JPH08330698A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH08330698A JPH08330698A JP13450395A JP13450395A JPH08330698A JP H08330698 A JPH08330698 A JP H08330698A JP 13450395 A JP13450395 A JP 13450395A JP 13450395 A JP13450395 A JP 13450395A JP H08330698 A JPH08330698 A JP H08330698A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film substrate
- attaching
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は混成集積回路装置に関
し、更に詳しく言えば、放熱性の良好な金属板を厚膜基
板として用いた混成集積回路装置の改善に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to improvement of a hybrid integrated circuit device using a metal plate having good heat dissipation as a thick film substrate.
【０００２】[0002]
【従来の技術】以下で、従来のハイブリッドＩＣについ
て図面を参照しながら説明する。なお図６は図５のＸ−
Ｘ線断面図である。従来のハイブリッドＩＣは、図４に
示すように、アルミニウムなどの金属板上に不図示の絶
縁樹脂が形成され、所定の銅箔パターンがその上に形成
されて成る厚膜基板（１）上に半導体素子や抵抗、コン
デンサなどの所定の素子（３）が搭載され、かつ端部に
は外部機器との電気的接続をするためのリード端子
（４）が形成されて成る。また厚膜基板（１）の両側に
はビス孔（２Ａ）が設けられた取付部（２）が形成され
ている。2. Description of the Related Art A conventional hybrid IC will be described below with reference to the drawings. Note that FIG. 6 shows X- in FIG.
It is an X-ray sectional view. As shown in FIG. 4, a conventional hybrid IC is formed on a thick film substrate (1) in which an insulating resin (not shown) is formed on a metal plate such as aluminum and a predetermined copper foil pattern is formed thereon. A predetermined element (3) such as a semiconductor element, a resistor, or a capacitor is mounted, and a lead terminal (4) for electrically connecting to an external device is formed at an end portion. Further, mounting portions (2) provided with screw holes (2A) are formed on both sides of the thick film substrate (1).
【０００３】上記のハイブリッドＩＣをプリント基板
（ＰＳ）に取付ける時には、図５に示すように当該ハイ
ブリッドＩＣの放熱をする放熱板（５）をプリント基板
（ＰＳ）にビス（Ｂ２）で取付けて固定し、図６に示す
ように上記の取付部（２）のビス孔（２Ａ）に取付用の
ビス（Ｂ１）を通して放熱板（５）に厚膜基板（１）を
取り付けて固定し、リード端子（４）をプリント基板
（ＰＳ）の所定の端子に半田付けすることにより取付け
ていた。When the hybrid IC is mounted on the printed circuit board (PS), a heat radiating plate (5) for radiating the hybrid IC is mounted and fixed to the printed circuit board (PS) with screws (B2) as shown in FIG. Then, as shown in FIG. 6, the thick film substrate (1) is attached and fixed to the heat sink (5) through the screw (B1) for attachment through the screw hole (2A) of the attachment portion (2), and the lead terminal is fixed. It was attached by soldering (4) to a predetermined terminal of the printed circuit board (PS).
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来のハイブリッドＩＣでは、厚膜基板の材料として放熱
性の良好な金属板を用いており、実際には放熱板が不要
であるにも関らず、プリント基板（ＰＳ）に直接立てて
取り付けるための取付部が厚膜基板に形成されていない
ため、まず放熱板（５）に厚膜基板（１）を取付け、次
いで放熱板（５）をプリント基板（ＰＳ）に取り付ける
という合計２段階の工程を必要とし、放熱板を必要とす
る分だけ製造コストが上がり、工程数が増加するという
問題が生じていた。However, in the above-mentioned conventional hybrid IC, the metal plate having good heat dissipation is used as the material of the thick film substrate, and although the heat dissipation plate is not actually required, , The thick film substrate is not formed with a mounting portion for directly standing on the printed circuit board (PS), so that the thick film substrate (1) is first mounted on the heat sink (5), and then the heat sink (5) is printed. A total of two steps of attaching to the substrate (PS) are required, and there is a problem that the manufacturing cost is increased and the number of steps is increased due to the need for the heat sink.
【０００５】また用途によっては放熱板が不要の場合も
あり、その際は、厚膜ＩＣのみで自立させねばならなか
った。すると、厚膜ＩＣとＰＢＣとの半田接続部のみに
応力がかかり、耐振動に対してクラックなどの心配があ
った。In some cases, a heat sink is not necessary depending on the application, and in that case, the thick film IC alone must be used for self-sustaining. Then, stress is applied only to the solder connection portion between the thick film IC and the PBC, and there is a fear of cracking or the like with respect to vibration resistance.
【０００６】[0006]
【課題を解決するための手段】本発明は上記従来の欠点
に鑑み成されたもので、図１に示すように、所定の素子
が搭載され、放熱性の高い材質からなる厚膜基板を有
し、前記厚膜基板を直接プリント基板に取付ける取付部
が前記厚膜基板の一部に形成されてなることにより、プ
リント基板に当該混成集積回路装置を取り付ける際に、
放熱板を用いることなく取り付けることで製造コストの
低減や製造工程の省力化を図ることが可能になる混成集
積回路装置の提供を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and as shown in FIG. 1, has a thick film substrate on which a predetermined element is mounted and which is made of a material having high heat dissipation. When the thick integrated circuit device is mounted on the printed circuit board, the mounting portion for directly mounting the thick film circuit board on the printed circuit board is formed on a part of the thick film circuit board.
An object of the present invention is to provide a hybrid integrated circuit device that can be mounted without using a heat sink to reduce the manufacturing cost and save the manufacturing process.
【０００７】[0007]
【作 用】本発明に係る混成集積回路装置によれば、図
１に示すように、例えば厚膜基板の一部が折曲げられ、
折り曲げられた部分に取付用の孔が設けられることで形
成される取付部が厚膜基板の一部に形成されている。こ
のため、厚膜基板をプリント基板に取り付ける際に、例
えば厚膜基板の一部が折曲げられ、折り曲げられた部分
に取付用の孔が形成されてなる取付部を用いて、取付部
の取付用の孔にビスを通してプリント基板にネジ止めす
るなどして固定することにより、厚膜基板を直接プリン
ト基板に直立させて取り付けることができる。[Operation] According to the hybrid integrated circuit device of the present invention, as shown in FIG. 1, for example, a part of a thick film substrate is bent,
An attachment portion formed by providing an attachment hole in the bent portion is formed in a part of the thick film substrate. For this reason, when attaching the thick film substrate to the printed circuit board, for example, a part of the thick film substrate is bent, and a mounting portion formed by forming a mounting hole in the bent portion is used to mount the mounting portion. The thick film substrate can be attached directly upright to the printed circuit board by screwing the screws into the holes for fixing to the printed circuit board.
【０００８】厚膜ＩＣのみで自立させることができ、Ｐ
ＣＢとの半田接続部への応力が減り振動に対しての信頼
性が向上した。本発明では放熱性の良好な材質を厚膜基
板の材料として用いているので、放熱板は本来不要であ
るので、従来のように放熱板を用いずに当該混成集積回
路装置をプリント基板に直接取り付けることができ、第
一に放熱板を必要としないために放熱板の分だけ製造コ
ストが低減出来、第二に放熱板を取り付ける工程が不要
になるので製造工程数を減少させることが可能になる。A thick film IC alone can be used to make it stand alone.
The stress on the solder joint with CB is reduced and the reliability against vibration is improved. In the present invention, since a material having good heat dissipation is used as the material for the thick film substrate, the heat dissipation plate is essentially unnecessary, so that the hybrid integrated circuit device is directly attached to the printed circuit board without using the heat dissipation plate as in the past. Since it can be attached, firstly the heat radiation plate is not required, so the manufacturing cost can be reduced by the amount of the heat radiation plate, and secondly, the process of attaching the heat radiation plate is not necessary, so the number of manufacturing steps can be reduced. Become.
【０００９】[0009]
【実施例】以下で、本発明の実施例に係るハイブリッド
ＩＣについて図面を参照しながら説明する。本実施例に
係るハイブリッドＩＣは、図１に示すように、アルミニ
ウム板上に不図示の絶縁樹脂が形成され、その上に所定
の銅箔パターンが形成されて成る厚膜基板（１１）上
に、半導体素子や抵抗、コンデンサその他の所定の素子
（１３）が搭載され、端部には外部機器との電気的接続
をするためのリード端子（１４）が形成されて成る。厚
膜基板（１１）の端部には、厚膜基板（１１）の一部が
５mm程度の幅に折り曲げられてなり、プリント基板に当
該ハイブリッドＩＣを取り付けるための取付部（１２）
が形成されている。なお、この取付部（１２）には取り
付け用のビス孔（１２Ａ，１２Ｂ）が２個設けられてい
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid IC according to an embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the hybrid IC according to the present embodiment has a thick film substrate (11) formed by forming an insulating resin (not shown) on an aluminum plate and forming a predetermined copper foil pattern on the insulating resin. , Semiconductor elements, resistors, capacitors and other predetermined elements (13) are mounted, and lead terminals (14) for electrical connection with external devices are formed at the ends. At the end of the thick film substrate (11), a part of the thick film substrate (11) is bent to have a width of about 5 mm, and a mounting portion (12) for mounting the hybrid IC on a printed circuit board.
Are formed. The mounting portion (12) is provided with two screw holes (12A, 12B) for mounting.
【００１０】上記のハイブリッドＩＣをプリント基板
（ＰＳ）に取付ける時には、図２に示すように厚膜基板
（１１）の一部に形成された取付部（１２）のビス孔
（１２Ａ，１２Ｂ）に、取り付け用のビス（Ｂ１１，Ｂ
１２）を通してプリント基板（ＰＳ）上の所定の箇所に
ネジ止めして、厚膜基板（１１）をプリント基板（Ｐ
Ｓ）上に直立させて固定する。When the hybrid IC is mounted on the printed circuit board (PS), the screw holes (12A, 12B) of the mounting portion (12) formed on a part of the thick film substrate (11) are mounted as shown in FIG. , Mounting screws (B11, B
The thick film substrate (11) is screwed to a predetermined location on the printed circuit board (PS) through the printed circuit board (PS) 12).
S) Stand upright and fix.
【００１１】そして、リード端子（１４）を所定の箇所
に差し込んで半田付けして固定することにより、ハイブ
リッドＩＣをプリント基板（ＰＳ）上に取付ける。以上
説明したように本実施例に係る混成集積回路装置によれ
ば、厚膜基板（１１）の一部が５mm程度折曲げられ、折
り曲げられた部分にビス孔（１２Ａ，１２Ｂ）が設けら
れることで形成される取付部（１２）が厚膜基板の一部
に形成されているため、取付部（１２）のビス孔（１２
Ａ，１２Ｂ）に取付用のビス（Ｂ１１，Ｂ１２）を通し
てプリント基板（ＰＳ）にネジ止めすることにより、厚
膜基板（１１）をプリント基板（ＰＳ）に直立させて直
接取り付けることができる。Then, the lead terminal (14) is inserted into a predetermined place and fixed by soldering, whereby the hybrid IC is mounted on the printed circuit board (PS). As described above, according to the hybrid integrated circuit device of the present embodiment, a part of the thick film substrate (11) is bent by about 5 mm, and screw holes (12A, 12B) are provided in the bent part. Since the mounting portion (12) formed in (1) is formed on a part of the thick film substrate, the screw hole (12) of the mounting portion (12) is formed.
The thick film substrate (11) can be directly attached to the printed circuit board (PS) in an upright state by screwing the screws (B11, B12) for attachment to the printed circuit board (PS) to the printed circuit board (PS).
