JPS5526612A - Manufacturing of carrier tape useful for ic - Google Patents
Manufacturing of carrier tape useful for icInfo
- Publication number
- JPS5526612A JPS5526612A JP9853078A JP9853078A JPS5526612A JP S5526612 A JPS5526612 A JP S5526612A JP 9853078 A JP9853078 A JP 9853078A JP 9853078 A JP9853078 A JP 9853078A JP S5526612 A JPS5526612 A JP S5526612A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- bump
- areas
- bonded
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To provide a novel carrier tapes in which one surface of a film base is press-bonded with a piece of conductor foil; bump-forming areas on the back surface of the foil and circuit pattern-forming areas on the upper surface of the foil are covered with resist; exposed areas common to both surfaces are ethed off; covered areas on the upper surface are half etched; and bumps and fingers are integrally formed.
CONSTITUTION: Near the middle of a film base 1 lengthwise is provided an open space of a predetermined length, over which a piece of copper foil 5 is press-bonded. The upper and back surfaces of foil 5 are treated to be free of irregularities, and provided with resist layers 7, 8. An inside lead pattern on layer 7 and a bump- forming area constituting the end of each inside lead on layer 8 are sticked, followed by development, resulting in allowing resists to remain as circuit pattern 9 on the upper surface of foil 5 and as bump-forming area 10 on the back surface. Etching is applied to both the upper and back surfaces to a depth enough for bump formation. Lastly all remaining resists are peeled off. The resultant composite is gold-plated to finish a finger-and-bump integrated carrier tape having excellent electrical and mechanical properties and which is convenient for handling.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9853078A JPS5526612A (en) | 1978-08-11 | 1978-08-11 | Manufacturing of carrier tape useful for ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9853078A JPS5526612A (en) | 1978-08-11 | 1978-08-11 | Manufacturing of carrier tape useful for ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5526612A true JPS5526612A (en) | 1980-02-26 |
Family
ID=14222224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9853078A Pending JPS5526612A (en) | 1978-08-11 | 1978-08-11 | Manufacturing of carrier tape useful for ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5526612A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59115649U (en) * | 1983-01-25 | 1984-08-04 | 九州日本電気株式会社 | Semiconductor substrate replacement equipment |
| US4701363A (en) * | 1986-01-27 | 1987-10-20 | Olin Corporation | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
-
1978
- 1978-08-11 JP JP9853078A patent/JPS5526612A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59115649U (en) * | 1983-01-25 | 1984-08-04 | 九州日本電気株式会社 | Semiconductor substrate replacement equipment |
| JPS635229Y2 (en) * | 1983-01-25 | 1988-02-12 | ||
| US4701363A (en) * | 1986-01-27 | 1987-10-20 | Olin Corporation | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
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