JPS5446138A - Production of multilayer printed plate - Google Patents

Production of multilayer printed plate

Info

Publication number
JPS5446138A
JPS5446138A JP11221977A JP11221977A JPS5446138A JP S5446138 A JPS5446138 A JP S5446138A JP 11221977 A JP11221977 A JP 11221977A JP 11221977 A JP11221977 A JP 11221977A JP S5446138 A JPS5446138 A JP S5446138A
Authority
JP
Japan
Prior art keywords
plate
copper foil
copper
film
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11221977A
Other languages
Japanese (ja)
Inventor
Shinji Umemoto
Michio Yokozawa
Kenji Yamamoto
Kiyoshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11221977A priority Critical patent/JPS5446138A/en
Publication of JPS5446138A publication Critical patent/JPS5446138A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To easily obtain a rand portion of a prescribed size and produce a superior multilayer printed plate by carrying out total copper plating of a copper lined, laminated plate, including through holes, formed by covering the surface copper foil layers with easily detachable metal thin films and then removing the plated layers on the thin films together with the films. CONSTITUTION:Both the sides of a usual copper lined plate consisting of copper foil 3, laminated base material 2 and copper foil 3 are covered with metal thin films 9 such as copper foil to form copper lined, laminated plate 1 used as a printed plate substrate. A necessary no. of through holes are made in plate 1 by drilling and total copper plating 5 is carried out. Next an edge tool is slid along detachable bond face 10 of each film 9 to scrape film 9 and plated layer 11 on film 9, and plated layer 12 alone inside each through hole 4 is left. A photoresist layer is sticked to the surface copper foil and a printed circuit is exposed. Thereafter, dry film 13 is attached and etching is carried out to simultaneously form a printed circuit, plated through holes and rand portion 6.
JP11221977A 1977-09-20 1977-09-20 Production of multilayer printed plate Pending JPS5446138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11221977A JPS5446138A (en) 1977-09-20 1977-09-20 Production of multilayer printed plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11221977A JPS5446138A (en) 1977-09-20 1977-09-20 Production of multilayer printed plate

Publications (1)

Publication Number Publication Date
JPS5446138A true JPS5446138A (en) 1979-04-11

Family

ID=14581224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11221977A Pending JPS5446138A (en) 1977-09-20 1977-09-20 Production of multilayer printed plate

Country Status (1)

Country Link
JP (1) JPS5446138A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015005644A (en) * 2013-06-21 2015-01-08 凸版印刷株式会社 Production method of coreless wiring board, jig and peeling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015005644A (en) * 2013-06-21 2015-01-08 凸版印刷株式会社 Production method of coreless wiring board, jig and peeling device

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