JPH0611320U - Chip inductor - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] The inductance value can be adjusted by cutting the conductor pattern or magnetic material pattern by laser trimming or the like. A conductor pattern 11 such as a thin film formed as an inductor or a magnetic material pattern formed from a thin film is provided on a substrate 10 such as a ceramic, and the conductor pattern 11 or a part of the magnetic material pattern is a laser. The inductance value is finely adjusted by cutting along the trimming locus 16.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip inductor that can be trimmed, and more specifically, by adjusting the inductance in a high frequency circuit such as a VCO circuit, a filter circuit, a booster, etc. in the MHz to CHz band of a mobile phone, a mobile phone, a BS, a CS, etc. The present invention relates to a chip inductor used in a circuit that obtains predetermined characteristics.

[0002]

[Prior art]

 Conventionally, in this type of inductor, as shown in FIGS. 16 and 17, thick film conductor patterns 1 and magnetic material patterns 2 are alternately stacked, and both ends of the conductor pattern 1 are connected to terminals 3 and 4. In general, the structure is such that a specific inductance value can be obtained.

[0003]

[Problems to be solved by the device]

 By the way, according to the conventional inductor described above, the inductance value is adjusted to the design value in advance to obtain a predetermined value, so that the deviation value of the finished product is large, and the conductor pattern that determines the inductance value is the magnetic material pattern. Since it is inside, and the magnetic material pattern is thick and completed by high-temperature firing, there was a problem that adjustment by cutting etc. was impossible.

The present invention has been made in view of the above problems of the conventional technology, and an object thereof is to adjust the inductance value appropriately by a laser or other easily available device. It is to provide an inductor.

[0005]

[Means for solving problems]

 For this purpose, the present invention provides a conductor pattern such as a thin film formed as an inductor or a magnetic material pattern formed of a thin film on a substrate such as a ceramic, and the conductor pattern or the magnetic material pattern is laser trimmed or the like. It is characterized in that the inductance value can be appropriately adjusted by cutting with, and is further characterized in that the conductor pattern has a two-layer structure.

[0006]

【Example】

 An embodiment will be described with reference to the drawings. FIG. 1 and FIG. 2 are a plan view and a cross-sectional view taken along line AA of an example of a chip inductor according to the present invention. A thin-film or thick-film conductor pattern 11 is formed as an inductor thereon, and both ends 12 and 13 of the conductor pattern 11 are connected to terminals 14 and 15 on both sides, and a part of the conductor pattern 11 is subjected to laser trimming locus. By cutting with 16, the inductance value was raised and fine adjustment was made possible.

Modifications of the chip inductor according to the present invention are possible, and other modifications are shown in FIGS. 3 to 15. In the embodiment shown in FIGS. 3 to 10, the conductor pattern has a two-layer structure in order to obtain a large inductance value. To further explain, referring to FIGS. 3 and 4, a thin-film or thick-film first-layer conductor pattern 17 as an inductor is provided in a concentric square shape on a substrate 10 such as a ceramic. Further, the first layer conductor pattern 17 is connected to the first layer conductor pattern 17 via an insulator 19, and one end connection portion 21 is connected to each connection portion 23 in the first layer conductor pattern 17 and the other end portion 22 is a terminal. A second layer conductor pattern 20 is provided so as to be connected to 15 and a part of the second layer conductor pattern 20 is cut by a laser trimming locus 16 to adjust the inductance value. Is.

The two-layer structure of the conductor patterns shown in FIGS. 5 to 7 is obtained by interposing a thin-layer or thick-film first-layer conductor pattern 24 as an inductor and an insulator 25 on a substrate 10 made of ceramic or the like. The second-layer conductor patterns 26 are provided in a zigzag pattern in which the second-layer conductor patterns 26 are slightly displaced from each other, and one end 27 of the second-layer conductor pattern 26 is connected to the terminal 14 and the other end is connected. 28 is connected at one end connection portion 29 in the first layer conductor pattern 24, and the other end portion 30 of the second layer conductor pattern 26 and the plurality of branch end portions 31 are connected to the terminal 15. The inductance value is adjusted by cutting a part of the portions 26 and 30 of the reference numeral 26 along the locus 16 of laser trimming. is there.

