JPS61140115A - High-frequency circuit device - Google Patents
High-frequency circuit deviceInfo
- Publication number
- JPS61140115A JPS61140115A JP59262002A JP26200284A JPS61140115A JP S61140115 A JPS61140115 A JP S61140115A JP 59262002 A JP59262002 A JP 59262002A JP 26200284 A JP26200284 A JP 26200284A JP S61140115 A JPS61140115 A JP S61140115A
- Authority
- JP
- Japan
- Prior art keywords
- inductance
- curve
- powder
- circuit device
- ferrimagnetic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 9
- 239000010408 film Substances 0.000 claims description 7
- 230000005293 ferrimagnetic effect Effects 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 7
- 239000002902 ferrimagnetic material Substances 0.000 abstract description 5
- 238000013459 approach Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 230000035699 permeability Effects 0.000 abstract description 2
- 229920006395 saturated elastomer Polymers 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、セラミック基板上に、抵抗、コンデンサ、イ
ンダクタンスなどの受動部品、およびトランジスタ、ダ
イオードなどの能動素子を形成、または搭載した混成集
積回路によって構成された高周波回路装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a hybrid integrated circuit in which passive components such as resistors, capacitors, and inductances, and active elements such as transistors and diodes are formed or mounted on a ceramic substrate. The present invention relates to a high frequency circuit device configured by.
従来、セラミック、基板上に薄膜または厚膜抵抗を形成
すると共に1金属を帯状に蒸着してインダクタンスを形
成し、さらに、前記基板にトランジスタやダイオードな
どの半導体能動素子およびチップコンデンサなどを搭載
してなる混成集積回路による高周波回路装置が数多く実
用化されつつある。Conventionally, a thin film or thick film resistor is formed on a ceramic substrate, a metal is vapor deposited in a band shape to form an inductance, and semiconductor active elements such as transistors and diodes, chip capacitors, etc. are mounted on the substrate. Many high-frequency circuit devices using hybrid integrated circuits are being put into practical use.
第3図はこれらの高周波回路装置におけるインダクタン
ス部分を示す平面図であり、同図(a)は波形に迂回さ
せて引廻した帯状の金属膜2による波状のインダクタン
ス、゛同図(b)は四角の過巻状に形成した帯状金属膜
3のインダクタンスを示し、インダクタンスを大きくし
ようとすれば、そのための占有面積が大きくならざるを
得ない。なお、6はチップコンデンサである。FIG. 3 is a plan view showing the inductance part in these high-frequency circuit devices. FIG. The figure shows the inductance of the band-shaped metal film 3 formed in a rectangular overwound shape, and if the inductance is to be increased, the occupied area must be increased. Note that 6 is a chip capacitor.
上述のとおり、限られた基板面積内でのインダクタンス
の形成では、基板上に形成される帯状金属膜の幅および
長さに限界があり、十分なインダクタンスを得ようとす
れば、セラミック基板の面積を拡げなけれはならず、基
板面積の増大は、特性上の問題はかりでなく、価格上昇
にもつながるので、当然回避すべき性質のものである。As mentioned above, in order to form inductance within a limited substrate area, there are limits to the width and length of the strip metal film formed on the substrate, and in order to obtain sufficient inductance, the area of the ceramic substrate An increase in the substrate area not only causes problems in terms of characteristics but also leads to an increase in price, so it is of a nature that should naturally be avoided.
上記問題点に対し、本発明では、インダクタンスを形成
する帯状の金属膜の上をフェリ磁性体の粉末で被うこと
により、インダクタンスの増大を得、よって、基板面積
を殊更に拡げることから免れている。In order to solve the above-mentioned problem, in the present invention, the inductance is increased by covering the strip-shaped metal film forming the inductance with ferrimagnetic powder, thereby avoiding the need to further increase the substrate area. There is.
つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第1図(a)は本発明の一実施例に係るインダクタンス
部分の平面図、同図(b)は同図(a)のA−A断面図
である。第1図(a) 、 (b)において、所望のイ
ンダクタンス値を得るために、セラミック基板1の上に
、帯状の金属膜を波状に迂回させて形成したインダクタ
ンス導体2は、フェリ磁性体の粉末を混入した気発性溶
剤の塗布により形成した被援物4で被われている。FIG. 1(a) is a plan view of an inductance portion according to an embodiment of the present invention, and FIG. 1(b) is a sectional view taken along line AA in FIG. 1(a). In FIGS. 1(a) and 1(b), in order to obtain a desired inductance value, the inductance conductor 2 is formed by waving a band-shaped metal film around the ceramic substrate 1, and is made of ferrimagnetic powder. It is covered with a covering material 4 formed by coating an evaporative solvent mixed with.
第2図(a)は渦巻状インダクタンスにおける本発明の
実施例の平面図、同図(b)は同図(a)のA−A断面
図である。第2図(a) 、 (b)においては、セラ
ミック基板lの上に、四角い渦巻状に、帯状の金属膜に
よるインダクタンス導体3が形成され、導体3は、第1
図の例と同様の、フェリ磁性体の粉末からなる被扱物4
により被われている。FIG. 2(a) is a plan view of an embodiment of the present invention in a spiral inductance, and FIG. 2(b) is a sectional view taken along the line AA in FIG. 2(a). In FIGS. 2(a) and 2(b), an inductance conductor 3 made of a band-shaped metal film is formed in a rectangular spiral shape on a ceramic substrate l, and the conductor 3
Workpiece 4 made of ferrimagnetic powder, similar to the example shown in the figure.
covered by.
第4図は本発明の一実施例に係るインダクタンスのZi
−f特性の一例を示すグラフである。曲線11は従来例
、曲線12は本発明の特性であり、曲線12では、イン
ダクタンスの増加によりリャクタンスZiも大きく、曲
線11の上に出ている。FIG. 4 shows the inductance Zi according to an embodiment of the present invention.
It is a graph showing an example of -f characteristics. Curve 11 is the characteristic of the conventional example, and curve 12 is the characteristic of the present invention. In curve 12, the reactance Zi is also large due to the increase in inductance, and is above the curve 11.
しかし、周波数が高くなると、曲線12は曲線11に近
付き飽和するようKなる。これは、フェリ磁性体の透磁
率μの周波数特性に起因している。しかし、本発明によ
って、インダクタンス導体の上および近傍に塗布したフ
ェリ磁性体の粉末により使用周波数帯におけるリャクタ
ンスを増加させることができる。よつ・て、便用セラミ
ック基板上のインダクタンスによシ占める面atヲ小さ
くでき、混成集積回路構成による高周波回路装置の小形
化および高集積化が実現できる。また、立体のフェライ
トコア使用に比べた場合は、製造工数が少く、かつ粉末
を塗布するだけであるから高さを低くできる効果もある
。However, as the frequency increases, the curve 12 approaches the curve 11 and becomes saturated. This is due to the frequency characteristics of the magnetic permeability μ of the ferrimagnetic material. However, according to the present invention, the reactance in the used frequency band can be increased by applying ferrimagnetic powder on and near the inductance conductor. As a result, the area occupied by the inductance on the toilet ceramic substrate can be reduced, and the high frequency circuit device can be made smaller and more highly integrated due to the hybrid integrated circuit configuration. Furthermore, compared to using a three-dimensional ferrite core, the number of manufacturing steps is small and the height can be reduced because only powder is applied.
第1図(a)は本発明の一実施例に係るインダクタンス
部分の平面図、同図(b)は同図+2)OA−A断面図
、第2図(alは本発明の他の実施例に係るインダクタ
ンス部分の平面図、同図(b)は同図(alのA−A断
面図、第3図ta)および(b)はそれぞれ従来の高周
波回路装置のインダクタンス部分の一例および他の一例
の平面図、第4図は本発明および従来例に係るインダク
タンスのZi−f特性を示すグラフである。
1・・・・・・セラミック基板、2,3・・・・・・イ
ンダクタンス導体、4・・・・・・フェリ磁性体被覆、
6・・・・・・チップコンデンサ。
躬1図 第Z図
(bン
第3図
±
第4図FIG. 1(a) is a plan view of an inductance portion according to an embodiment of the present invention, FIG. FIG. 3(b) is a plan view of the inductance portion of the conventional high-frequency circuit device, and FIG. 4 is a graph showing the Zi-f characteristics of inductance according to the present invention and the conventional example. 1... Ceramic substrate, 2, 3... Inductance conductor, 4 ......ferrimagnetic coating,
6... Chip capacitor. Figure 1 Figure Z (Figure 3± Figure 4)
Claims (1)
デンサ等の回路部品をセラミックの平面基板上に形成ま
たは搭載した混成集積回路装置からなる高周波回路装置
において、前記セラミック基板上に金属を蒸着して形成
したインダクタンス上の一部または全体をフェリ磁性体
の粉末で被ったことを特徴とする高周波回路装置。In a high-frequency circuit device consisting of a hybrid integrated circuit device in which circuit components such as thin film resistors, thick film resistors, semiconductor components, and chip capacitors are formed or mounted on a ceramic flat substrate, the circuit components are formed by vapor-depositing metal on the ceramic substrate. A high frequency circuit device characterized in that an inductance is partially or entirely covered with ferrimagnetic powder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59262002A JPS61140115A (en) | 1984-12-12 | 1984-12-12 | High-frequency circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59262002A JPS61140115A (en) | 1984-12-12 | 1984-12-12 | High-frequency circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61140115A true JPS61140115A (en) | 1986-06-27 |
Family
ID=17369643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59262002A Pending JPS61140115A (en) | 1984-12-12 | 1984-12-12 | High-frequency circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61140115A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6480096A (en) * | 1987-09-19 | 1989-03-24 | Nippon Cmk Kk | Formation of condenser or like on printed wiring board |
EP0701262A1 (en) * | 1994-09-12 | 1996-03-13 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US5647966A (en) * | 1994-10-04 | 1997-07-15 | Matsushita Electric Industrial Co., Ltd. | Method for producing a conductive pattern and method for producing a greensheet lamination body including the same |
US6909350B2 (en) | 1994-09-12 | 2005-06-21 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
JPWO2020189478A1 (en) * | 2019-03-19 | 2020-09-24 |
-
1984
- 1984-12-12 JP JP59262002A patent/JPS61140115A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6480096A (en) * | 1987-09-19 | 1989-03-24 | Nippon Cmk Kk | Formation of condenser or like on printed wiring board |
US6631545B1 (en) | 1994-09-12 | 2003-10-14 | Matsushita Electric Industrial Co., Ltd. | Method for producing a lamination ceramic chi |
US6293001B1 (en) | 1994-09-12 | 2001-09-25 | Matsushita Electric Industrial Co., Ltd. | Method for producing an inductor |
EP1148521A1 (en) * | 1994-09-12 | 2001-10-24 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
EP1152439A1 (en) * | 1994-09-12 | 2001-11-07 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
EP0701262A1 (en) * | 1994-09-12 | 1996-03-13 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US6909350B2 (en) | 1994-09-12 | 2005-06-21 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US6911888B2 (en) | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US6911887B1 (en) | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US6914510B2 (en) | 1994-09-12 | 2005-07-05 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US7078999B2 (en) | 1994-09-12 | 2006-07-18 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US5647966A (en) * | 1994-10-04 | 1997-07-15 | Matsushita Electric Industrial Co., Ltd. | Method for producing a conductive pattern and method for producing a greensheet lamination body including the same |
JPWO2020189478A1 (en) * | 2019-03-19 | 2020-09-24 |
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