JPS6484697A - Manufacture of multilayer circuit board - Google Patents
Manufacture of multilayer circuit boardInfo
- Publication number
- JPS6484697A JPS6484697A JP62242045A JP24204587A JPS6484697A JP S6484697 A JPS6484697 A JP S6484697A JP 62242045 A JP62242045 A JP 62242045A JP 24204587 A JP24204587 A JP 24204587A JP S6484697 A JPS6484697 A JP S6484697A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- circuit board
- semiconductor packaging
- outermost
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To improve positioning accuracy of an interlayer circuit pattern by laminating a circuit board which has a through section so that a surface where on a circuit pattern is not formed yet will be an outermost surface and by forming a through hole and an outermost layer circuit pattern. CONSTITUTION:An etching resist layer 3 is formed on a circuit pattern area 1a where a semiconductor packaging matrix circuit board 2 which is provided with a semiconductor packaging circuit pattern 1 exposes at least. A circuit board 5 which has a through section 4 is laminated in one-piece construction on a semiconductor packaging circuit pattern formation surface 2a of the board 2 so that a formation surface 5a is the outermost surface. After a through hole 6 and an outermost layer circuit pattern 7 are formed, the etching resist layer 3 is eliminated. The positioning accuracy of an interlayer circuit pattern is thereby improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242045A JPH0719969B2 (en) | 1987-09-26 | 1987-09-26 | Method for manufacturing multilayer circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242045A JPH0719969B2 (en) | 1987-09-26 | 1987-09-26 | Method for manufacturing multilayer circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6484697A true JPS6484697A (en) | 1989-03-29 |
JPH0719969B2 JPH0719969B2 (en) | 1995-03-06 |
Family
ID=17083448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62242045A Expired - Lifetime JPH0719969B2 (en) | 1987-09-26 | 1987-09-26 | Method for manufacturing multilayer circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0719969B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006093493A (en) * | 2004-09-27 | 2006-04-06 | Cmk Corp | Printed wiring board with built-in part and method of manufacturing the same |
-
1987
- 1987-09-26 JP JP62242045A patent/JPH0719969B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006093493A (en) * | 2004-09-27 | 2006-04-06 | Cmk Corp | Printed wiring board with built-in part and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0719969B2 (en) | 1995-03-06 |
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