JPS6480096A - Formation of condenser or like on printed wiring board - Google Patents
Formation of condenser or like on printed wiring boardInfo
- Publication number
- JPS6480096A JPS6480096A JP23576587A JP23576587A JPS6480096A JP S6480096 A JPS6480096 A JP S6480096A JP 23576587 A JP23576587 A JP 23576587A JP 23576587 A JP23576587 A JP 23576587A JP S6480096 A JPS6480096 A JP S6480096A
- Authority
- JP
- Japan
- Prior art keywords
- condenser
- electrode
- printed wiring
- layer
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To decrease a condenser in an apparent mounting area so as to improve a component mounting in desisty by a method wherein a condenser is formed into a laminated structure in side view under a space where components are mounted or on an empty space of a printed wiring board. CONSTITUTION:An insulating layer 12 is formed under a mounting area of comparatively large components such as ICs, hybrid ICs, or the like which are mounted on a printed wiring plate 10. A VCC electrode 14 is formed into layer on an insulating layer 12. A dielectric 15 is formed into layer on the electrode 14, and a GND electrode 16 is formed on the dielectric 15 in layer. An overcoat 17 is made to be formed on the electrode 16 to cover and form a condenser 11, which is composed of the electrode 14, the dielectric 15, and the electrode 16, of a laminated structure like a bypass condenser. By these processes, an apparent mounting area of the condenser 11 is made to decrease, and thus a component mounting is improved in density.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23576587A JPS6480096A (en) | 1987-09-19 | 1987-09-19 | Formation of condenser or like on printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23576587A JPS6480096A (en) | 1987-09-19 | 1987-09-19 | Formation of condenser or like on printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6480096A true JPS6480096A (en) | 1989-03-24 |
Family
ID=16990903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23576587A Pending JPS6480096A (en) | 1987-09-19 | 1987-09-19 | Formation of condenser or like on printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6480096A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6699748B2 (en) | 2002-05-30 | 2004-03-02 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating capacitor having a photosensitive resin layer as a dielectric |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057146B2 (en) * | 1977-10-17 | 1985-12-13 | ソニー株式会社 | video tape recorder |
| JPS61140115A (en) * | 1984-12-12 | 1986-06-27 | Nec Corp | High-frequency circuit device |
| JPS61168992A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Circuit board |
-
1987
- 1987-09-19 JP JP23576587A patent/JPS6480096A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057146B2 (en) * | 1977-10-17 | 1985-12-13 | ソニー株式会社 | video tape recorder |
| JPS61140115A (en) * | 1984-12-12 | 1986-06-27 | Nec Corp | High-frequency circuit device |
| JPS61168992A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6699748B2 (en) | 2002-05-30 | 2004-03-02 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating capacitor having a photosensitive resin layer as a dielectric |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW351911B (en) | Laminar stackable circuit board structure with capacitor | |
| CA2064784A1 (en) | Capacitor Laminate for Printed Circuit Board | |
| EP0489177A4 (en) | Semiconductor device and method of manufacturing the same | |
| JPS647697A (en) | Manufacture of hybrid multi-layer circuit board | |
| CA2142611A1 (en) | A Multiple Layer Printed Circuit Board | |
| CA2225129A1 (en) | Printed circuit board including crosstalk compensation | |
| KR850001658A (en) | Printed wiring board | |
| EP0101791A3 (en) | Multi-layer circuitry | |
| EP0169530A3 (en) | Multilayer printed circuit board | |
| EP0331429A3 (en) | A laminated printed circuit board and process for its manufacture | |
| EP0272046A3 (en) | Circuit arrangement including a composite ceramic substrate | |
| ES469497A1 (en) | Composite electronic ignition system structure | |
| IE802038L (en) | Integrated circuit package | |
| JPS6480096A (en) | Formation of condenser or like on printed wiring board | |
| EP0204004A4 (en) | Wiring structure of a terminal circuit. | |
| JPS5567158A (en) | Inductor device of hybrid integrated circuit | |
| JPS6489350A (en) | Package for containing semiconductor element | |
| JPS57192058A (en) | Semiconductor device | |
| JPS646833A (en) | Detector | |
| JPS57157549A (en) | Container for integrated circuit | |
| JPS6484690A (en) | Printed wiring board and the production thereof | |
| JPS6457791A (en) | Printed board | |
| JPS54104564A (en) | Method of producing printed circuit board having electronic component elements on internal layer | |
| CA2103328A1 (en) | Electronic Circuit Board Arrangements | |
| JPS6489547A (en) | Board for mounting semiconductor element |