JPS63147396A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS63147396A JPS63147396A JP29444586A JP29444586A JPS63147396A JP S63147396 A JPS63147396 A JP S63147396A JP 29444586 A JP29444586 A JP 29444586A JP 29444586 A JP29444586 A JP 29444586A JP S63147396 A JPS63147396 A JP S63147396A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal plate
- cooling
- metal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 52
- 238000001816 cooling Methods 0.000 claims description 25
- 230000005855 radiation Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、電子部品を搭載し電子部品相互間の接続を行
うプリント配線板に関し、特に電子部品から生じた熱を
放熱冷却するための構造を有したプリント配線板に関す
る。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed wiring board that mounts electronic components and connects the electronic components to each other, and particularly relates to a structure for radiating and cooling heat generated from the electronic components. The present invention relates to a printed wiring board having:
[従来の技術]
従来、この種のプリント配線板は、第4図に示す如くプ
リント配線板本体1の内部に金属板2を有し、特に放熱
部を有していないものがあった。[Prior Art] Conventionally, this type of printed wiring board has had a metal plate 2 inside a printed wiring board main body 1, as shown in FIG. 4, and did not particularly have a heat dissipation section.
また第5図に示す如く、プリント配線板本体1内部に金
属板2で形成した中空部17を有し、気体や液体を循環
させて冷却を行うものがあった。更に第6図に示す如く
、プリント配線板本体1の内部に金属板2を有し、該金
属板2のプリント配線板本体1の端部にヒートシンク5
を取付けて冷却を行うものがあった。Further, as shown in FIG. 5, there was a printed wiring board body 1 which had a hollow part 17 formed of a metal plate 2 and cooled by circulating gas or liquid. Furthermore, as shown in FIG. 6, a metal plate 2 is provided inside the printed wiring board body 1, and a heat sink 5 is provided at the end of the printed wiring board body 1 of the metal plate 2.
There was one that was installed with a cooling system.
[解決すべき問題点コ
上述した従来のプリント配線板にあっては、以下の様な
欠点があった。[Problems to be Solved] The conventional printed wiring board described above had the following drawbacks.
第4図に示したプリント配線板は、特に放熱部を設けて
いないため、発熱量が大きい電子部品を搭載した場合に
は温度が上り過ぎてしまう欠点があった。The printed wiring board shown in FIG. 4 does not particularly have a heat dissipation section, so it has a drawback that the temperature rises too much when electronic components that generate a large amount of heat are mounted.
第5図に示したプリント配線板は、その内部に金属板2
で形成した大きな中空部17を有しているため、該金属
板2の上下を電気的に接続するには困難を伴うという欠
点があった。The printed wiring board shown in FIG. 5 has two metal plates inside it.
Since the metal plate 2 has a large hollow part 17 formed of a metal plate 2, it is difficult to electrically connect the upper and lower parts of the metal plate 2.
第6図に示したプリント配線板は、プリント配線板本体
1の端部にヒートシンク5を備えているため、ヒートシ
ンク5付近での放熱は十分であるが、プリント配線板本
体1の中心部における放熱は不十分となり放熱の不均一
を生じる欠点があった。Since the printed wiring board shown in FIG. 6 is equipped with a heat sink 5 at the end of the printed wiring board body 1, the heat radiation near the heat sink 5 is sufficient, but the heat radiation in the center of the printed wiring board body 1 is sufficient. This has the disadvantage of being insufficient, resulting in uneven heat radiation.
[問題点の解決手段]
本発明は、上記従来の間罵点を解決するためになされた
もので、そのための解決手段として、内部に金属板を有
し、上記金属板と実装する電子部品を接続する伝熱用金
属部材を配し、かつ上記金属板と外部冷却器とを、機械
穴を介して設けた冷却用金属部材で連結したプリント配
線板を提供するものである。[Means for Solving Problems] The present invention has been made in order to solve the above-mentioned problems with the conventional technology. The present invention provides a printed wiring board in which a connecting metal member for heat transfer is disposed, and the metal plate and an external cooler are connected by a metal member for cooling provided through a mechanical hole.
[実施例]
次に、本発明の実施例について図面を参照して説明する
。[Example] Next, an example of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例に係るプリント配線板の縦断
面図、第2図は第1図の実施例に用いた冷却用金属部材
の取付構造を示す縦断面図である。FIG. 1 is a longitudinal sectional view of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a mounting structure for a cooling metal member used in the embodiment of FIG.
