JPH0577990U - Exothermic hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] [Objective] To provide a heat-dissipating hybrid integrated circuit device with good heat dissipation and mounting efficiency that allows circuit components to be mounted on both main surfaces of a heat conductive circuit board, and to dissipate the heat dissipation board on another surface. It should be handled like parts. [Structure] Wiring patterns and land electrodes connected to the wiring patterns are formed on both main surfaces of the heat conductive circuit board, and dummy land electrodes are formed on one main surface. The radiating board having a plurality of radiating fins attached thereto is supported by a supporting member having one end fixed to the radiating fins attached to both ends thereof and the other end having a horizontal supporting portion connected to the dummy land electrode. The heat conductive circuit board, the heat dissipation board, and the support member form a circuit component space into which the heat generating circuit component is inserted.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a heat-generating hybrid integrated circuit device in which heat-generating circuit components are efficiently mounted on a heat-conductive circuit board.

[0002]

[Prior Art]

 FIG. 3 is a diagram for explaining a state in which a heat generating circuit component in a conventional example is attached. In FIG. 3, the heat generating circuit component 31 is surface-mounted on the heat conductive circuit board 33 by the external connection terminal 32 thereof. The heat-conductive circuit board 33 is a metal or ceramic board, and in the case of a metal, a wiring pattern, land electrodes, etc. are formed on the heat-conductive circuit board 33 via an insulating sheet (not shown). A large number of heat radiation fins 34 are attached to the heat conductive circuit board 33 on the side opposite to the main surface on which the heat generating circuit component 31 is attached, for example, with a heat conductive adhesive.

The heat conductive circuit board 33 as described above is attached to the mother circuit board 35 by a known fixing means (not shown). Then, the heat generated from the heat generating circuit component 31 is dissipated from the heat radiation fins 34 via the heat conductive circuit board 33.

[0004]

[Problems to be solved by the device]

 Since the heat-conductive circuit board 33 as shown in FIG. 3 is provided with the heat-generating circuit component 31 on one main surface and the radiation fins 34 on the other main surface, the circuit component is mounted on one main surface. There was a problem that it could only be done on the face. Further, when the heat generation amount of the heat-generating circuit component 31 is large, there is a problem that the large heat radiation fins 34 are required and the hybrid integrated circuit device cannot be downsized. Further, the heat-conductive circuit board 33 requires a fixing step for attaching it to the mother circuit board 35 and the labor thereof.

The present invention is intended to solve the above problems, and provides a heat-generating hybrid integrated circuit device capable of mounting circuit components on both main surfaces of a heat-conductive circuit board with good heat dissipation and mounting efficiency. The purpose is to do. An object of the present invention is to provide a heat-generating hybrid integrated circuit device that can handle a heat dissipation board in the same manner as other surface mount components.

[0006]

[Means for Solving the Problems]

 (First Invention) In order to achieve the above-mentioned object, a heat-generating hybrid integrated circuit device has a wiring pattern and land electrodes connected to the wiring pattern on both main surfaces, and a dummy land electrode (Fig. 1 and 12 of FIG. 2), respectively, a heat conductive circuit board (11 of FIGS. 1 and 2) and a heat dissipation board to which a plurality of heat radiation fins (2 of FIGS. 1 and 2) are attached. (1 in FIG. 1 and FIG. 2), and one end fixed to the heat dissipation fins (2) attached to both ends of the heat dissipation board (1) and the other end connected to the dummy land electrode (12) A support member (3 in FIG. 1) provided with a support portion (4 in FIG. 1), and the heat conductive circuit board (11), the heat dissipation board (1) and the support member (3). To form a circuit component space (5 in FIG. 2) into which the heat generating circuit component (21 in FIG. 2) is inserted. It is characterized by

(Second Invention) In the heat-generating hybrid integrated circuit device, the heat-generating circuit component (21) is in direct contact with the heat dissipation board (1).

[0008]

[Work]

 (1st invention) The heat generated in the heat-generating circuit component is transmitted from the heat-conductive circuit board to the heat-radiating board and the heat-radiating fins through the supporting member, and is dissipated in these parts and air passing between the heat-radiating fins. Dissipate by. That is, the heat generated in the heat-generating circuit component is dissipated while being transferred to the heat-conductive circuit board, the supporting member, the heat-dissipating board, and the heat radiation fins, and the heat-conductive circuit board, the supporting member, and the heat radiation. It is cooled by the air flowing through the circuit component space formed by the substrate and the space sandwiched by a large number of heat radiation fins. Further, since the heat-conductive circuit board is mounted separately from the heat-dissipating board having the heat-dissipating fins by the supporting member having the horizontal supporting portion, the circuit components can be mounted on both main surfaces. Furthermore, since the heat dissipation board with heat dissipation fins is attached to the dummy land electrode of the heat conductive circuit board by the support member having the horizontal support, treat it as a surface mount component like other circuit components. You can

