JPS6456596A - Manufacture of ic card - Google Patents

Manufacture of ic card

Info

Publication number
JPS6456596A
JPS6456596A JP62214223A JP21422387A JPS6456596A JP S6456596 A JPS6456596 A JP S6456596A JP 62214223 A JP62214223 A JP 62214223A JP 21422387 A JP21422387 A JP 21422387A JP S6456596 A JPS6456596 A JP S6456596A
Authority
JP
Japan
Prior art keywords
mounting
card
hollow
mounting hollow
injection molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62214223A
Other languages
Japanese (ja)
Other versions
JP2589093B2 (en
Inventor
Tomoyuki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP62214223A priority Critical patent/JP2589093B2/en
Publication of JPS6456596A publication Critical patent/JPS6456596A/en
Application granted granted Critical
Publication of JP2589093B2 publication Critical patent/JP2589093B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent IC device from falling off and to enable its manufacture in a simplified process by inserting electrode terminals and conducing circuit into metal molds for wiring at injection molding and mounting IC device directly on its mounting portion. CONSTITUTION: Provided on metal mold 6 is projection 6a that corresponds to IC device mounting hollow 1a. Under temperature conditions of these metal molds 6 and 7 at 150 deg.C and cylinder 8 at 390 deg.C, PPS resin 9 is subject to injection molding, and IC card substrate 1 formed with IC mounting hollow 1a is fabricated. Concurrently wired in this occasion are electrode terminals 3 and conducting circuit 2. Then IC device 4 is mounted on the IC mounting hollow 1a by dye bonding and wire bonding. After this, the IC mounting hollow 1a is sealed with epoxy resin and label 5 is stuck to produce the IC card monolithic with the substrate. Thus IC cards with good bending characteristics and excellent heat resistance can be produced because IC module has not been used.
JP62214223A 1987-08-28 1987-08-28 IC card manufacturing method Expired - Lifetime JP2589093B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62214223A JP2589093B2 (en) 1987-08-28 1987-08-28 IC card manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214223A JP2589093B2 (en) 1987-08-28 1987-08-28 IC card manufacturing method

Publications (2)

Publication Number Publication Date
JPS6456596A true JPS6456596A (en) 1989-03-03
JP2589093B2 JP2589093B2 (en) 1997-03-12

Family

ID=16652241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214223A Expired - Lifetime JP2589093B2 (en) 1987-08-28 1987-08-28 IC card manufacturing method

Country Status (1)

Country Link
JP (1) JP2589093B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323481U (en) * 1989-07-11 1991-03-12
JP2006236206A (en) * 2005-02-28 2006-09-07 Power Digital Card Co Ltd Method for manufacturing memory card
WO2007102360A1 (en) * 2006-03-06 2007-09-13 Mitsubishi Electric Corporation Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag
JP2007265187A (en) * 2006-03-29 2007-10-11 Sony Corp Memory card

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323481U (en) * 1989-07-11 1991-03-12
JP2006236206A (en) * 2005-02-28 2006-09-07 Power Digital Card Co Ltd Method for manufacturing memory card
WO2007102360A1 (en) * 2006-03-06 2007-09-13 Mitsubishi Electric Corporation Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag
US8368512B2 (en) 2006-03-06 2013-02-05 Mitsubishi Electric Corporation RFID tag, method of manufacturing the RFID tag, and method of mounting the RFID tag
JP2007265187A (en) * 2006-03-29 2007-10-11 Sony Corp Memory card

Also Published As

Publication number Publication date
JP2589093B2 (en) 1997-03-12

Similar Documents

Publication Publication Date Title
FR2639763B1 (en) METHOD FOR PRODUCING AN ELECTRONIC MODULE AND ELECTRONIC MODULE AS OBTAINED BY THIS PROCESS
JPS6436496A (en) Carrier element incorporated into identification card
EP0390996A3 (en) Ic card module
NO178089C (en) Method of manufacturing an electronic memory card
US3444440A (en) Multiple lead semiconductor device with plastic encapsulation supporting such leads and associated elements
KR910017210A (en) Optical module and its manufacturing process
KR910019186A (en) Semiconductor device, manufacturing method thereof and molding apparatus used therein
EP1119037A3 (en) Semiconductor device and method of manufacturing thereof
EP0651440B1 (en) High reliable power package for an electronic semiconductor circuit
JPS6456596A (en) Manufacture of ic card
JPS6455291A (en) Integrated circuit device
JPS57159032A (en) Forming method for package of electronic timepiece
JPS5469068A (en) Semiconductor device and its manufacture
JP2596995B2 (en) Method for manufacturing semiconductor device
JPH0526764Y2 (en)
JPS6482994A (en) Ic card
CH641626B (en) METHOD OF MANUFACTURING ELECTRONIC CLOCK MODULES.
JPH03132046A (en) Manufacture of semiconductor device
JPS55138845A (en) Method of fabricating semiconductor device
JPS6431448A (en) Lead frame and manufacture thereof
JPS5791571A (en) Manufacture of light module
ATE49680T1 (en) PROCESS FOR MAKING AN ENCAPSULATED IC PLATE.
JPS5745964A (en) Manufacture of hybrid integrated circuit
JPS6457631A (en) Tape carrier tape and manufacture thereof
JPH02230761A (en) Lead frame and semiconductor device utilizing the same