JPS6456595A - Manufacture of ic card - Google Patents
Manufacture of ic cardInfo
- Publication number
- JPS6456595A JPS6456595A JP62214222A JP21422287A JPS6456595A JP S6456595 A JPS6456595 A JP S6456595A JP 62214222 A JP62214222 A JP 62214222A JP 21422287 A JP21422287 A JP 21422287A JP S6456595 A JPS6456595 A JP S6456595A
- Authority
- JP
- Japan
- Prior art keywords
- card
- card substrate
- mounting
- substrate
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
PURPOSE: To prevent IC device from falling off and to enable its manufacture in a simplified process by directly mounting IC device on the mounting portion formed on the card substrate itself. CONSTITUTION: IC card substrate 1 formed with IC device mounting hollow 1a is fabricated with injection mold of PES resin 9 under temperature conditions of metal molds 6 and 7 at 150 deg.C and cylinder 8 at 370 deg.C. Then through holes are drilled, followed by preparation of electrode terminal 3 on the front surface of the card substrate 1 and conducting circuit 2 on the back face using semi- additive system. Further, 1C device 4 is dye-bonded and wire-bonded on the IC mounting hollow la of the IC card substrate 1. Then the IC mounting hollow 1a is sealed with epoxy resin and printed labels 5 are stuck on both sides of the card substrate 1 to produce the IC card monolithic with the substrate. Obtained with this procedure is the IC card with good bending characteristics and excellent heat resistance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62214222A JP2711664B2 (en) | 1987-08-28 | 1987-08-28 | IC card manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62214222A JP2711664B2 (en) | 1987-08-28 | 1987-08-28 | IC card manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6456595A true JPS6456595A (en) | 1989-03-03 |
JP2711664B2 JP2711664B2 (en) | 1998-02-10 |
Family
ID=16652227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62214222A Expired - Fee Related JP2711664B2 (en) | 1987-08-28 | 1987-08-28 | IC card manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2711664B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH067971U (en) * | 1992-07-10 | 1994-02-01 | オムロン株式会社 | Electronic card |
JP2002244563A (en) * | 2001-02-22 | 2002-08-30 | Toppan Forms Co Ltd | Label to be stuck on card |
WO2008143043A1 (en) * | 2007-05-14 | 2008-11-27 | Tateyama Kagaku Industry Co., Ltd. | Wireless ic tag and method for manufacturing wireless ic tag |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61133489A (en) * | 1984-12-03 | 1986-06-20 | Mitsubishi Plastics Ind Ltd | Memory card |
JPS6295295A (en) * | 1985-10-23 | 1987-05-01 | 松下電器産業株式会社 | Integrated circuit card |
-
1987
- 1987-08-28 JP JP62214222A patent/JP2711664B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61133489A (en) * | 1984-12-03 | 1986-06-20 | Mitsubishi Plastics Ind Ltd | Memory card |
JPS6295295A (en) * | 1985-10-23 | 1987-05-01 | 松下電器産業株式会社 | Integrated circuit card |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH067971U (en) * | 1992-07-10 | 1994-02-01 | オムロン株式会社 | Electronic card |
JP2002244563A (en) * | 2001-02-22 | 2002-08-30 | Toppan Forms Co Ltd | Label to be stuck on card |
WO2008143043A1 (en) * | 2007-05-14 | 2008-11-27 | Tateyama Kagaku Industry Co., Ltd. | Wireless ic tag and method for manufacturing wireless ic tag |
US9053402B2 (en) | 2007-05-14 | 2015-06-09 | Tateyama Kagaku Industry Co., Ltd. | Wireless IC tag and method for manufacturing wireless IC tag |
Also Published As
Publication number | Publication date |
---|---|
JP2711664B2 (en) | 1998-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |