JPH073673Y2 - Heat dissipation structure of heating element - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a housing of an electronic device such as a television camera.
For example, the present invention relates to a heat radiation structure of an element (hereinafter referred to as a heating element) that generates heat during operation, such as an integrated circuit element for driving a CCD.

[Prior Art] An integrated circuit element (hereinafter referred to as an IC) for driving a CCD of a TV camera, etc., generates a large amount of heat during operation.

FIG. 4 is a sectional view of the television camera disclosed in Japanese Utility Model Laid-Open No. 55-1226, in which a printed wiring board 2 to which a CCD 3 is attached is provided in the camera body 1. Is mounted with CCD drive IC and other electrical components. A lens 6 is attached to the camera body 1.

In such a television camera, as shown in FIG. 5, a CCD driving I mounted on a printed wiring board 2 is generally used.
A heat radiating plate 5 made of a metal material having good thermal conductivity (hereinafter referred to as a good thermal conductor) was brought into contact with and fixed to the upper surface of C4, and heat was radiated through the heat radiating plate 5.

Further, as shown in, for example, Japanese Utility Model Publication No. 54-1370, a heat sink is attached to a printed wiring board, a semiconductor element is arranged on this heat sink through insulating paper, and the semiconductor element is held by a spring member. It is designed to be fixed by a plate.

[Problems to be Solved by the Invention] In the heat dissipation structure as described above, since heat is dissipated only by the heat dissipation plate having a small heat dissipation capacity, a sufficient heat dissipation effect cannot be obtained. In particular, in the case of an element that generates a large amount of heat such as a CCD driving IC, the heat radiation effect is insufficient, and thus the image pickup function sometimes deteriorates.

The present invention has been made to solve the above problems.
The purpose of the present invention is to obtain a heat dissipation structure for a heat-generating element of an electronic device, which has a large heat dissipation effect of a D drive IC and the like, and does not cause a decline in function.

[Means for Solving the Problems] The heat dissipation structure of the heat generating element according to the present invention includes at least one heat dissipation pillar integrally formed with a housing made of a good thermal conductor, and a print fixed to the heat dissipation pillar. The heat dissipation plate is in contact with the heat generating element mounted on the wiring board. The heat dissipation plate is provided with a contact piece, and the contact piece is connected to the ground terminal of the printed wiring board.

[Operation] The heat of the heat generating element is conducted from the heat radiating plate and the heat radiating support to the housing,
During that time, heat is radiated from each of these parts, so that a sufficient heat radiating effect can be obtained.

Also, by connecting the contact piece of the heat sink to the ground terminal of the printed wiring board and giving the heat sink a ground function,
It is possible to obtain an electronic device that is resistant to noise.

[Embodiment] FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a right side view thereof. In the figure, 1a is a chassis portion of the camera body (hereinafter referred to as the camera body) made of a good heat conductor such as aluminum alloy, and a lens mounting portion 12 for mounting the lens 6 on the front surface (left side of the drawing) via an adjusting screw 31. Is provided.
A mounting portion 13 for the CCD 3, the printed wiring board 2, etc. is provided on the back surface (on the right side of the figure), and a positioning post 14 of the printed wiring board 2 and a slightly longer than the post 14 are provided on the peripheral edge thereof, and a heat dissipation plate to be described later. Heat dissipation columns 15 and 16 for fixing 5a are integrally formed. Reference numeral 17 denotes a partition wall provided between the lens mounting portion 12 and the mounting portion 13 for the CCD or the like, and a light passage hole 18 is provided at the central portion, and the CCD 3 is mounted in the vicinity thereof.
19, 19a are screw holes provided at the ends of the columns 15 and 16, 20 to 20c
Is a screw hole provided on the partition wall 17 to erect a support column 21 for supporting the printed wiring board 2.

