JPS63147396A - Printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed wiring board that mounts electronic components and connects the electronic components to each other, and particularly relates to a structure for radiating and cooling heat generated from the electronic components. The present invention relates to a printed wiring board having:

[Prior Art] Conventionally, this type of printed wiring board has had a metal plate 2 inside a printed wiring board main body 1, as shown in FIG. 4, and did not particularly have a heat dissipation section.

Further, as shown in FIG. 5, there was a printed wiring board body 1 which had a hollow part 17 formed of a metal plate 2 and cooled by circulating gas or liquid. Furthermore, as shown in FIG. 6, a metal plate 2 is provided inside the printed wiring board body 1, and a heat sink 5 is provided at the end of the printed wiring board body 1 of the metal plate 2.
There was one that was installed with a cooling system.

[Problems to be Solved] The conventional printed wiring board described above had the following drawbacks.

The printed wiring board shown in FIG. 4 does not particularly have a heat dissipation section, so it has a drawback that the temperature rises too much when electronic components that generate a large amount of heat are mounted.

The printed wiring board shown in FIG. 5 has two metal plates inside it.
Since the metal plate 2 has a large hollow part 17 formed of a metal plate 2, it is difficult to electrically connect the upper and lower parts of the metal plate 2.

Since the printed wiring board shown in FIG. 6 is equipped with a heat sink 5 at the end of the printed wiring board body 1, the heat radiation near the heat sink 5 is sufficient, but the heat radiation in the center of the printed wiring board body 1 is sufficient. This has the disadvantage of being insufficient, resulting in uneven heat radiation.

[Means for Solving Problems] The present invention has been made in order to solve the above-mentioned problems with the conventional technology. The present invention provides a printed wiring board in which a connecting metal member for heat transfer is disposed, and the metal plate and an external cooler are connected by a metal member for cooling provided through a mechanical hole.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a longitudinal sectional view of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a mounting structure for a cooling metal member used in the embodiment of FIG.

The printed wiring board includes a printed wiring board main body 1, a metal plate 2 provided inside the printed wiring board main body 1, and a heat transfer device that is in contact with and connected to the metal plate 2, and an electronic component 3 mounted on the printed wiring board main body 1. and a cooling metal member 6 connected to the metal plate 2 and having an external cooling heat sink 5.

The metal plate 2 is provided horizontally in the middle of the printed wiring board body 1.

The heat transfer metal member 4 has a T-shaped cross section. The horizontal portion 7 is in contact with the bottom surface of the electronic component 3 such as an IC or LSI, and the vertical portion 8 is connected to the metal plate 2 inside the printed wiring board body 1. The area of the horizontal portion 7 is set to be approximately the same as the size of the bottom surface of the electronic component 3. Thereby, the heat generated in the electronic component 3 is absorbed and the heat is transmitted to the metal plate 2.

The cooling metal member 6 has a T-shaped cross section as shown in FIGS. 1 and 2. The horizontal part 9 is in contact with the inner surface of the casing 10, and the vertical part 11 is inserted into the machine hole 12 at the end of the printed wiring board main body 1, and the vertical part 11 is connected to the metal plate 2 inside the printed wiring board main body 1. It is connected. Bolt holes 13 are provided inside the cooling metal member 6.

The cooling metal member 6 is fixed to the printed wiring board main body 1 and the housing 10 by inserting a bolt 14 into the bolt hole 13 and tightening a nut 15. Vertical portion 1 of cooling metal member 6
1 is mostly exposed to the outside, and a cooling heat sink 5 is attached to the exposed part. Thereby, the heat inside the metal plate 2 is radiated to the outside and is cooled by the outside air.

Next, the operation of this embodiment will be explained.

The electronic component 3 generates heat. The heat is absorbed by the horizontal portion 7 of the heat transfer metal member 4, transmitted through the vertical portion 8, and reaches the metal plate 2 inside the printed wiring board body 1.

The heat within the metal plate 2 moves toward the cooling metal member 6 and is transmitted within the vertical portion 11 of the cooling metal member 6.

The heat within the vertical portion 11 is radiated to the outside via the heat sink 5 having a large heat radiation area, and is cooled by the outside air.

Next, other embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is a longitudinal sectional view of a printed wiring board according to another embodiment of the present invention.

The cooling metal members 6 are provided at predetermined intervals in mechanical holes 12 at predetermined locations in the printed wiring board main body 1 . The horizontal portion 9 of the cooling metal member 6 is in contact with a cooling water cooling device 16 provided outside. The cooling metal member 6 is fixed to the water cooling device 16 and the printed wiring board body 1 using bolts and nuts in the same manner as shown in FIG.

The other configurations are the same as the printed wiring board according to the embodiment shown in FIG.

Therefore, the heat generated in the electronic component 3 is transferred to the heat transfer metal member 4.
, reaches the cooling metal member 6 through the metal plate 2, and is cooled by the water cooling device 16.

[Effects of the Invention] As explained above, the present invention has a metal plate inside, a heat transfer metal member is arranged to connect the metal plate to the electronic component to be mounted, and the metal plate and an external cooler are connected to each other. Since these are connected to each other by a cooling metal member provided through a mechanical hole in the printed wiring board, heat can be radiated relatively uniformly from any part of the printed wiring board. Further, since it does not have a hollow part like the conventional printed wiring board shown in FIG. 5, patterns can be formed on the top and bottom of the metal plate, which has the effect of making double-sided mounting possible.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view of a printed wiring board according to embodiments of the present invention, FIG. 2 is a vertical cross-sectional view showing the mounting structure of the cooling metal member used in the embodiment of FIG. 1, and FIG. A vertical sectional view of a printed wiring board according to another embodiment of the present invention, and FIGS. 4 to 6 are sectional views of a conventional printed wiring board. 1 Niblint wiring board body 2: Metal plate 3: Electronic component 4: Heat transfer metal member 5: Heat sink (cooler) 6: Cooling metal member 16: Water cooling device (cooler)

Claims (1)

[Scope of Claims] A metal plate is provided inside, and a heat transfer metal member is arranged to connect the metal plate and the electronic components to be mounted, and the metal plate and an external cooler are connected through a mechanical hole. A printed wiring board characterized in that it is connected by a provided cooling metal member.