JPS6457631A - Tape carrier tape and manufacture thereof - Google Patents
Tape carrier tape and manufacture thereofInfo
- Publication number
- JPS6457631A JPS6457631A JP62212923A JP21292387A JPS6457631A JP S6457631 A JPS6457631 A JP S6457631A JP 62212923 A JP62212923 A JP 62212923A JP 21292387 A JP21292387 A JP 21292387A JP S6457631 A JPS6457631 A JP S6457631A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- heat
- device hole
- resistant tape
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
PURPOSE:To eliminate etching process, plating process and the like, and obtain a device excellent in yield, cost and reliability, by providing a heat-resistant tape having a device hole, and leads formed of conductive resin paste which protrude from above the heat-resistant tape into the device hole. CONSTITUTION:The title device is provided with a heat-resistant tape 21 having a device hole 21a whose dimension corresponds with the chip size, and leads 23 which is formed of conductive resin paste and arranged so as to protrude from the above the heat-resistant tape 21 into the device hole 21a aiming at its central part. A tape carrier tape is manufactured as follows. On the heat- resistant tape 21, a device hole 21a whose dimension corresponds with the chip size is formed, and stopped up with conductive resin paste. A semicured type conductive resin paste layer 22 having lead parts 22a extending in the form of a line on also the heat-resistant tape 21 is formed. Leads 23 which protrude from the lead part 22a into the device hole 21a aiming at its central part are formed from the above conductive paste layer 22.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62212923A JPS6457631A (en) | 1987-08-28 | 1987-08-28 | Tape carrier tape and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62212923A JPS6457631A (en) | 1987-08-28 | 1987-08-28 | Tape carrier tape and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457631A true JPS6457631A (en) | 1989-03-03 |
Family
ID=16630525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62212923A Pending JPS6457631A (en) | 1987-08-28 | 1987-08-28 | Tape carrier tape and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457631A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003017371A (en) * | 2001-06-29 | 2003-01-17 | Nippon Chemicon Corp | Sealing structure of capacitor |
-
1987
- 1987-08-28 JP JP62212923A patent/JPS6457631A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003017371A (en) * | 2001-06-29 | 2003-01-17 | Nippon Chemicon Corp | Sealing structure of capacitor |
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