JPS6484786A - Multilayer printed wiring board - Google Patents

Multilayer printed wiring board

Info

Publication number
JPS6484786A
JPS6484786A JP24453287A JP24453287A JPS6484786A JP S6484786 A JPS6484786 A JP S6484786A JP 24453287 A JP24453287 A JP 24453287A JP 24453287 A JP24453287 A JP 24453287A JP S6484786 A JPS6484786 A JP S6484786A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
hole
pattern
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24453287A
Other languages
Japanese (ja)
Inventor
Kenichi Omae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24453287A priority Critical patent/JPS6484786A/en
Publication of JPS6484786A publication Critical patent/JPS6484786A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To enhance a mounting density and to set a small-diameter through hole highly accurately by a method wherein a first and a second printed wiring boards are laminated via an insulator and a hole made in the second printed wiring board and the insulator is connected to a conductor pattern to be connected to the through hole in the first printed wiring board. CONSTITUTION:A first printed wiring board 1 having inner layers 9 has through holes 3, 4 and a short pattern 10 which is connected to the through hole 4 on its surface layer. A second printed wiring board 2 is laminated on the first printed wiring board 1 via an insulator 13. The second printed wiring board 2 has inner layers 8 and a through hole 5 is formed in advance. Holes are made in the laminated printed wiring board by using drills 7, 12 from the side of the second printed board 2. The drill 7 makes the hole at one end of the pattern 10 on the surface layer of the first printed wiring board 1. After making the hole, if the through hole is planted 14, a hole 6 can be connected electrically to the hole 4 through the pattern 10.
JP24453287A 1987-09-28 1987-09-28 Multilayer printed wiring board Pending JPS6484786A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24453287A JPS6484786A (en) 1987-09-28 1987-09-28 Multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24453287A JPS6484786A (en) 1987-09-28 1987-09-28 Multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS6484786A true JPS6484786A (en) 1989-03-30

Family

ID=17120095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24453287A Pending JPS6484786A (en) 1987-09-28 1987-09-28 Multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS6484786A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492007B1 (en) 2000-03-14 2002-12-10 Oki Printed Circuits Co., Ltd. Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same
JPWO2019225488A1 (en) * 2018-05-21 2021-04-22 株式会社村田製作所 Wafer bonding structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492007B1 (en) 2000-03-14 2002-12-10 Oki Printed Circuits Co., Ltd. Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same
JPWO2019225488A1 (en) * 2018-05-21 2021-04-22 株式会社村田製作所 Wafer bonding structure

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