(Second Invention) The heat-generating circuit component mounted on the heat-conductive circuit board may have its upper surface in contact with the heat-radiating circuit board. That is, when the heat-generating circuit component and other circuit components are mounted on both main surfaces of the heat-conductive circuit board and the heat-dissipating board equipped with the heat-dissipating fins is mounted, the top surface of the heat-generating circuit component and the heat-dissipating board are Make contact. In this way, the heat generated from the heat-generating circuit components is generated by the heat conduction by the heat-conducting circuit board and the heat-dissipating board and the heat-conducting circuit board, the heat-dissipating board, and the supporting member supporting the heat-dissipating board. Is dissipated by the airflow flowing through the space formed by the heat radiation fins and the space formed by the radiation fins. Therefore, by adopting the above-mentioned configuration, it is possible to provide a small heat-generating hybrid integrated circuit device with good heat dissipation efficiency.

[0010]

【Example】

 FIG. 1 is a schematic perspective view of a heat-generating hybrid integrated circuit device according to an embodiment of the present invention. FIG. 2 is a sectional view of FIG. 1 as viewed from the right or the left. In FIGS. 1 and 2, a large number of radiation fins 2 whose lower part is formed in an L shape, for example, are mounted on the heat radiation substrate 1 by caulking, soldering, or a heat conductive adhesive. Further, the radiation fins 2 attached to both ends of the radiation substrate 1 are attached with support members 3 each having an L-shaped horizontal support portion 4 at the bottom. The heat dissipating board 1 and the supporting member 3 are attached at positions where the circuit component space 5 is formed between the heat dissipating board 1 and the heat conductive circuit board 11. The space formed by the heat radiation fins 2 and the heat radiation substrate 1 serves as an air flow passage. The interval at which the heat radiation fins 2 are provided on the heat radiation substrate 1 is determined in consideration of the heat capacity of the heat-generating circuit component.

On both main surfaces of the heat conductive circuit board 11, a wiring pattern and a dummy land electrode 12 (not shown) are formed. Then, for example, a solder paste (not shown) is applied on the land electrode formed on the heat-conductive circuit board 11 and the dummy land electrode 12. The heat-generating circuit component 21 and the other circuit components 22 and 23 are placed at predetermined positions on the wiring pattern. After that, the heat-dissipating substrate 1 provided with the heat-dissipating fins 2 is mounted on the dummy land electrode 12 by the horizontal support portion 4 as one surface mounting component. The heat conductive circuit board 11 is soldered in this state, for example, by passing through a reflow furnace. The heat-generating circuit component 21 is arranged so that its upper portion is in contact with the heat dissipation board 1, and transfers the generated heat to the heat conductive circuit board 11 and the heat dissipation board 1 or separates it from the heat dissipation board 1. It is also possible to improve the circulation of air. It should be noted that a heat-conductive adhesive 21 'may be put in the contact portion between the heat-generating circuit component 21 and the heat dissipation substrate 1 to bond them together.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Further, various design changes can be made without departing from the present invention described in the claims for utility model registration. For example, the shapes of the circuit component space, the heat radiation fins, and the support member can be arbitrarily changed depending on the shape and heat generation capacity of the heat generating circuit component. Further, although the supporting member and the dummy land electrode in the embodiment are shown as being divided, it is possible to use one continuous member. Further, the dummy land electrode can also serve as the ground electrode.

[0013]

[Effect of the device]

 According to the present invention, since the heat dissipation board having the heat dissipation fins is connected to the dummy land electrode by the support member provided with the horizontal support, it can be treated as a surface mount component. In addition, the heat-generating circuit components include heat conduction by a heat-dissipating board that includes a heat-conductive circuit board, a supporting member, and heat radiation fins, and heat conduction by a heat-dissipating board that includes a heat-conductive circuit board, a supporting member, and heat radiation fins. It is efficiently cooled by the air flowing through the space formed by the space and the space formed by the radiation fins.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a heat-generating hybrid integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a sectional view of FIG. 1 as viewed from the right or the left.

FIG. 3 is a diagram for explaining a state in which a heat-generating circuit component in a conventional example is attached.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Heat dissipation board 2 ... Heat dissipation fin 3 ... Support member 4 ... Horizontal support part 5 ... Circuit component space 11 ... Thermally conductive circuit board 12 ... Dummy land electrode 21 ... Exothermic circuit component 21 '... Thermally conductive adhesive

Claims (2)

[Scope of utility model registration request] 1. A heat-conductive circuit board having wiring patterns and land electrodes connected to the wiring patterns on both main surfaces, and dummy land electrodes on one main surface, respectively, and a plurality of heat radiation fins. And a supporting member having a horizontal supporting portion, one end of which is fixed to the heat dissipating fins attached to both ends of the heat dissipating substrate and the other end of which is connected to the dummy land electrode. A heat-generating mixed integrated circuit device, wherein a heat-generating circuit board, a heat-radiating board, and a supporting member form a circuit component space into which a heat-generating circuit component is inserted. 2. The heat generating hybrid integrated circuit device according to claim 1, wherein the heat generating circuit component and the heat dissipation board are in direct contact with each other.