JPS6456595A - Manufacture of ic card - Google Patents

Manufacture of ic card

Info

Publication number
JPS6456595A
JPS6456595A JP62214222A JP21422287A JPS6456595A JP S6456595 A JPS6456595 A JP S6456595A JP 62214222 A JP62214222 A JP 62214222A JP 21422287 A JP21422287 A JP 21422287A JP S6456595 A JPS6456595 A JP S6456595A
Authority
JP
Japan
Prior art keywords
card
card substrate
mounting
substrate
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62214222A
Other languages
Japanese (ja)
Other versions
JP2711664B2 (en
Inventor
Tomoyuki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP62214222A priority Critical patent/JP2711664B2/en
Publication of JPS6456595A publication Critical patent/JPS6456595A/en
Application granted granted Critical
Publication of JP2711664B2 publication Critical patent/JP2711664B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE: To prevent IC device from falling off and to enable its manufacture in a simplified process by directly mounting IC device on the mounting portion formed on the card substrate itself. CONSTITUTION: IC card substrate 1 formed with IC device mounting hollow 1a is fabricated with injection mold of PES resin 9 under temperature conditions of metal molds 6 and 7 at 150 deg.C and cylinder 8 at 370 deg.C. Then through holes are drilled, followed by preparation of electrode terminal 3 on the front surface of the card substrate 1 and conducting circuit 2 on the back face using semi- additive system. Further, 1C device 4 is dye-bonded and wire-bonded on the IC mounting hollow la of the IC card substrate 1. Then the IC mounting hollow 1a is sealed with epoxy resin and printed labels 5 are stuck on both sides of the card substrate 1 to produce the IC card monolithic with the substrate. Obtained with this procedure is the IC card with good bending characteristics and excellent heat resistance.
JP62214222A 1987-08-28 1987-08-28 IC card manufacturing method Expired - Fee Related JP2711664B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62214222A JP2711664B2 (en) 1987-08-28 1987-08-28 IC card manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214222A JP2711664B2 (en) 1987-08-28 1987-08-28 IC card manufacturing method

Publications (2)

Publication Number Publication Date
JPS6456595A true JPS6456595A (en) 1989-03-03
JP2711664B2 JP2711664B2 (en) 1998-02-10

Family

ID=16652227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214222A Expired - Fee Related JP2711664B2 (en) 1987-08-28 1987-08-28 IC card manufacturing method

Country Status (1)

Country Link
JP (1) JP2711664B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067971U (en) * 1992-07-10 1994-02-01 オムロン株式会社 Electronic card
JP2002244563A (en) * 2001-02-22 2002-08-30 Toppan Forms Co Ltd Label to be stuck on card
WO2008143043A1 (en) * 2007-05-14 2008-11-27 Tateyama Kagaku Industry Co., Ltd. Wireless ic tag and method for manufacturing wireless ic tag

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133489A (en) * 1984-12-03 1986-06-20 Mitsubishi Plastics Ind Ltd Memory card
JPS6295295A (en) * 1985-10-23 1987-05-01 松下電器産業株式会社 Integrated circuit card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133489A (en) * 1984-12-03 1986-06-20 Mitsubishi Plastics Ind Ltd Memory card
JPS6295295A (en) * 1985-10-23 1987-05-01 松下電器産業株式会社 Integrated circuit card

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067971U (en) * 1992-07-10 1994-02-01 オムロン株式会社 Electronic card
JP2002244563A (en) * 2001-02-22 2002-08-30 Toppan Forms Co Ltd Label to be stuck on card
WO2008143043A1 (en) * 2007-05-14 2008-11-27 Tateyama Kagaku Industry Co., Ltd. Wireless ic tag and method for manufacturing wireless ic tag
US9053402B2 (en) 2007-05-14 2015-06-09 Tateyama Kagaku Industry Co., Ltd. Wireless IC tag and method for manufacturing wireless IC tag

Also Published As

Publication number Publication date
JP2711664B2 (en) 1998-02-10

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