JPS6484697A - Manufacture of multilayer circuit board - Google Patents

Manufacture of multilayer circuit board

Info

Publication number
JPS6484697A
JPS6484697A JP62242045A JP24204587A JPS6484697A JP S6484697 A JPS6484697 A JP S6484697A JP 62242045 A JP62242045 A JP 62242045A JP 24204587 A JP24204587 A JP 24204587A JP S6484697 A JPS6484697 A JP S6484697A
Authority
JP
Japan
Prior art keywords
circuit pattern
circuit board
semiconductor packaging
outermost
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62242045A
Other languages
Japanese (ja)
Other versions
JPH0719969B2 (en
Inventor
Takeshi Kano
Toru Higuchi
Muneisa Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62242045A priority Critical patent/JPH0719969B2/en
Publication of JPS6484697A publication Critical patent/JPS6484697A/en
Publication of JPH0719969B2 publication Critical patent/JPH0719969B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To improve positioning accuracy of an interlayer circuit pattern by laminating a circuit board which has a through section so that a surface where on a circuit pattern is not formed yet will be an outermost surface and by forming a through hole and an outermost layer circuit pattern. CONSTITUTION:An etching resist layer 3 is formed on a circuit pattern area 1a where a semiconductor packaging matrix circuit board 2 which is provided with a semiconductor packaging circuit pattern 1 exposes at least. A circuit board 5 which has a through section 4 is laminated in one-piece construction on a semiconductor packaging circuit pattern formation surface 2a of the board 2 so that a formation surface 5a is the outermost surface. After a through hole 6 and an outermost layer circuit pattern 7 are formed, the etching resist layer 3 is eliminated. The positioning accuracy of an interlayer circuit pattern is thereby improved.
JP62242045A 1987-09-26 1987-09-26 Method for manufacturing multilayer circuit board Expired - Lifetime JPH0719969B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242045A JPH0719969B2 (en) 1987-09-26 1987-09-26 Method for manufacturing multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242045A JPH0719969B2 (en) 1987-09-26 1987-09-26 Method for manufacturing multilayer circuit board

Publications (2)

Publication Number Publication Date
JPS6484697A true JPS6484697A (en) 1989-03-29
JPH0719969B2 JPH0719969B2 (en) 1995-03-06

Family

ID=17083448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242045A Expired - Lifetime JPH0719969B2 (en) 1987-09-26 1987-09-26 Method for manufacturing multilayer circuit board

Country Status (1)

Country Link
JP (1) JPH0719969B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093493A (en) * 2004-09-27 2006-04-06 Cmk Corp Printed wiring board with built-in part and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093493A (en) * 2004-09-27 2006-04-06 Cmk Corp Printed wiring board with built-in part and method of manufacturing the same

Also Published As

Publication number Publication date
JPH0719969B2 (en) 1995-03-06

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