JPS5478982A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS5478982A
JPS5478982A JP14644477A JP14644477A JPS5478982A JP S5478982 A JPS5478982 A JP S5478982A JP 14644477 A JP14644477 A JP 14644477A JP 14644477 A JP14644477 A JP 14644477A JP S5478982 A JPS5478982 A JP S5478982A
Authority
JP
Japan
Prior art keywords
heat sink
solder
base
hole
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14644477A
Other languages
Japanese (ja)
Other versions
JPS6120146B2 (en
Inventor
Takehisa Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14644477A priority Critical patent/JPS5478982A/en
Publication of JPS5478982A publication Critical patent/JPS5478982A/en
Publication of JPS6120146B2 publication Critical patent/JPS6120146B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To perform the removal and replacement of chip arbitrarily and easily, by fitting heat sink on the back of the semiconductor chip in face down bonding.
CONSTITUTION: The element 12 is in face down bonding to the element mounting base 11. The heat sink 14 is provided with the through-hole 14A opposing with the element 12, solder plating layer 16 and screw hole 14B. When the plate 14 and the base 11 are fixed with screws 15 via the copper spacer 13, clearance is caused between the plate 14 and the element 12. When low temperature solder 17 is inserted to the hole 14A and heated, the solder 17 is molten to the solder plating 16 and it simply in contact with the element 12. With this constitution, even with the bending of mounting base and heat sink and unevenness of thickness of chip, since the back of element and heat sink are closely fitted with solder, heat dissipation is excellent and the base and the heat sink can easily be separated, allowing to easy replacement.
COPYRIGHT: (C)1979,JPO&Japio
JP14644477A 1977-12-06 1977-12-06 Semiconductor device and its manufacture Granted JPS5478982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14644477A JPS5478982A (en) 1977-12-06 1977-12-06 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14644477A JPS5478982A (en) 1977-12-06 1977-12-06 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
JPS5478982A true JPS5478982A (en) 1979-06-23
JPS6120146B2 JPS6120146B2 (en) 1986-05-21

Family

ID=15407777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14644477A Granted JPS5478982A (en) 1977-12-06 1977-12-06 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5478982A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0812015A1 (en) * 1996-06-04 1997-12-10 MAGNETI MARELLI S.p.A. A heat dissipator for integrated circuits
JP2001144233A (en) * 1999-11-12 2001-05-25 Fujitsu Ltd Semiconductor unit, cooler and their manufacturing method
US6281575B1 (en) 1998-07-08 2001-08-28 Hitachi, Ltd Multi-chip module
JP2010153934A (en) * 2010-04-07 2010-07-08 Fujitsu Ltd Semiconductor unit and cooling device, and method for manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174660U (en) * 1987-03-31 1988-11-14

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0812015A1 (en) * 1996-06-04 1997-12-10 MAGNETI MARELLI S.p.A. A heat dissipator for integrated circuits
US6281575B1 (en) 1998-07-08 2001-08-28 Hitachi, Ltd Multi-chip module
JP2001144233A (en) * 1999-11-12 2001-05-25 Fujitsu Ltd Semiconductor unit, cooler and their manufacturing method
JP2010153934A (en) * 2010-04-07 2010-07-08 Fujitsu Ltd Semiconductor unit and cooling device, and method for manufacturing the same

Also Published As

Publication number Publication date
JPS6120146B2 (en) 1986-05-21

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