JPS57202763A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS57202763A
JPS57202763A JP56087572A JP8757281A JPS57202763A JP S57202763 A JPS57202763 A JP S57202763A JP 56087572 A JP56087572 A JP 56087572A JP 8757281 A JP8757281 A JP 8757281A JP S57202763 A JPS57202763 A JP S57202763A
Authority
JP
Japan
Prior art keywords
bedplate
parts
circuit
buried
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56087572A
Other languages
Japanese (ja)
Other versions
JPS623984B2 (en
Inventor
Masao Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56087572A priority Critical patent/JPS57202763A/en
Publication of JPS57202763A publication Critical patent/JPS57202763A/en
Publication of JPS623984B2 publication Critical patent/JPS623984B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance heat radiability, airtightness and ability for maintenance of an electronic device, and to obtain the device favorable for mounting on an automobile, etc., by a method wherein a thin plate body is provided being adhered closely on a bedplate having heat radiating fins, circuit parts are mounted thereon, and a cap body is provided removably on the bedplate covering the circuit component parts. CONSTITUTION:The thin plate body 22 constituted of an insulating layer of glass ceramics, etc., and conducting layers of circuit pattern, etc., is provided being adhered closely on the bedplate 21 formed with a material of molybdenum or Kovar, etc., having the thermal expansion coefficient being nearly the same with ceramics, and having heat radiating fins 211 on the back. Then the circuit parts 26 of the prescribed number of pieces are fixed thereon, and connectors 25 are buried in an opening provided in the bedplate 21 to be connected to the parts 26 using connecting conductors 28. After then, the cap body 23 is put thereon covering the parts thereof, and the circumferential flange part is equipped to be fixed to the bedplate 21 using fitting screws 27. Moreover at this time, an O-ring 24 is buried in the bedplate 21 being positioned on the lower face of the flange part.
JP56087572A 1981-06-09 1981-06-09 Electronic device Granted JPS57202763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56087572A JPS57202763A (en) 1981-06-09 1981-06-09 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56087572A JPS57202763A (en) 1981-06-09 1981-06-09 Electronic device

Publications (2)

Publication Number Publication Date
JPS57202763A true JPS57202763A (en) 1982-12-11
JPS623984B2 JPS623984B2 (en) 1987-01-28

Family

ID=13918707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56087572A Granted JPS57202763A (en) 1981-06-09 1981-06-09 Electronic device

Country Status (1)

Country Link
JP (1) JPS57202763A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016067659A1 (en) * 2014-10-29 2016-05-06 新電元工業株式会社 Heat-dissipating structure

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63235685A (en) * 1987-03-23 1988-09-30 Keibunshiya Seisakusho:Kk Vane type vacuum pump
JPH0291492A (en) * 1988-09-28 1990-03-30 Aisin Seiki Co Ltd Displacement supercharger
JPH0424687U (en) * 1990-06-22 1992-02-27

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016067659A1 (en) * 2014-10-29 2016-05-06 新電元工業株式会社 Heat-dissipating structure
JP6021290B2 (en) * 2014-10-29 2016-11-09 新電元工業株式会社 Heat dissipation structure
US10159166B2 (en) 2014-10-29 2018-12-18 Shindengen Electric Manufacturing Co., Ltd. Heat dissipating structure

Also Published As

Publication number Publication date
JPS623984B2 (en) 1987-01-28

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