The two-layer structure of conductor patterns shown in FIGS. 8 to 10 is a thin-film or thick-film first-layer conductor pattern 32 as an inductor and a first-layer conductor pattern 32 on a substrate 10 made of ceramic or the like. The second-layer conductor pattern 33 is provided on the conductor pattern 32 via the insulator 25. To further explain, both conductor patterns 32 and 33 are arranged in a substantially U shape and slightly offset from each other. At the same time, one end portion 34 of the first-layer conductor pattern 32 is connected to the terminal 14, the connection portion 35 is connected to the connection end portion 36 of the second-layer conductor pattern 33, and both conductor patterns 32 and 33 are slightly displaced from each other. And the connection portions 35 of the first-layer conductor pattern 32 and the connection portion 36 of the second-layer conductor pattern 33 that are closest to the terminal 15 are extended. The second layer conductor pattern extending portion 37, the end portion 38 and the plurality of branch ends 39 of the second layer conductor pattern 33 closest to the terminal 15 are connected to the terminal 15, and the second layer conductor pattern The inductance value is adjusted by cutting a part of the parts 37, 38, 39 of the body pattern 33 with a locus 16 of laser trimming.

In the embodiment shown in FIGS. 11 to 15, the conductor pattern is not trimmed and adjusted, but the magnetic material pattern formed of a thin film or the like is trimmed and adjusted. To further explain, in the embodiment shown in FIGS. 11 and 12, a magnetic material pattern 40 formed of a thin film or a thick film is provided on a substrate 10 such as a ceramic, and the magnetic material pattern 40 is provided. A conductor pattern 41 is provided on one side, one end 42 thereof is connected to the terminal 14 and the other end 43 thereof is connected to the terminal 15, respectively, and the film of the magnetic material pattern 40 is cut by the locus 16 of laser trimming. The inductance value is adjusted by.

Further, in the embodiment shown in FIGS. 13 to 15, the magnetic material pattern 44 formed on the substrate 10 made of ceramic or the like and formed as a thin film or a thick film slightly above the middle thereof is in a strip shape. And a conductor pattern 45 is provided on the magnetic material pattern 44 with a part thereof positioned so that one end 46 thereof is connected to the terminal 14 and the other end 47 thereof is connected to the terminal 15, respectively. A magnetic material pattern 48 equivalent to the magnetic material pattern 44 is provided on the remaining portion of the conductor pattern 45, and the film of the magnetic material patterns 44 and 48 is cut by the laser trimming locus 16 to reduce the inductance value. The adjustment is made.

[0012]

[Effect of device]

 Therefore, according to the present invention, since the inductance value is adjusted by the locus of laser trimming, it takes a long time while mechanically monitoring the output characteristics with an air-core coil in a high frequency circuit. Compared to the conventional method, the inductance value can be adjusted in an extremely short time and can be adjusted to any value, eliminating the need for cut-and-try adjustment especially in high-frequency circuits.

Further, in the past, when creating a series of inductance values, many original images (pattern diagrams) were required, but according to the present invention, since it is completed with a few patterns, adjustment by a laser or the like is required. A wide range of inductance values can be realized only by using.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a chip inductor according to the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG.

FIG. 3 is a plan view showing another example of the present invention.

FIG. 4 is a sectional view taken along line BB of FIG.

FIG. 5 is a plan view showing another example of the present invention.

6 is a cross-sectional view taken along the line CC of FIG.

7 is a cross-sectional view taken along the line DD of FIG.

FIG. 8 is a plan view showing another example of the present invention.

9 is a sectional view taken along the line EE of FIG.

10 is a cross-sectional view taken along the line FF of FIG.

FIG. 11 is a plan view showing still another example of the present invention.

12 is a cross-sectional view taken along the line GG of FIG.

FIG. 13 is a plan view showing still another example of the present invention.

14 is a cross-sectional view taken along the line HH of FIG.

FIG. 15 is a cross-sectional view taken along the line I-I of FIG.

FIG. 16 is a plan view showing a conventional example.

17 is a sectional view taken along the line JJ of FIG.

[Explanation of symbols]

 10 substrate 11, 41, 45 conductor pattern 16 cutting locus such as laser trimming 17, 24, 32 first layer conductor pattern 19, 25 insulator 20, 26, 33 second layer conductor pattern 40 magnetic material pattern

Claims (2)

[Scope of utility model registration request] 1. A conductor pattern such as a thin film formed as an inductor or a magnetic material pattern formed of a thin film is provided on a substrate such as a ceramic, and the conductor pattern or the magnetic material pattern is cut by laser trimming or the like. A chip inductor characterized by a structure in which the inductance value can be adjusted appropriately. 2. The chip inductor according to claim 1, wherein the conductor pattern has a two-layer structure.