プリント配線板は、プリント配線板本体1と、該プリン
ト配線板本体1内部に設けた金属板2と、プリント配線
板本体lに搭載された電子部品3と接触し金属板2と接
続した伝熱用金属部材4と、金属板2と連結し外部に冷
却用のヒートシンク5を有する冷却用金属部材6とより
なる。The printed wiring board includes a printed wiring board main body 1, a metal plate 2 provided inside the printed wiring board main body 1, and a heat transfer device that is in contact with and connected to the metal plate 2, and an electronic component 3 mounted on the printed wiring board main body 1. and a cooling metal member 6 connected to the metal plate 2 and having an external cooling heat sink 5.
金属板2は、プリント配線板本体1の中間部に水平に設
けである。The metal plate 2 is provided horizontally in the middle of the printed wiring board body 1.
伝熱用金属部材4は、断面T字状をなしている。その水
平部7がIC又はLSI等の電子部品3の底面と接触し
、垂直部8がプリント配線板本体1内部の金属板2に接
続している。水平部7の面積は電子部品3の底面の大き
さを略同じに設定しである。これにより、電子部品3で
発生した熱を吸収すると共に金属板2に該熱を伝える。The heat transfer metal member 4 has a T-shaped cross section. The horizontal portion 7 is in contact with the bottom surface of the electronic component 3 such as an IC or LSI, and the vertical portion 8 is connected to the metal plate 2 inside the printed wiring board body 1. The area of the horizontal portion 7 is set to be approximately the same as the size of the bottom surface of the electronic component 3. Thereby, the heat generated in the electronic component 3 is absorbed and the heat is transmitted to the metal plate 2.
冷却用金属部材6は、第1図及び第2図に示す如く断面
T字状をなしている。その水平部9が筐体10の内面に
当接し、垂直部11がその先端部をプリント配線板本体
1の端部にある機械穴12に挿入させてプリント配線板
本体1内部の金属板2と連結している。冷却用金属部材
6の内部にはボルト用穴13が設けである。The cooling metal member 6 has a T-shaped cross section as shown in FIGS. 1 and 2. The horizontal part 9 is in contact with the inner surface of the casing 10, and the vertical part 11 is inserted into the machine hole 12 at the end of the printed wiring board main body 1, and the vertical part 11 is connected to the metal plate 2 inside the printed wiring board main body 1. It is connected. Bolt holes 13 are provided inside the cooling metal member 6.
該ボルト用穴13にボルト14を挿通させナツト15の
締付により冷却用金属部材6をプリント配線板本体1と
筐体10に固定している。冷却用金属部材6の垂直部1
1は大部分外部に露出しており、該露出部に冷却用のヒ
ートシンク5が装着しである。これにより、金属板2内
の熱を外部に放熱すると共に外気によって冷却する。The cooling metal member 6 is fixed to the printed wiring board main body 1 and the housing 10 by inserting a bolt 14 into the bolt hole 13 and tightening a nut 15. Vertical portion 1 of cooling metal member 6
1 is mostly exposed to the outside, and a cooling heat sink 5 is attached to the exposed part. Thereby, the heat inside the metal plate 2 is radiated to the outside and is cooled by the outside air.
次に、本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
電子部品3は熱を発生する。該熱は伝熱用金属部材4の
水平部7に吸収され、垂直部8を伝わってプリント配線
板本体1内部の金属板2に至る。The electronic component 3 generates heat. The heat is absorbed by the horizontal portion 7 of the heat transfer metal member 4, transmitted through the vertical portion 8, and reaches the metal plate 2 inside the printed wiring board body 1.
該金属板2内の熱は冷却用金属部材6側に移動し、冷却
用金属部材6の垂直部11内を伝わる。The heat within the metal plate 2 moves toward the cooling metal member 6 and is transmitted within the vertical portion 11 of the cooling metal member 6.
該垂直部11内の熱は大きな放熱面積を存するヒートシ
ンク5を介して外部に放熱されると共に外気により冷却
される。The heat within the vertical portion 11 is radiated to the outside via the heat sink 5 having a large heat radiation area, and is cooled by the outside air.
次いで、本発明の他の実施例について図面を参照して説
明する。Next, other embodiments of the present invention will be described with reference to the drawings.
第3図は本発明の他の実施例に係るプリント配線板の縦
断面図である。FIG. 3 is a longitudinal sectional view of a printed wiring board according to another embodiment of the present invention.