Reference numeral 5a is a heat dissipation plate made of a material having high heat conductivity and high conductivity such as aluminum and copper. As shown in FIG. 3, both ends on one side are bent at the tips in the same direction. Contact pieces 22, 22a are provided. 23, 23a is a heat dissipation column 1
It is a through hole provided at a position aligned with the screw holes 19 and 19a provided in 5, and 16. Reference numeral 32 is a cover for the mounting portion 13 such as a CCD.

Next, an example of the assembling order of the camera body 1a configured as described above will be described. First, the support pillars 21 are respectively screwed into the screw holes 20 to 20c provided in the partition wall 17 of the camera body 1a to which the CCD 3 is attached to stand upright. Next, the printed wiring board 2 is brought into contact with the positioning pillar 14 and fixed to each supporting pillar 21 by screwing.
In this state, the heat dissipation plate 5 is screwed to the heat dissipation columns 15 and 16, and the contact pieces 22 and 22a thereof are soldered to the ground terminal of the printed wiring board 2.

Since the heat radiation columns 15 and 16 are selected to be longer than the positioning column 14 by the height h when the CCD driving IC is mounted on the printed wiring board 2, the lower surface of the heat radiation plate 5a when the heat radiation plate 5a is attached. Touches the upper surface of the CCD driving IC.

In the present invention configured as described above, when the CCD driving IC 4 is now operating and generates heat, the heat is conducted to the camera body 1a via the heat radiating plate 5a and the heat radiating struts 15 and 16, and in the meantime from these parts. Heat is dissipated. Further, since the contact pieces 22 and 22a provided on the heat sink 5a are connected to the ground terminal of the printed wiring board 2, the heat sink 5a has a ground function.

In the above-described embodiment, the case where the present invention is applied to the illustrated camera body 1a is shown.For example, the heat dissipation columns 15 and 16 are separately made of a material having good heat conduction, and this is integrally formed with the camera body 1a. It can be modified in various ways such as mounting.

Although the CCD driving IC 4 is illustrated as the heating element, the present invention can be applied to heat dissipation of other semiconductor elements and electric parts.

Furthermore, the heat sink 5a is formed in a substantially half-moon shape and two contact pieces 22 and 22a are provided at both ends, but the shape depends on the shape and mounting position of the camera body 1a to which it is attached. The positions, the number, etc. of the contact pieces 22, 22a can be appropriately changed.

In addition, in the above-mentioned embodiment, the present invention is applied to the television camera, but the present invention can be applied to other electronic devices.

[Effects of the Invention] As is apparent from the above description, the present invention attaches a heat dissipation plate to a heat dissipation column integrally formed with a housing made of a good conductor of heat, abuts a heat generating element on the heat dissipation plate, and dissipates heat. Since the connection piece provided on the plate is connected to the ground terminal of the printed wiring board so as to have a grounding function, it is possible to obtain a heat dissipation structure having a significantly larger heat dissipation capacity than the conventional one.
Therefore, the heat generated by the heating element can be sufficiently and surely radiated, so that it is possible to realize an electronic device that is resistant to noise and does not interfere with the function.

[Brief description of drawings]

1 is a longitudinal sectional view of an embodiment of the present invention, FIG. 2 is a right side view thereof, FIG. 3 (a) is a plan view of an embodiment of a heat dissipation plate used in the present invention, and FIG. 3 (b) is a side view thereof. FIG. 4 is a cross-sectional view showing an example of a conventional television camera, and FIG. 5 is a schematic view showing an example of a heat dissipation structure of a conventional heating element. 1a: camera body, 2: printed wiring board, 3: CCD, 4: CCD drive IC, 5a: heat sink, 13: CCD mounting part, 14: positioning support, 15, 16: heat dissipation support, 17: bulkhead 22,22a: Contact piece.

Claims (1)

[Scope of utility model registration request] 1. A housing made of a good conductor of heat, at least one heat dissipation pillar integrally formed with the housing, and a heat dissipation plate fixed to the heat dissipation pillar and abutting a heating element mounted on a printed wiring board. And a contact piece provided on the heat sink and the contact piece is connected to a ground terminal of a printed wiring board.