JPH0530366Y2 - - Google Patents
Info
- Publication number
- JPH0530366Y2 JPH0530366Y2 JP1986020581U JP2058186U JPH0530366Y2 JP H0530366 Y2 JPH0530366 Y2 JP H0530366Y2 JP 1986020581 U JP1986020581 U JP 1986020581U JP 2058186 U JP2058186 U JP 2058186U JP H0530366 Y2 JPH0530366 Y2 JP H0530366Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- magnetic film
- inductor
- conductor line
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 16
- 239000012528 membrane Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野】
本考案は、混成集積回路に関し、特に高周波回
路のインダクターに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a hybrid integrated circuit, and particularly to an inductor for a high frequency circuit.
従来、高周波回路のインダクターとしては、整
合回路用コイルと高周波阻止用のRFCに分けら
れるが、いずれもほぼ数百ＭHz以上の周波数にな
ると空心コイルが使用され、膜回路基板上に半田
付けにより、搭載されるのが通例である。
Conventionally, inductors for high-frequency circuits are divided into coils for matching circuits and RFC for high-frequency blocking, but air-core coils are used in both cases when the frequency exceeds several hundred MHz, and they are soldered onto a membrane circuit board. It is customary to be installed.
上述した従来の空心コイルを使用した混成集積
回路は、第５図、６図に示すようにチツプコンデ
ンサ、トランジスター等の部品は、自動搭載機を
使用して、容易に組立ができるが、空心コイル２
だけは、形状からくる欠点のため、搭載機を使用
できない問題がある。すなわち、自動搭載工程の
後、更に半田ゴテを使用して、空心コイル４の両
端を膜回路基板１の上に作られた導体ランド３
に、半田４により接続する工程があるため、多大
な工数を要し、コスト高となる問題がある。ま
た、空心コイル自体も、特殊な形状を使用する場
合は、自動機にかからないため、コスト高となる
欠点もある。
In the hybrid integrated circuit using the conventional air-core coil described above, parts such as chip capacitors and transistors can be easily assembled using an automatic mounting machine, as shown in Figures 5 and 6. 2
However, due to the drawbacks due to its shape, there is a problem that the aircraft equipped with it cannot be used. That is, after the automatic mounting process, a soldering iron is used to connect both ends of the air-core coil 4 to the conductive lands 3 made on the membrane circuit board 1.
In addition, since there is a step of connecting with solder 4, a large amount of man-hours are required and there is a problem that the cost is high. Furthermore, if the air-core coil itself is of a special shape, it cannot be machined by an automatic machine, which has the disadvantage of increasing costs.
本考案は、回路基板上に形成されたインダクタ
を有する混成集積回路において、インダクタは導
体ラインと導体ラインを上下からはさみ込む磁性
膜により構成されている。
The present invention provides a hybrid integrated circuit having an inductor formed on a circuit board, in which the inductor is constituted by a conductor line and a magnetic film sandwiching the conductor line from above and below.
次に、本考案について図面を参照して説明す
る。
Next, the present invention will be explained with reference to the drawings.
第１図は、本考案の一実施例の上面図及び第２
図は、側面図である。１は、アルミナ等の上に膜
回路が形成された膜回路基板で、５は、高周波阻
止を目的とした、インダクタンスを形成する導体
ラインであるが、機能を満すためには、相当長い
ライン長を必要とするが、磁性膜６を導体ライン
の上下にはさむことにより、トロイダルコアにワ
イヤを通した１ターンのインダクターと等価の機
能を有することができ、ライン長を短かくでき
る。ここで、磁性膜としては、高周波で低損失、
及び電気抵抗の高いNi−Zn系フエライト等が適
している。 FIG. 1 shows a top view and a second embodiment of the present invention.
The figure is a side view. 1 is a membrane circuit board with a membrane circuit formed on alumina or the like, and 5 is a conductor line that forms an inductance for the purpose of blocking high frequencies, but in order to fulfill its function, it must be a fairly long line. Although it requires a long conductor line, by sandwiching the magnetic film 6 above and below the conductor line, it can have a function equivalent to a one-turn inductor in which a wire is passed through a toroidal core, and the line length can be shortened. Here, the magnetic film has low loss at high frequency.
Also suitable are Ni-Zn ferrite, which has high electrical resistance.
膜回路基板１の上への形成法としては、Ni−
Zn系フエライトの粉体及びアルミナ基板１へ接
着させるための酸化ビスマスガラス粉末、有機物
バインダー等を混合したペースト状の材料をスク
リーン印刷等により、膜回路基板１に付着させ、
高温で焼結することにより、形成することができ
る。 As a method of forming on the film circuit board 1, Ni-
A paste material, which is a mixture of Zn-based ferrite powder, bismuth oxide glass powder for adhering to the alumina substrate 1, an organic binder, etc., is attached to the membrane circuit board 1 by screen printing or the like.
It can be formed by sintering at high temperature.