【００１２】厚膜基板（１１）は放熱性の良好なアルミ
ニウムからなり、放熱板は本来不要であって、従来のよ
うに放熱板を用いることなくプリント基板（ＰＳ）に取
り付けることができるので、第一に放熱板を必要としな
いために放熱板の分だけ製造コストの低減が可能にな
り、第二に放熱板を取り付ける工程が不要になるので製
造工程数を減少させることができ、生産性の向上が可能
になる。Since the thick film substrate (11) is made of aluminum having a good heat dissipation property, a heat dissipation plate is essentially unnecessary and can be attached to the printed circuit board (PS) without using a heat dissipation plate as in the conventional case. Firstly, because no heat sink is required, the manufacturing cost can be reduced by the amount of heat sink, and secondly, the process of attaching the heat sink is not required, so the number of manufacturing steps can be reduced and productivity is improved. Can be improved.
【００１３】なお、本実施例では取付部（１２）にビス
孔（１２Ａ，１２Ｂ）を２個設けているが、本発明はこ
れに限らず、例えば取付部（１２）を一部変形してプリ
ント基板（ＰＳ）に差し込んで固定させるような部材を
設けてもよく、あるいはビス孔とこのような機構を併用
しても同様の効果を奏する。また、本実施例ではリード
端子（１４）の引出された面と反対方向に厚膜基板（１
１）を折り曲げて取付部（１２）を形成しているが、本
発明はこれに限らず、リード端子（１４）の引き出され
た面の側に厚膜基板（１１）を折り曲げて取付部（１
２）を形成してもよい。In this embodiment, the mounting portion (12) is provided with two screw holes (12A, 12B), but the present invention is not limited to this. For example, the mounting portion (12) may be partially deformed. A member that is inserted and fixed in the printed circuit board (PS) may be provided, or the same effect can be obtained by using a screw hole and such a mechanism together. In addition, in this embodiment, the thick film substrate (1
Although the mounting portion (12) is formed by bending 1), the present invention is not limited to this, and the mounting portion (12) is formed by bending the thick film substrate (11) on the side where the lead terminal (14) is pulled out. 1
2) may be formed.
【００１４】さらに、本実施例では幅５mm程度に厚膜基
板を折り曲げて取付部（１２）を形成しているが、本発
明はこれに限らず、ハイブリッドＩＣの大きさによって
プリント基板（ＰＳ）に取り付けた際の安定性が悪いよ
うな場合には、厚膜基板の折り曲げる幅をそれ以上にと
ってもよい。また、本実施例では所定の素子（１３）が
露出しているが、本発明はこれに限らず、厚膜基板（１
１）にケースを取り付けてこれら所定の素子（１３）を
収納しても同様の効果を奏する。Further, in the present embodiment, the thick film substrate is bent to have a width of about 5 mm to form the mounting portion (12), but the present invention is not limited to this, and the printed circuit board (PS) is selected depending on the size of the hybrid IC. If the stability when attached to the thick film substrate is poor, the bending width of the thick film substrate may be set wider than that. Further, although the predetermined element (13) is exposed in the present embodiment, the present invention is not limited to this, and the thick film substrate (1
Even if a case is attached to 1) and these predetermined elements (13) are housed, the same effect can be obtained.
【００１５】[0015]
【発明の効果】以上説明したように本発明に係る混成集
積回路装置によれば、厚膜基板の一部が折曲げられ、折
り曲げられた部分に取付用の孔が設けられることで形成
される取付部が厚膜基板の一部に形成されているので、
厚膜基板を直接プリント基板に取り付けることができ、
従来のように放熱板を用いずに当該混成集積回路装置を
プリント基板に直接取り付けることができ、第一に放熱
板を必要としないために放熱板の分だけ製造コストが低
減出来、第二に放熱板を取り付ける工程が不要になるの
で製造工程数を減少させることが可能になる。As described above, the hybrid integrated circuit device according to the present invention is formed by bending a part of the thick film substrate and providing the mounting hole in the bent part. Since the mounting part is formed on a part of the thick film substrate,
Thick film substrate can be directly attached to the printed circuit board,
Unlike the conventional case, the hybrid integrated circuit device can be directly attached to the printed circuit board without using the heat sink. First, since the heat sink is not required, the manufacturing cost can be reduced by the amount of the heat sink. Since the step of attaching the heat sink is not necessary, it is possible to reduce the number of manufacturing steps.
