JPS6415686A - Radiation detecting element - Google Patents

Radiation detecting element

Info

Publication number
JPS6415686A
JPS6415686A JP62169851A JP16985187A JPS6415686A JP S6415686 A JPS6415686 A JP S6415686A JP 62169851 A JP62169851 A JP 62169851A JP 16985187 A JP16985187 A JP 16985187A JP S6415686 A JPS6415686 A JP S6415686A
Authority
JP
Japan
Prior art keywords
layer
substrate
constitution
metal plate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62169851A
Other languages
Japanese (ja)
Inventor
Masahiko Kurakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP62169851A priority Critical patent/JPS6415686A/en
Publication of JPS6415686A publication Critical patent/JPS6415686A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Measurement Of Radiation (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

PURPOSE:To measure even a high count rate, by using a metal plate having high heat conductivity as a substrate. CONSTITUTION:A superconductive tunnel connector layer 5 is provided on a substrate 4 composed of a metal plate 3 whose surface is covered with an insulator 2. A tunnel barrier layer 8 is laminated between the first conductor layer 6 and the second conductor layer 7 to form the superconductive tunnel connector layer 5. Bonding electrodes 9, 9 are mounted to the insulating coating layer 2 of the substrate 4 and connected to the first and second conductor layers 6, 7 by bonding layers 10, 10. By this constitution, even when the phonon formed by the incidence of radiation becomes heat, the heat can be escaped and even a high count rate can be measured because of reduced temp. rising.
JP62169851A 1987-07-09 1987-07-09 Radiation detecting element Pending JPS6415686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62169851A JPS6415686A (en) 1987-07-09 1987-07-09 Radiation detecting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62169851A JPS6415686A (en) 1987-07-09 1987-07-09 Radiation detecting element

Publications (1)

Publication Number Publication Date
JPS6415686A true JPS6415686A (en) 1989-01-19

Family

ID=15894112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62169851A Pending JPS6415686A (en) 1987-07-09 1987-07-09 Radiation detecting element

Country Status (1)

Country Link
JP (1) JPS6415686A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002357660A (en) * 2001-05-31 2002-12-13 Seiko Instruments Inc Calorie meter
JP2004061212A (en) * 2002-07-26 2004-02-26 Masahiko Kurakado Superconductor radiation sensor system
JP2009168827A (en) * 2009-05-01 2009-07-30 Masahiko Kurakado Superconductor radiation sensor system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002357660A (en) * 2001-05-31 2002-12-13 Seiko Instruments Inc Calorie meter
JP2004061212A (en) * 2002-07-26 2004-02-26 Masahiko Kurakado Superconductor radiation sensor system
JP2009168827A (en) * 2009-05-01 2009-07-30 Masahiko Kurakado Superconductor radiation sensor system

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