JPS6442895A - Multilayered wiring board with resistor - Google Patents

Multilayered wiring board with resistor

Info

Publication number
JPS6442895A
JPS6442895A JP62199116A JP19911687A JPS6442895A JP S6442895 A JPS6442895 A JP S6442895A JP 62199116 A JP62199116 A JP 62199116A JP 19911687 A JP19911687 A JP 19911687A JP S6442895 A JPS6442895 A JP S6442895A
Authority
JP
Japan
Prior art keywords
resistor
insulating layer
section
overlap
substrate surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62199116A
Other languages
Japanese (ja)
Inventor
Kazumi Furuya
Haruo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanki Engineering Co Ltd
Sanki Industrial Co Ltd
Original Assignee
Sanki Engineering Co Ltd
Sanki Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanki Engineering Co Ltd, Sanki Industrial Co Ltd filed Critical Sanki Engineering Co Ltd
Priority to JP62199116A priority Critical patent/JPS6442895A/en
Publication of JPS6442895A publication Critical patent/JPS6442895A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To improve a superficial mounting in density by a method wherein a resistor is formed in an interlaminar insulating layer of a buid-up type multilayered board. CONSTITUTION:A multi-layered wiring plate is so structured as to interpose a printed resistor 6 between a first insulating layer 3 and a second insulating layer 7. When a resistor section is made to occupy space as much as possible in a limited space, a first insulating layer 3 is made to overlap with a under land 4 a little so as to make a difference in level smaller, where the connecting land 4 connects the resistor section with a first layer pattern 2. And, when distance between electrodes 5 of silver paste has a margin (a carbon section 6 does not extend over a step), the first insulating layer 3 need not overlap with the connecting land 4 of the first layer pattern 2. By these processes, a resistor formerly mounted on a substrate surface is built in an insulating layer 7, and thus the mounting density of the substrate surface is improved.
JP62199116A 1987-08-11 1987-08-11 Multilayered wiring board with resistor Pending JPS6442895A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62199116A JPS6442895A (en) 1987-08-11 1987-08-11 Multilayered wiring board with resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62199116A JPS6442895A (en) 1987-08-11 1987-08-11 Multilayered wiring board with resistor

Publications (1)

Publication Number Publication Date
JPS6442895A true JPS6442895A (en) 1989-02-15

Family

ID=16402399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62199116A Pending JPS6442895A (en) 1987-08-11 1987-08-11 Multilayered wiring board with resistor

Country Status (1)

Country Link
JP (1) JPS6442895A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100334601B1 (en) * 1999-11-17 2002-05-03 배영하 Printed circuit board with buried resistor and method for thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100334601B1 (en) * 1999-11-17 2002-05-03 배영하 Printed circuit board with buried resistor and method for thereof

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