JPS5571052A - Substrate for semiconductor device - Google Patents

Substrate for semiconductor device

Info

Publication number
JPS5571052A
JPS5571052A JP14591378A JP14591378A JPS5571052A JP S5571052 A JPS5571052 A JP S5571052A JP 14591378 A JP14591378 A JP 14591378A JP 14591378 A JP14591378 A JP 14591378A JP S5571052 A JPS5571052 A JP S5571052A
Authority
JP
Japan
Prior art keywords
conductor
cut
semiconductor device
substrate
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14591378A
Other languages
Japanese (ja)
Other versions
JPS5929146B2 (en
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP53145913A priority Critical patent/JPS5929146B2/en
Publication of JPS5571052A publication Critical patent/JPS5571052A/en
Publication of JPS5929146B2 publication Critical patent/JPS5929146B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve strength and miniaturize by forming a bridging portion of the hole of a conductor strip thick locally in a substrate for semiconductor device in insulating film having a conductor strip pattern.
CONSTITUTION: A metallic layer 4 like nickel is formed thick on a portion of a conductor ground 2a on an insulating film 1, i.e. the conductor ground 2a at cut portions 3a, 3b. A plated layer 2b like gold is formed on a central hole 1b of the conductor ground 2a so that the thickness is given at t small enough as compared with that of t'. IC, LSI chip are junctioned to the tip of a conductor strip 5 on the portion of central hole 1b, the portion is covered with resin, cut at portions 3a, 3b, and the cut portion is used for external input/output lead.
COPYRIGHT: (C)1980,JPO&Japio
JP53145913A 1978-11-22 1978-11-22 Method for manufacturing substrates for semiconductor devices Expired JPS5929146B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53145913A JPS5929146B2 (en) 1978-11-22 1978-11-22 Method for manufacturing substrates for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53145913A JPS5929146B2 (en) 1978-11-22 1978-11-22 Method for manufacturing substrates for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5571052A true JPS5571052A (en) 1980-05-28
JPS5929146B2 JPS5929146B2 (en) 1984-07-18

Family

ID=15395962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53145913A Expired JPS5929146B2 (en) 1978-11-22 1978-11-22 Method for manufacturing substrates for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5929146B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9752695B2 (en) 2013-08-09 2017-09-05 Kautex Textron Gmbh & Co. Kg Operating fluid reservoir having an integrated venting and/or air admission valve

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196115A (en) * 1984-03-16 1985-10-04 ヤンマー農機株式会社 Threshing apparatus
JPS60177748U (en) * 1984-05-07 1985-11-26 株式会社　山本製作所 Culm release device in threshing machine
JPS6181726A (en) * 1984-09-28 1986-04-25 三菱農機株式会社 Threshing machine
JPH0438676Y2 (en) * 1985-01-19 1992-09-10
JPS624933U (en) * 1985-06-26 1987-01-13
JPS6217839U (en) * 1985-07-18 1987-02-03
JPS6274538U (en) * 1985-10-29 1987-05-13
JPH0538601Y2 (en) * 1985-10-30 1993-09-29
JPH0538594Y2 (en) * 1985-11-18 1993-09-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9752695B2 (en) 2013-08-09 2017-09-05 Kautex Textron Gmbh & Co. Kg Operating fluid reservoir having an integrated venting and/or air admission valve
US10690257B2 (en) 2013-08-09 2020-06-23 Kautex Textron Gmbh & Co. Kg Operating fluid reservoir having an integrated venting and/or air admission valve

Also Published As

Publication number Publication date
JPS5929146B2 (en) 1984-07-18

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