JPS54154277A - Heat radiation device - Google Patents

Heat radiation device

Info

Publication number
JPS54154277A
JPS54154277A JP6298578A JP6298578A JPS54154277A JP S54154277 A JPS54154277 A JP S54154277A JP 6298578 A JP6298578 A JP 6298578A JP 6298578 A JP6298578 A JP 6298578A JP S54154277 A JPS54154277 A JP S54154277A
Authority
JP
Japan
Prior art keywords
heat sink
heat
cavity
heat radiation
gasified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6298578A
Other languages
Japanese (ja)
Other versions
JPS619738B2 (en
Inventor
Manabu Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP6298578A priority Critical patent/JPS54154277A/en
Publication of JPS54154277A publication Critical patent/JPS54154277A/en
Publication of JPS619738B2 publication Critical patent/JPS619738B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To obtain a high heat radiation effect by constituting the heat sink with the first heat sink containing the cavity and the second heat sink pasted together and raising up the refrigerant within the cavity via the capillary phenomenon to be gasified. CONSTITUTION:Heat radiation device 1 is constituted with first heat sink 1a containing the cavity and second heat sink 1b pasted together. Then heat radiated substance containing a number of electric parts to be cooled down is attached to heat sink 1b of one side via screw 3, and lead wire 5 supplied from heat radiated substance 3 is connected to print substrate 4. And device 1 is attached tight to the end part of machine chassis 6 with screw 7 and via the angle. In such constitution, heat sink 1b is made flat and heat sink 1a opposing to 1b is made uneven in order to secure the cavity to the heat sink. Thus refrigerant 8 is intruded into the cavity caused by the concavity and then gasified there to cool down the two heat sinks effectively.
JP6298578A 1978-05-25 1978-05-25 Heat radiation device Granted JPS54154277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6298578A JPS54154277A (en) 1978-05-25 1978-05-25 Heat radiation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6298578A JPS54154277A (en) 1978-05-25 1978-05-25 Heat radiation device

Publications (2)

Publication Number Publication Date
JPS54154277A true JPS54154277A (en) 1979-12-05
JPS619738B2 JPS619738B2 (en) 1986-03-25

Family

ID=13216154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6298578A Granted JPS54154277A (en) 1978-05-25 1978-05-25 Heat radiation device

Country Status (1)

Country Link
JP (1) JPS54154277A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6564503B1 (en) 1999-05-18 2003-05-20 Elm, Inc. Apparatus for trapping and killing insects
US7028760B2 (en) 1999-05-12 2006-04-18 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293338A (en) * 1987-05-27 1988-11-30 Nok Corp Rubber spring

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7028760B2 (en) 1999-05-12 2006-04-18 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7066240B2 (en) 1999-05-12 2006-06-27 Thermal Corp Integrated circuit heat pipe heat spreader with through mounting holes
US7100680B2 (en) 1999-05-12 2006-09-05 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7100679B2 (en) 1999-05-12 2006-09-05 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6564503B1 (en) 1999-05-18 2003-05-20 Elm, Inc. Apparatus for trapping and killing insects

Also Published As

Publication number Publication date
JPS619738B2 (en) 1986-03-25

Similar Documents

Publication Publication Date Title
IT1162748B (en) COOLING STRUCTURE OF SEMICONDUCTIVE DEVICES
JPS5745959A (en) Resin-sealed semiconductor device
EP0327336A3 (en) Electronic devices incorporating carbon films
JPS54154277A (en) Heat radiation device
JPS5414181A (en) Semiconductor laser unit
MY7400320A (en) Thermal fatigue-free semiconductor device
JPS6459841A (en) Semiconductor device
JPS57111053A (en) Heat radiation of electronic apparatus
JPS56133857A (en) Manufacture of hybrid ic
JPS54111768A (en) Semiconductor device of resin sealing type
JPS56137662A (en) Semiconductor device
JPS55134952A (en) Mounting of ic package
JPS6489547A (en) Board for mounting semiconductor element
JPS6465895A (en) Mesh-shaped metal core substrate
JPS57128047A (en) High frequency high power transistor
JPS5683051A (en) Semiconductor device
JPS57153457A (en) Semiconductor mounting apparatus
GB969483A (en) Improvements in or relating to semiconductor assemblies and methods of forming such assemblies
JPS57117263A (en) Cooler for dual-in-line package type integrated circuit element
JPS56148855A (en) High density package
JPS57121260A (en) Semiconductor device
JPS5448173A (en) Semiconductor device
JPS553657A (en) Electronic circuit device
JPS52135281A (en) Semiconductor device
FR2336853A1 (en) Interconnecting plate with printed circuit on one face - has components mounted on other face and acts as heatsink