と同様の効果が得られる。Example 2. In the above embodiment, the printed circuit board 4
Although the screw 7 is shown as a fixing means for the printed circuit board 4, as shown in FIGS. 3 and 4, the hole 11 of the printed circuit board 4 is fitted into the dowel 10 provided in the circuit board mounting frame 8A.
Even if the substrate is fixed by patching using the elasticity of the substrate itself, the same effect as in the above embodiment can be obtained.
【００１３】この固定手段であれば上記実施例より部品
点数を減らすことができ、さらにダボ１０との嵌合部の
プリント基板４の孔１１に基板の熱変形を見込んだクリ
アランスをとっておくことにより、プリント基板４が熱
により伸びてもプリント基板４は損傷しないという効果
が得られる。With this fixing means, the number of parts can be reduced as compared with the above-mentioned embodiment, and a clearance for the thermal deformation of the board is set in the hole 11 of the printed board 4 at the fitting portion with the dowel 10. Thereby, even if the printed circuit board 4 is expanded by heat, the printed circuit board 4 is not damaged.
【００１４】実施例３．また、プリント基板４の固定手
段として図５，図６に示すように板状の押えバネ１２と
しても上記実施例と同様の効果が得られる。この押えバ
ネ１２をネジ１３により基板取付用フレーム８Ａに固定
し、先端の突起１２ａをプリント基板４の孔１１に嵌合
する。Example 3. Further, as the fixing means of the printed circuit board 4, as shown in FIGS. 5 and 6, a plate-like pressing spring 12 can obtain the same effect as that of the above embodiment. The pressing spring 12 is fixed to the board mounting frame 8A with the screw 13, and the projection 12a at the tip is fitted into the hole 11 of the printed board 4.
【００１５】実施例４．上記実施例３では押えバネ１２
をネジ１３で固定するものを示したが、図７，図８に示
すように押えバネ１２の一端１２ｂを折り曲げて基板取
付用フレーム８Ａの溝１４に圧入して固定することによ
っても、上記実施例３と同様の効果が得られる上、この
実施例ではネジ１３が不要となる。Example 4. In the third embodiment, the presser spring 12
Although the screw 13 is fixed by the screw 13, the above-described embodiment can also be performed by bending one end 12b of the presser spring 12 and press-fitting it into the groove 14 of the board mounting frame 8A as shown in FIGS. In addition to the same effect as in Example 3, the screw 13 is unnecessary in this embodiment.
【００１６】[0016]
【発明の効果】以上のように、この発明によれば放熱板
にＵ溝とプリント基板の固定手段とを設けることによ
り、プリント基板の端部中央部のソリを強制的に押えて
プリント基板の端部の変形を押えると共にこの中央部の
振動による集積回路などのＩＣの端子の損傷を防止でき
るという効果が得られる。As described above, according to the present invention, the U-groove and the fixing means for the printed circuit board are provided in the heat dissipation plate to forcibly press the warp at the center of the end portion of the printed circuit board to prevent the printed circuit board from being damaged. The effect of suppressing deformation of the end portions and preventing damage to the terminals of ICs such as integrated circuits due to the vibration of the central portion can be obtained.
【図１】この発明の実施例１を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention.
【図２】図１の線II−IIの断面図である。2 is a cross-sectional view taken along the line II-II in FIG.
【図３】この発明の実施例２を示す斜視図である。FIG. 3 is a perspective view showing a second embodiment of the present invention.
【図４】図３の線IV−IVの断面図である。4 is a cross-sectional view taken along the line IV-IV in FIG.
【図５】この発明の実施例３を示す斜視図である。FIG. 5 is a perspective view showing a third embodiment of the present invention.
【図６】図５の要部拡大図である。FIG. 6 is an enlarged view of a main part of FIG.
【図７】この発明の実施例４を示す斜視図である。FIG. 7 is a perspective view showing a fourth embodiment of the present invention.
【図８】図７の線VIII−VIIIの断面図である。8 is a cross-sectional view taken along the line VIII-VIII of FIG.
【図９】第１の従来例を示す斜視図である。FIG. 9 is a perspective view showing a first conventional example.
【図１０】図９の線Ｘ−Ｘの断面図である。10 is a cross-sectional view taken along the line XX of FIG.
【図１１】図９の要部拡大図である。11 is an enlarged view of a main part of FIG.
【図１２】第２の従来例を示す斜視図である。FIG. 12 is a perspective view showing a second conventional example.
【図１３】図１２の線XIII−XIIIの断面図である。13 is a cross-sectional view taken along the line XIII-XIII in FIG.
１ 集積回路 １ａ 集積回路の端子 ４ プリント基板 ４ａ プリント基板の端部 ７ ネジ ８ 放熱板 ８Ａ 基板取付用フレーム ９ Ｕ溝 １０ ダボ １１ 孔 １２ 押えバネ 1 Integrated Circuit 1a Integrated Circuit Terminal 4 Printed Circuit Board 4a Printed Circuit Board End 7 Screw 8 Heat Sink 8A Board Mounting Frame 9 U Groove 10 Dowel 11 Hole 12 Presser Spring
Claims (4)
この放熱板に設けられてプリント基板の端部の中央部を
含むほぼ全てが挿入されるＵ溝と、このＵ溝の部分から
はみ出た前記基板取付用フレームに設けられる前記プリ
ント基板の固定手段とを備えたことを特徴とする基板保
持装置。1. A heat sink that also serves as a board mounting frame,
A U-groove provided on the heat dissipation plate and into which almost the entire end of the printed board including the central portion is inserted, and a fixing means for the printed board provided on the board mounting frame protruding from the U groove. A substrate holding device comprising:
板から基板取付用フレームに螺合されるネジである請求
項１の基板保持装置。2. The board holding device according to claim 1, wherein the fixing means for the printed board is a screw screwed from the printed board to the board mounting frame.
フレームに設けたダボと、プリント基板に設けられて前
記ダボが嵌まる孔とで構成される請求項１の基板保持装
置。3. The substrate holding device according to claim 1, wherein the printed circuit board fixing means includes a dowel provided on the board mounting frame and a hole provided on the printed circuit board and into which the dowel is fitted.
フレームに設けた押えバネと、プリント基板に設けられ
て前記押えバネが係合する孔とで構成される請求項１の
基板保持装置。4. The substrate holding device according to claim 1, wherein the fixing means for the printed circuit board comprises a holding spring provided on the board mounting frame and a hole provided on the printed board and engaged with the holding spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33538193A JP3094765B2 (en) | 1993-12-28 | 1993-12-28 | Substrate holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33538193A JP3094765B2 (en) | 1993-12-28 | 1993-12-28 | Substrate holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07202089A true JPH07202089A (en) | 1995-08-04 |
| JP3094765B2 JP3094765B2 (en) | 2000-10-03 |
Family
ID=18287911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33538193A Expired - Fee Related JP3094765B2 (en) | 1993-12-28 | 1993-12-28 | Substrate holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3094765B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190759A (en) * | 2019-05-31 | 2019-08-30 | 宁波久源电子有限公司 | A kind of small size DC voltage-stablized source apparatus |
-
1993
- 1993-12-28 JP JP33538193A patent/JP3094765B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190759A (en) * | 2019-05-31 | 2019-08-30 | 宁波久源电子有限公司 | A kind of small size DC voltage-stablized source apparatus |
| CN110190759B (en) * | 2019-05-31 | 2020-12-29 | 宁波久源电子有限公司 | Small-size direct-current stabilized voltage supply device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3094765B2 (en) | 2000-10-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |