JPS5780747A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5780747A
JPS5780747A JP15588080A JP15588080A JPS5780747A JP S5780747 A JPS5780747 A JP S5780747A JP 15588080 A JP15588080 A JP 15588080A JP 15588080 A JP15588080 A JP 15588080A JP S5780747 A JPS5780747 A JP S5780747A
Authority
JP
Japan
Prior art keywords
holding means
solder layer
projections
layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15588080A
Other languages
Japanese (ja)
Inventor
Kou Saitou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15588080A priority Critical patent/JPS5780747A/en
Publication of JPS5780747A publication Critical patent/JPS5780747A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain sufficient heat resistance and cold resistance of a semiconductor device even when the device has a junction between materials of different type by providing holding means for forming an adequate solder layer between a radiating plate and an insulating plate and between the insulating plate and a semiconductor element. CONSTITUTION:An insulating plate such as a ceramic plate having a metallized layer 9a via a solder layer 8 is bonded on a heat radiating plate 7 formed with holding means made of projections 7a, 7b. Further, a large power semiconductor element 11 formed with projections 11a, 11b via a solder layer 10 is bonded thereon. Since the thickness of the solder layer can be specified by the holding means provided at the layer in the semiconductor device thus constructed, the solder layer of sufficient thickness can be obtained by selecting the thickness of the holding means. As a consequence, a semiconductor strong for the thermal change can be obtained. The shape of the holding means may not always be projections, but may also be any shape.
JP15588080A 1980-11-07 1980-11-07 Semiconductor device Pending JPS5780747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15588080A JPS5780747A (en) 1980-11-07 1980-11-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15588080A JPS5780747A (en) 1980-11-07 1980-11-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5780747A true JPS5780747A (en) 1982-05-20

Family

ID=15615518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15588080A Pending JPS5780747A (en) 1980-11-07 1980-11-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5780747A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762491B1 (en) 2003-01-23 2004-07-13 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device
US10358855B2 (en) 2014-04-29 2019-07-23 Brose Fahrzeugteile Gmbh & Co. Kg, Bamberg Linear drive for an adjustment element of a motor vehicle

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4710169U (en) * 1971-02-25 1972-10-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4710169U (en) * 1971-02-25 1972-10-06

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762491B1 (en) 2003-01-23 2004-07-13 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device
US10358855B2 (en) 2014-04-29 2019-07-23 Brose Fahrzeugteile Gmbh & Co. Kg, Bamberg Linear drive for an adjustment element of a motor vehicle

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