冷却用金属部材6は、プリント配線板本体1の所定個所
の機械穴12に所定散設けである。冷却用金属部材6の
水平部9は外部に設けた冷却用の水冷装置16に当接し
ている。冷却用金属部材6は、第2図に示したと同様の
方法で、ボルトとナツトにより水冷装置16とプリント
配線板本体1に固定しである。The cooling metal members 6 are provided at predetermined intervals in mechanical holes 12 at predetermined locations in the printed wiring board main body 1 . The horizontal portion 9 of the cooling metal member 6 is in contact with a cooling water cooling device 16 provided outside. The cooling metal member 6 is fixed to the water cooling device 16 and the printed wiring board body 1 using bolts and nuts in the same manner as shown in FIG.
他の構成については第1図に示した実施例に係るプリン
ト配線板と同じである。The other configurations are the same as the printed wiring board according to the embodiment shown in FIG.
従って、電子部品3で発生した熱は、伝熱用金属部材4
、金属板2を通じて冷却用金属部材6に至り、水冷装置
16によって冷却される。Therefore, the heat generated in the electronic component 3 is transferred to the heat transfer metal member 4.
, reaches the cooling metal member 6 through the metal plate 2, and is cooled by the water cooling device 16.
[発明の効果コ
以上説明したように本発明は、内部に金属板を有し、該
金属板と実装する電子部品と接続する伝熱用金属部材を
配し、かつ該金属板と外部冷却器とを、機械穴を介して
設けた冷却用金属部材で連結したプリント配線板とした
ため、プリント配線板のどの部分をとっても比較的均一
に放熱することができる効果がある。また、第5図に示
した従来のプリント配線板のような中空部を有しないの
で、金属板の上下にパターンを形成することができ、両
面実装を可能にする効果がある。[Effects of the Invention] As explained above, the present invention has a metal plate inside, a heat transfer metal member is arranged to connect the metal plate to the electronic component to be mounted, and the metal plate and an external cooler are connected to each other. Since these are connected to each other by a cooling metal member provided through a mechanical hole in the printed wiring board, heat can be radiated relatively uniformly from any part of the printed wiring board. Further, since it does not have a hollow part like the conventional printed wiring board shown in FIG. 5, patterns can be formed on the top and bottom of the metal plate, which has the effect of making double-sided mounting possible.
第1図は本発明の〜実施例に係るプリント配線板の縦断
面図、第2図は第1図の実施例に用いた冷却用金属部材
の取付構造を示す縦断面図、第3図は本発明の他の実施
例に係るプリント配線板の縦断面図、第4図乃至第6図
は従来のプリント配線板の断面図である。
1ニブリント配線板本体
2:金属板
3:電子部品
4:伝熱用金属部材
5:ヒートシンク(冷却器)
6:冷却用金属部材
16:水冷装置(冷却器)FIG. 1 is a vertical cross-sectional view of a printed wiring board according to embodiments of the present invention, FIG. 2 is a vertical cross-sectional view showing the mounting structure of the cooling metal member used in the embodiment of FIG. 1, and FIG. A vertical sectional view of a printed wiring board according to another embodiment of the present invention, and FIGS. 4 to 6 are sectional views of a conventional printed wiring board. 1 Niblint wiring board body 2: Metal plate 3: Electronic component 4: Heat transfer metal member 5: Heat sink (cooler) 6: Cooling metal member 16: Water cooling device (cooler)
Claims (1)
材を配し、 かつ上記金属板と外部冷却器とを、機械穴を介して設け
た冷却用金属部材で連結したことを特徴とするプリント
配線板。[Scope of Claims] A metal plate is provided inside, and a heat transfer metal member is arranged to connect the metal plate and the electronic components to be mounted, and the metal plate and an external cooler are connected through a mechanical hole. A printed wiring board characterized in that it is connected by a provided cooling metal member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29444586A JPS63147396A (en) | 1986-12-10 | 1986-12-10 | Printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29444586A JPS63147396A (en) | 1986-12-10 | 1986-12-10 | Printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63147396A true JPS63147396A (en) | 1988-06-20 |
Family
ID=17807868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29444586A Pending JPS63147396A (en) | 1986-12-10 | 1986-12-10 | Printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63147396A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005260252A (en) * | 2005-03-30 | 2005-09-22 | Fujitsu Ltd | Electronic device equipped with spacer having function of protecting electronic component |
-
1986
- 1986-12-10 JP JP29444586A patent/JPS63147396A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005260252A (en) * | 2005-03-30 | 2005-09-22 | Fujitsu Ltd | Electronic device equipped with spacer having function of protecting electronic component |
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