JPS60244097A - Hybrid electronic circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to hybrid electronic circuits.

[Prior art and its problems]

With the increasing integration of electronic components, coils, capacitors, resistors, etc. are being manufactured using lamination technology. However, as integration progresses, capacitive coupling occurs particularly between wiring, electrodes, coil conductors, etc., which hinders integration.

[Purpose of the invention]

An object of the present invention is to provide a hybrid electronic component that has a high degree of integration and has low capacitive coupling between mounted or built-in elements. Another object of the present invention is to provide a hybrid electronic circuit in which the capacitive elements are intensively formed in the dielectric substrate and the inductance elements are intensively formed in the dielectric, thereby increasing the degree of integration.

[Summary of structure and effects of the invention]

The hybrid electronic circuit of the present invention includes an insulating magnetic substrate containing a plurality of inductors, a dielectric substrate containing a plurality of capacitors, and an insulating material such as glass coated on the surfaces of the magnetic substrate and the dielectric substrate. The insulating layer includes a resistor, a semiconductor component, etc. provided on the surface of the insulating layer.

According to this configuration, the insulating layer made of glass or the like prevents coupling between circuit parts, thereby increasing the degree of integration. Further, since the inductor portion is formed on the magnetic substrate, the capacitor portion is formed on the dielectric substrate, and the resistor is formed on the surface of the insulating layer, the integration process is significantly simplified.

According to the embodiments of the present invention, the magnetic substrate and the dielectric substrate may have a shape in which they are juxtaposed in a plane, and may have a common glass layer or the like on their surfaces, or the magnetic substrate and the dielectric substrate may have a common glass layer or the like on their surfaces. A glass layer or the like may be formed on each of the substrates, and the substrates may be sequentially laminated and combined, and a resistor may be formed on the uppermost surface. The former has a higher surface utilization rate, but the latter has the advantage of a smaller planar projected area and higher mechanical strength.

[Explanation of specific examples]

Embodiments of the present invention will be described in detail below with reference to the drawings.

Example 1 FIG. 1 shows a perspective view of a planar hybrid electronic circuit.

In this example, the hybrid electronic circuit is planar and divided into three areas: a part containing a magnetic substrate with a built-in inductor, a part containing a high-permittivity dielectric substrate B with a built-in capacitor, and a part containing a low-permittivity dielectric substrate with a built-in capacitor. It consists of a part including C and an antenna part substrate.

These substrates can be manufactured by any method such as co-firing with a suitable bonding powder or co-firing on a common support substrate.

The substrates A, B, C, and D can be manufactured by conventionally known methods. One example of these will be described below.

Figure 2 shows the laminated structure of the inductor built-in board A during manufacture, and shows a magnetic thin plate 1.2.3.4 manufactured by printing a paste of soft magnetic ferrite powder with high electrical resistance.
and a conductor piece 5.6.7.8 made from a paste of conductive powder such as AgSAg-Pd and printed on the surface of the magnetic thin plate 1.2.3.4 so as to form approximately one turn of the coil.
A laminate is formed by alternately laminating the conductor pieces, and at this time, the conductor pieces overlap each other at the boundary positions of each layer indicated by dotted lines to establish electrical connection. Therefore, a conductor coil from the starting end 8 to the ending end F is formed in the magnetic thin plate laminate. This laminate is fired, and then 8. Complete the inductor board by baking an external terminal for external circuit connection at F. Although FIG. 2 shows an example in which a single inductor is built in for the sake of convenience, a similar lamination technique is generally used to obtain a magnetic substrate in which a plurality of inductors are built in at the same time.

FIG. 3 shows an example of manufacturing a high-m tolerance dielectric substrate 2 with a built-in capacitor. In the figure, 10.11.12.13 shows a dielectric thin plate formed by printing from a paste of high dielectric constant dielectric powder. 10.11.12.15 Printing on each surface, and electrode thin layer 14.15.16.17.18
．． 19.20.21, and the ends of the electrodes are drawn out to the outer periphery of the laminate. The above lamination is carried out in order from the bottom to the top, and then sintering is performed to bake the external terminals to the lead-out ends to form the dielectric substrate B with a built-in capacitor. This substrate 2 is also generally manufactured so as to incorporate a desired capacitance and number of capacitors.

Manufacturing of low dielectric constant dielectric substrate C (7) with built-in capacitor is the third step.
This is done in a manner similar to that described in connection with the figure. Also, the antenna part will be manufactured in accordance with the board design.