尚、所定の特性のインダクターを得るために
は、導体ラインをおおう磁性膜の長さを調整する
必要があり、また磁性膜の厚さをあらかじめ設定
しておく必要がある。 Note that in order to obtain an inductor with predetermined characteristics, it is necessary to adjust the length of the magnetic film covering the conductor line, and it is also necessary to set the thickness of the magnetic film in advance.
次に、第３図、第４図は、本考案のもととなる
実施例の一つで、トロイダルコイルに２ターン導
体を巻いたものと等価であり、磁性体を芯として
コイル状に導体を巻いたものである。 Next, Figures 3 and 4 show one of the embodiments that are the basis of the present invention, which is equivalent to a toroidal coil wrapped with a two-turn conductor, and the conductor is coiled with a magnetic material as the core. It is rolled.
形成方法としては、膜回路基板１に磁性膜６を
印刷焼成しさらに、導体パターン５を、さらにそ
の上に磁性膜６を形成し、最後に導体パターンを
さらに磁性膜をつけて完了する。但し、本実施例
の場合は、磁路を確保するため、上下の磁性膜の
間にガラス等による絶縁層が一層必要となり、製
造工程が複雑になり、また導体パターンが磁性膜
の上下に接続しなければならないため、断線し易
く、歩留、耐久性に欠けるという問題がある。 The formation method is to print and bake the magnetic film 6 on the film circuit board 1, then to form the conductor pattern 5 and the magnetic film 6 thereon, and finally to complete the conductor pattern by attaching another magnetic film. However, in this example, in order to secure the magnetic path, an insulating layer made of glass or the like is required between the upper and lower magnetic films, which complicates the manufacturing process, and the conductor pattern is connected to the upper and lower sides of the magnetic film. Because of this, there are problems in that the wires are easily broken and the yield and durability are poor.
以上説明したように本考案は、導体ラインのイ
ンダクター部分の上下に磁性膜を付加することに
より、インダクターを容易に膜回路基板に形成す
ることができ、従来、組立てに要していた多大な
工数を削減することができ、量産に適した構造の
混成集積回路を提供することができる。
As explained above, the present invention enables the inductor to be easily formed on a film circuit board by adding magnetic films above and below the inductor part of the conductor line, which eliminates the large amount of man-hours that were previously required for assembly. It is possible to provide a hybrid integrated circuit with a structure suitable for mass production.
第１図、第２図は本考案による第１の実施例の
混成集積回路の上面図及び側面図を示し、第３
図、第４図は本考案のもととなる実施例の上面図
及び側面図を示し、第５図、第６図は従来の混成
集積回路の上面図及び側面図を示す図である。
１……膜回路基板、２……空心コイル、３……
導体ランド、４……半田、５……導体ライン、６
……磁性膜。
1 and 2 show a top view and a side view of a hybrid integrated circuit according to a first embodiment of the present invention, and a third
4 show a top view and a side view of an embodiment on which the present invention is based, and FIGS. 5 and 6 show a top view and a side view of a conventional hybrid integrated circuit. 1... Membrane circuit board, 2... Air core coil, 3...
Conductor land, 4...Solder, 5...Conductor line, 6
...Magnetic film.
Claims (1)
成集積回路において、前記インダクタは導体ライ
ンと当該導体ラインを上下からはさみ込む磁性膜
とにより構成されていることを特徴とする混成集
積回路。 1. A hybrid integrated circuit having an inductor formed on a circuit board, wherein the inductor is composed of a conductor line and a magnetic film sandwiching the conductor line from above and below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986020581U JPH0530366Y2 (en) | 1986-02-14 | 1986-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986020581U JPH0530366Y2 (en) | 1986-02-14 | 1986-02-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62134258U JPS62134258U (en) | 1987-08-24 |
| JPH0530366Y2 true JPH0530366Y2 (en) | 1993-08-03 |
Family
ID=30816226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986020581U Expired - Lifetime JPH0530366Y2 (en) | 1986-02-14 | 1986-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530366Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4690033B2 (en) * | 2004-12-28 | 2011-06-01 | スミダコーポレーション株式会社 | Multilayer type magnetic element |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58188115A (en) * | 1982-04-27 | 1983-11-02 | Sanyo Electric Co Ltd | Forming method of inductive element |
| JPS60136363A (en) * | 1983-12-26 | 1985-07-19 | Toshiba Corp | Semiconductor device |
| JPS6117708B2 (en) * | 1978-09-27 | 1986-05-08 | Hitachi Ltd |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117708U (en) * | 1984-07-05 | 1986-02-01 | 関西日本電気株式会社 | inductance parts |
-
1986
- 1986-02-14 JP JP1986020581U patent/JPH0530366Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117708B2 (en) * | 1978-09-27 | 1986-05-08 | Hitachi Ltd | |
| JPS58188115A (en) * | 1982-04-27 | 1983-11-02 | Sanyo Electric Co Ltd | Forming method of inductive element |
| JPS60136363A (en) * | 1983-12-26 | 1985-07-19 | Toshiba Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62134258U (en) | 1987-08-24 |
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