JPS57203571A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS57203571A JPS57203571A JP8904981A JP8904981A JPS57203571A JP S57203571 A JPS57203571 A JP S57203571A JP 8904981 A JP8904981 A JP 8904981A JP 8904981 A JP8904981 A JP 8904981A JP S57203571 A JPS57203571 A JP S57203571A
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- base
- board
- substrate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE:To reduce the weight of a thermal head and to improve the heat radiating effect of the head by interposing a thermally conductive heat radiating plate between a heat resistant insulating substrate and a heat radiating base and interposing a thermoelectric insulating plate between a multilayer circuit board and the base. CONSTITUTION:A heat resistant insulating substrate 2 made of glazed alumina or the like is provided through a heat radiating plate 22 having good thermal conduction such as iron series material or the like on part of a heat radiating base 21 made of aluminum or the like, and a common electrode 4, a heating resistor 3 and an isolating electrode 5 are provided on the substrate. A multilayer circuit board 11 is provided through a thermoelectric insulating plate 23 on the other art of the base 21. A semiconductor device is provided on the board 11 or between the substrate 2 and the board 11. A coating film 8 is preferably formed on the lower surface of the device 7. A conductive pattern 24 is formed on the back surface of the board 11, and the pattern 24 is preferably electrically connected to a signal line 12 through a through hole 25.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8904981A JPS57203571A (en) | 1981-06-10 | 1981-06-10 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8904981A JPS57203571A (en) | 1981-06-10 | 1981-06-10 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57203571A true JPS57203571A (en) | 1982-12-13 |
Family
ID=13960019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8904981A Pending JPS57203571A (en) | 1981-06-10 | 1981-06-10 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57203571A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61181658A (en) * | 1985-02-07 | 1986-08-14 | Oki Electric Ind Co Ltd | Thermal head |
JPH05193170A (en) * | 1991-08-19 | 1993-08-03 | Samsung Electronics Co Ltd | Heat-sensitive recording element |
-
1981
- 1981-06-10 JP JP8904981A patent/JPS57203571A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61181658A (en) * | 1985-02-07 | 1986-08-14 | Oki Electric Ind Co Ltd | Thermal head |
JPH05193170A (en) * | 1991-08-19 | 1993-08-03 | Samsung Electronics Co Ltd | Heat-sensitive recording element |
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