Referring again to FIG. Substrates A, B, and C are bonded together, and a layer of glass is further formed over their surfaces. The glass layer can be produced by applying or printing a paste of glass powder over the entire surface of the bonded substrates A, B, C and fusing at high temperatures. The presence of this glass layer is extremely important, and serves to avoid electromagnetic interference with various components mounted on the surfaces of the substrates A, B, and C, thereby maintaining good characteristics.

In addition, if necessary, a recess is provided so that ICs, semiconductors, etc. to be mounted can be buried on the substrates A, B, and/or C, and the above glass layer is formed on the recess. be able to.

As shown in FIG. 1, the inductor built-in board part is divided into a transformer section 20, an intermediate frequency transformer section 21, an AM optical oscillation coil 22, an FM oscillation coil group section 23, a filter section 24, etc. Resistors, capacitors, etc. are mounted on the glass layer E on the surface, and the predetermined print layout is applied!
(not shown), and the lead-out end T of the internal inductor is formed on the outer periphery.

The capacitor-embedded board B constitutes a circuit network centered on capacitors, and has predetermined components such as an IC and a resistor R1 capacitor mounted on the surface of a glass layer E, and predetermined printed wiring. The capacitor built-in board C similarly mounts various parts. Circuits and glass layer E inside each board B, C, D
The surface of the board is connected to the external terminal T formed around the board in the same manner as described above regarding the board.

Advantages and Effects According to the above configuration, the inductor and capacitor of the circuit are centralized in each board, thereby simplifying the manufacturing of the circuit. Furthermore, since the glass layer E is provided on the surface of all the substrates, electrical or magnetic coupling with mounted components is significantly reduced, improving the quality of the circuit. According to the present invention, electronic devices can be miniaturized to the maximum.

Embodiment 2 FIG. 4 shows another embodiment of the present invention. This example provides a highly integrated hybrid electronic circuit in which each substrate is stacked with a glass layer interposed therebetween. Although this example has lower surface utilization efficiency than the example shown in FIG. 1, it is superior in compactness.

In FIG. 4, A' is a magnetic substrate with a built-in inductor, which has the same structure as the substrate of the first embodiment, and B/ is a high dielectric constant magnetic substrate with a built-in capacitor, which is the same as that of the first embodiment. It has the same structure as the board B, CI is a low permittivity dielectric board with a built-in capacitor and has the same structure as the board C of the first embodiment, and D' is a magnetic body with a built-in antenna coil. It has the same configuration as the antenna section of the first embodiment.

A glass layer E is interposed and fused between each substrate A', B', C' and antenna part D' to separate the substrates, and by introducing spacing, electrical and magnetic Reducing bonds. A glass layer is also fused to the surface of the antenna section, and various semiconductor ICs are placed on top of it.

A resistor R and the like are mounted, and predetermined wiring is performed using printed wiring (not shown) on the same surface and an external terminal T'.

Effects According to the above structure, the substrates A', B', C' and the antenna portion D' are overlapped, and as in the first embodiment, high integration and high workability are provided.

Furthermore, the presence of the glass layer E achieves the excellent effect of avoiding electromagnetic coupling between circuit elements.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a hybrid Kameko circuit according to the first embodiment of the present invention, FIG. 2 is a perspective view showing the manufacture of a magnetic substrate with a built-in inductor of the same circuit, and FIG. 3 is a dielectric substrate with a built-in capacitor of the same circuit. FIG. 4 is a perspective view showing a second embodiment of the present invention. The upper part of the figure is as follows. Person, A': Magnetic substrate with built-in inductor, B, B':
High-permittivity dielectric substrate with built-in capacitor cc': Low-permittivity dielectric substrate with built-in capacitor D, D': Antenna section E, E' Glass layer 1.2.5.4: Magnetic thin plate 5.6.7.8 : Conductor piece 10.11.12.13 : Dielectric thin plate 14.15.1
6.17.18.19.20.21: Electrode Figure 1 Figure 8 Figure 4

Claims (1)

[Claims] 1. An electrically insulating magnetic substrate containing a plurality of inductors, a dielectric substrate containing a plurality of capacitors, an insulating layer such as glass coated on the surface of each substrate, and an insulating layer provided on the surface of the insulating layer. A hybrid electronic circuit consisting of circuit components such as resistors and semiconductor components, and printed wiring formed on the surface.