JPS5526613A - Manufacturing of carrier tape useful for ic - Google Patents
Manufacturing of carrier tape useful for icInfo
- Publication number
- JPS5526613A JPS5526613A JP9853178A JP9853178A JPS5526613A JP S5526613 A JPS5526613 A JP S5526613A JP 9853178 A JP9853178 A JP 9853178A JP 9853178 A JP9853178 A JP 9853178A JP S5526613 A JPS5526613 A JP S5526613A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- bump
- areas
- area
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To provide a novel carrier tape in which the conductor pattern-forming areas and foil-preserving areas on the upper surface of a conductor foil and the bump-forming areas and foil-preserving areas on the back surface of the same conductor foil are covered with resist; only the upper surface is etched to half depth, while exposed areas are etched off, so that bumps are intergrally formed on the side opposite to the patterns.
CONSTITUTION: Conductor foil tape 1 is coated with photoresist 3. Patterns are sticked on the coated surface, followed by development. From the upper surface of foil 1, resist 4 corresponding to the area where the pattern would not be formed within a device hole is removed, while from the back surface of foil 1, resist 5 corresponding to the area where the bump would not be formed within the device hole is removed. Then both the upper and the back of the tape are subjected to suimultaneous ething, producing an ethed area 8 having a thickness necessary for the formation of bumps. Thus a bump-forming area 6 and the exterion of the device hole 9 have the same thickness as foil 1. All resists remaining unremoved are then peeled off. The resultant composite is tin-plated to finish a film-less and bump- provided IC carrier tape, which, having no organic films to cover but having excellent electrical and mechanical properties, is highly resistant to heat.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9853178A JPS5526613A (en) | 1978-08-11 | 1978-08-11 | Manufacturing of carrier tape useful for ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9853178A JPS5526613A (en) | 1978-08-11 | 1978-08-11 | Manufacturing of carrier tape useful for ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5526613A true JPS5526613A (en) | 1980-02-26 |
Family
ID=14222252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9853178A Pending JPS5526613A (en) | 1978-08-11 | 1978-08-11 | Manufacturing of carrier tape useful for ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5526613A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4701363A (en) * | 1986-01-27 | 1987-10-20 | Olin Corporation | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
| US4735678A (en) * | 1987-04-13 | 1988-04-05 | Olin Corporation | Forming a circuit pattern in a metallic tape by electrical discharge machining |
| US5786239A (en) * | 1995-09-20 | 1998-07-28 | Sony Corporation | Method of manufacturing a semiconductor package |
| US6077727A (en) * | 1996-01-31 | 2000-06-20 | Sony Corporation | Method for manufacturing lead frame |
-
1978
- 1978-08-11 JP JP9853178A patent/JPS5526613A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4701363A (en) * | 1986-01-27 | 1987-10-20 | Olin Corporation | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
| US4735678A (en) * | 1987-04-13 | 1988-04-05 | Olin Corporation | Forming a circuit pattern in a metallic tape by electrical discharge machining |
| US5786239A (en) * | 1995-09-20 | 1998-07-28 | Sony Corporation | Method of manufacturing a semiconductor package |
| US6077727A (en) * | 1996-01-31 | 2000-06-20 | Sony Corporation | Method for manufacturing lead frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES483987A1 (en) | Fabrication of integrated circuits utilizing thick high-resolution patterns | |
| EP0304077A3 (en) | Method of forming a fine pattern | |
| JPS5526613A (en) | Manufacturing of carrier tape useful for ic | |
| JPS52142740A (en) | Method of formation of shaped pattern using paper pattern having air-permeable formed layer | |
| JPS5526612A (en) | Manufacturing of carrier tape useful for ic | |
| JPS5374392A (en) | Multi-layer coat formation method | |
| JPS5618446A (en) | Formation of spherical salient electrode | |
| JPS52124884A (en) | Production of semiconductor device | |
| JPS568834A (en) | Manufacture of projection for substrate conductor layer | |
| JPS5384693A (en) | Production of semiconductor device | |
| JPS54158183A (en) | Manufacture of semiconductor device | |
| JPS53142337A (en) | Manufacture of copper through hole plate | |
| JPS5516553A (en) | Maunfacture of small and plane-shaped coil | |
| JPS54113277A (en) | Production of semiconductor device | |
| JPS54135627A (en) | Metal face decorated plate | |
| JPS53124993A (en) | Production of semiconductor device | |
| JPS5386165A (en) | Production of semiconductor device | |
| JPS54134036A (en) | Manufacture of perforated plated product | |
| ES2006071A6 (en) | Cladding of substrates with thick metal circuit patterns | |
| JPS5291193A (en) | Forming method of conductor pattern | |
| JPS53119228A (en) | Production of perforated plated metal foil | |
| JPS5614101A (en) | Pattern checking method | |
| JPS6480097A (en) | Manufacture of printed wiring board | |
| JPS5430782A (en) | Forming method of pattern | |
| JPS544575A (en) | Production of semiconductor devices |