JPS6444089A - Thermally conductive wiring substrate - Google Patents

Thermally conductive wiring substrate

Info

Publication number
JPS6444089A
JPS6444089A JP62201363A JP20136387A JPS6444089A JP S6444089 A JPS6444089 A JP S6444089A JP 62201363 A JP62201363 A JP 62201363A JP 20136387 A JP20136387 A JP 20136387A JP S6444089 A JPS6444089 A JP S6444089A
Authority
JP
Japan
Prior art keywords
substrate
circuit
thermal
thermally conductive
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62201363A
Other languages
Japanese (ja)
Inventor
Yoshihisa Owada
Kenji Yamamoto
Tsutomu Nanao
Masakazu Kamikita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP62201363A priority Critical patent/JPS6444089A/en
Publication of JPS6444089A publication Critical patent/JPS6444089A/en
Pending legal-status Critical Current

Links

Landscapes

  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

PURPOSE:To obtain a circuit substrate in which an operation speed can be largely accelerated by forming a circuit of an oxide superconductor on a thermal-conductive insulating substrate. CONSTITUTION:This thermal-conductive circuit substrate is composed by forming a circuit of an oxide superconductor on a thermal-conductive insulating substrate. For example, the thermal-conductive insulating substrate 3 is formed of a base substrate 1 and a thin insulating film 2, and a circuit is formed of the oxide superconductor 4 on the substrate 3. Since the circuit substrate has high thermal conductivity, it has excellent cooling efficiency, the wirings are formed of the superconductor, and its resistance can be set to zero. Thus, the operation speed of an LSI formed on the substrate can be largely improved.
JP62201363A 1987-08-11 1987-08-11 Thermally conductive wiring substrate Pending JPS6444089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62201363A JPS6444089A (en) 1987-08-11 1987-08-11 Thermally conductive wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62201363A JPS6444089A (en) 1987-08-11 1987-08-11 Thermally conductive wiring substrate

Publications (1)

Publication Number Publication Date
JPS6444089A true JPS6444089A (en) 1989-02-16

Family

ID=16439813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62201363A Pending JPS6444089A (en) 1987-08-11 1987-08-11 Thermally conductive wiring substrate

Country Status (1)

Country Link
JP (1) JPS6444089A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4982906A (en) * 1989-03-17 1991-01-08 Agency Of Industrial Science & Technology Multi-chamber inclined ball mill

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4982906A (en) * 1989-03-17 1991-01-08 Agency Of Industrial Science & Technology Multi-chamber inclined ball mill

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