JPS53142337A - Manufacture of copper through hole plate - Google Patents
Manufacture of copper through hole plateInfo
- Publication number
- JPS53142337A JPS53142337A JP5706577A JP5706577A JPS53142337A JP S53142337 A JPS53142337 A JP S53142337A JP 5706577 A JP5706577 A JP 5706577A JP 5706577 A JP5706577 A JP 5706577A JP S53142337 A JPS53142337 A JP S53142337A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- manufacture
- hole plate
- plating
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE: To form a precise pattern by making through holes in a copper-lined laminated substrate;carrying out through hole plating;plating;and coating a liquid resist and a dry film resist on appropriate portions, followed by etching.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5706577A JPS53142337A (en) | 1977-05-19 | 1977-05-19 | Manufacture of copper through hole plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5706577A JPS53142337A (en) | 1977-05-19 | 1977-05-19 | Manufacture of copper through hole plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53142337A true JPS53142337A (en) | 1978-12-12 |
Family
ID=13045033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5706577A Pending JPS53142337A (en) | 1977-05-19 | 1977-05-19 | Manufacture of copper through hole plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53142337A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4487828A (en) * | 1983-06-03 | 1984-12-11 | At&T Technologies, Inc. | Method of manufacturing printed circuit boards |
-
1977
- 1977-05-19 JP JP5706577A patent/JPS53142337A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4487828A (en) * | 1983-06-03 | 1984-12-11 | At&T Technologies, Inc. | Method of manufacturing printed circuit boards |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57102366A (en) | Ink jet head | |
JPS53142337A (en) | Manufacture of copper through hole plate | |
JPS5484932A (en) | Forming method of multi-layer construction | |
JPS53119228A (en) | Production of perforated plated metal foil | |
JPS5526613A (en) | Manufacturing of carrier tape useful for ic | |
JPS5376757A (en) | Photoetching method | |
JPS6481296A (en) | Manufacture of printed-circuit board | |
JPS5387668A (en) | Forming method of patterns | |
EP0261301A3 (en) | Process for the preparation of circuit-printed board having plated through-hole | |
JPS5394771A (en) | Forming method for thin film pattern | |
JPS5318966A (en) | Production of semiconductor integrated circuit | |
JPS5429975A (en) | Photo mask | |
GB1455854A (en) | Methods of manufacturing printed circuit boards | |
JPS5421272A (en) | Metal photo mask | |
JPS5453641A (en) | Production of mesh product having very fine mesh portion and spacer portion | |
JPS5349946A (en) | Formation of swelled electrode | |
JPS53126879A (en) | Formation mathod of electrode wiring layer | |
JPS5446138A (en) | Production of multilayer printed plate | |
JPS54134036A (en) | Manufacture of perforated plated product | |
JPS52146564A (en) | Production of extra-high-frequency integrated circuit substrates | |
JPS54135627A (en) | Metal face decorated plate | |
JPS53126267A (en) | Production of carrier tape | |
JPS545659A (en) | Manufacture of semiconductor device | |
JPS53128279A (en) | Production of semiconductor device | |
JPS6462491A (en) | Formation of metallic pattern |