JPS5488081A - Mounting method of semiconductor device - Google Patents
Mounting method of semiconductor deviceInfo
- Publication number
- JPS5488081A JPS5488081A JP15678577A JP15678577A JPS5488081A JP S5488081 A JPS5488081 A JP S5488081A JP 15678577 A JP15678577 A JP 15678577A JP 15678577 A JP15678577 A JP 15678577A JP S5488081 A JPS5488081 A JP S5488081A
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat sink
- substrate
- melting point
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To enable the mounting to the heat sink quickly and easily, by forming the polybutadiene resin film in advance, placing it between the circuit substrate and the heat sink, and heating it to a given temperature.
CONSTITUTION: The film 4 having a given thickness is made with thermoplastic polybutadiene resin 70°C or more in melting point. If necessary, the film 4 is made by mixing metal powder or inorganic metal compound to the polybutadiene resin 40°C or more in melting point. This film 4 is placed on the heat sink 3 and the ceramic circuit substrate 2 is placed on it, inserting the film 4 between them. Further, IC chip is mounted on the substrate 2. Further, the assembly is heated to the melting point or more of the resin used and the substrate 2 is bonded to the heat sink 3, and after that it is cooled. In removing the substrate 2, by heating again the assambly to the memlting point or more, it can easily be removed, allowing to mount new circuit substrate.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15678577A JPS5488081A (en) | 1977-12-26 | 1977-12-26 | Mounting method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15678577A JPS5488081A (en) | 1977-12-26 | 1977-12-26 | Mounting method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5488081A true JPS5488081A (en) | 1979-07-12 |
Family
ID=15635248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15678577A Pending JPS5488081A (en) | 1977-12-26 | 1977-12-26 | Mounting method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5488081A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55130134A (en) * | 1979-03-30 | 1980-10-08 | Hitachi Ltd | Bonding method of semiconductor pellet |
JPS57128933A (en) * | 1981-02-02 | 1982-08-10 | Nec Corp | Semiconductor device |
-
1977
- 1977-12-26 JP JP15678577A patent/JPS5488081A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55130134A (en) * | 1979-03-30 | 1980-10-08 | Hitachi Ltd | Bonding method of semiconductor pellet |
JPS57128933A (en) * | 1981-02-02 | 1982-08-10 | Nec Corp | Semiconductor device |
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