JPS6444089A - Thermally conductive wiring substrate - Google Patents
Thermally conductive wiring substrateInfo
- Publication number
- JPS6444089A JPS6444089A JP62201363A JP20136387A JPS6444089A JP S6444089 A JPS6444089 A JP S6444089A JP 62201363 A JP62201363 A JP 62201363A JP 20136387 A JP20136387 A JP 20136387A JP S6444089 A JPS6444089 A JP S6444089A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- thermal
- thermally conductive
- wiring substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
PURPOSE:To obtain a circuit substrate in which an operation speed can be largely accelerated by forming a circuit of an oxide superconductor on a thermal-conductive insulating substrate. CONSTITUTION:This thermal-conductive circuit substrate is composed by forming a circuit of an oxide superconductor on a thermal-conductive insulating substrate. For example, the thermal-conductive insulating substrate 3 is formed of a base substrate 1 and a thin insulating film 2, and a circuit is formed of the oxide superconductor 4 on the substrate 3. Since the circuit substrate has high thermal conductivity, it has excellent cooling efficiency, the wirings are formed of the superconductor, and its resistance can be set to zero. Thus, the operation speed of an LSI formed on the substrate can be largely improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201363A JPS6444089A (en) | 1987-08-11 | 1987-08-11 | Thermally conductive wiring substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201363A JPS6444089A (en) | 1987-08-11 | 1987-08-11 | Thermally conductive wiring substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6444089A true JPS6444089A (en) | 1989-02-16 |
Family
ID=16439813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62201363A Pending JPS6444089A (en) | 1987-08-11 | 1987-08-11 | Thermally conductive wiring substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6444089A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4982906A (en) * | 1989-03-17 | 1991-01-08 | Agency Of Industrial Science & Technology | Multi-chamber inclined ball mill |
-
1987
- 1987-08-11 JP JP62201363A patent/JPS6444089A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4982906A (en) * | 1989-03-17 | 1991-01-08 | Agency Of Industrial Science & Technology | Multi-chamber inclined ball mill |
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