【図１】本発明の実施例に係る混成集積回路装置の構造
を説明する斜視図である。FIG. 1 is a perspective view illustrating a structure of a hybrid integrated circuit device according to an embodiment of the present invention.
【図２】本発明の実施例に係る混成集積回路装置のプリ
ント基板への取付状態を説明する第１の図面である。FIG. 2 is a first drawing illustrating a mounting state of a hybrid integrated circuit device according to an embodiment of the present invention on a printed circuit board.
【図３】本発明の実施例に係る混成集積回路装置のプリ
ント基板への取付状態を説明する第２の図面である。FIG. 3 is a second drawing illustrating a mounting state of the hybrid integrated circuit device according to the embodiment of the present invention on a printed circuit board.
【図４】従来の混成集積回路装置の構造を説明する斜視
図である。FIG. 4 is a perspective view illustrating a structure of a conventional hybrid integrated circuit device.
【図５】従来の混成集積回路装置のプリント基板への取
付状態を説明する第１の図面である。FIG. 5 is a first drawing illustrating a mounting state of a conventional hybrid integrated circuit device on a printed circuit board.
【図６】従来の混成集積回路装置のプリント基板への取
付状態を説明する第２の図面である。FIG. 6 is a second drawing for explaining a mounting state of a conventional hybrid integrated circuit device on a printed circuit board.
（１１） 厚膜基板 （１２） 取付部 （１２Ａ，１２Ｂ）ビス孔（取付用の孔） （１３） 所定の素子 （１４） リード端子 （ＰＳ） プリント基板 （Ｂ１１，Ｂ１２）ビス (11) Thick film substrate (12) Mounting part (12A, 12B) Screw hole (mounting hole) (13) Predetermined element (14) Lead terminal (PS) Printed circuit board (B11, B12) screw
Claims (2)
質からなる厚膜基板を有し、前記厚膜基板を直接プリン
ト基板に取付ける取付部が前記厚膜基板の一部に形成さ
れてなることを特徴とする混成集積回路装置。1. A thick film substrate on which a predetermined element is mounted and which is made of a material having a high heat dissipation property, and a mounting portion for directly mounting the thick film substrate on a printed circuit board is formed in a part of the thick film substrate. And a hybrid integrated circuit device.
曲げられてなり、かつ前記折り曲げられた部分に取付用
の孔が形成されてなることを特徴とする請求項１記載の
混成集積回路装置。2. The mounting portion is formed by bending a part of the thick film substrate and forming a mounting hole in the bent portion. Hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13450395A JPH08330698A (en) | 1995-05-31 | 1995-05-31 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13450395A JPH08330698A (en) | 1995-05-31 | 1995-05-31 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08330698A true JPH08330698A (en) | 1996-12-13 |
Family
ID=15129853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13450395A Pending JPH08330698A (en) | 1995-05-31 | 1995-05-31 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08330698A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015170855A (en) * | 2014-03-04 | 2015-09-28 | ゼネラル・エレクトリック・カンパニイ | Ultra-thin embedded semiconductor device package and method of manufacturing the same |
-
1995
- 1995-05-31 JP JP13450395A patent/JPH08330698A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015170855A (en) * | 2014-03-04 | 2015-09-28 | ゼネラル・エレクトリック・カンパニイ | Ultra-thin embedded semiconductor device package and method of manufacturing the same |
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