MY102308A - Hybrid printed circuit structures - Google Patents

Hybrid printed circuit structures

Info

Publication number
MY102308A
MY102308A MYPI87000928A MYPI19870928A MY102308A MY 102308 A MY102308 A MY 102308A MY PI87000928 A MYPI87000928 A MY PI87000928A MY PI19870928 A MYPI19870928 A MY PI19870928A MY 102308 A MY102308 A MY 102308A
Authority
MY
Malaysia
Prior art keywords
printed circuit
circuit structures
hybrid printed
wiring substrate
hybrid
Prior art date
Application number
MYPI87000928A
Inventor
Mikiya Kobayashi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of MY102308A publication Critical patent/MY102308A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A HYBRID PRINTED CIRCUIT STRUCTURE COMPRISES A PRINTED WIRING SUBSTRATE (1), A THROUGH HOLE OR HOLES (3) FORMED IN THE PRINTED WIRING SUBSTRATE (1), CIRCUIT ELEMENTS (4) PROVIDED ON THE PRINTING WIRING SUBSTRATE (1), A FLAT INSULTING LAYER (5A) COVERING THE CIRCUIT ELEMENTS (4) OR THE THROUGH HOLE (3), AND AN IC CHIP (10) MOUNTED ON THE FLAT INSULATING LAYER (5A).(FIG. 1)
MYPI87000928A 1986-07-09 1987-07-01 Hybrid printed circuit structures MY102308A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986105213U JPH0735389Y2 (en) 1986-07-09 1986-07-09 Semiconductor device

Publications (1)

Publication Number Publication Date
MY102308A true MY102308A (en) 1992-05-28

Family

ID=14401389

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI87000928A MY102308A (en) 1986-07-09 1987-07-01 Hybrid printed circuit structures

Country Status (3)

Country Link
JP (1) JPH0735389Y2 (en)
KR (1) KR920005952Y1 (en)
MY (1) MY102308A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222914A (en) * 2001-01-26 2002-08-09 Sony Corp Semiconductor device and manufacturing method therefor
JP4489137B1 (en) * 2009-01-20 2010-06-23 パナソニック株式会社 Circuit module and electronic device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272468A (en) * 1975-12-15 1977-06-16 Matsushita Electric Ind Co Ltd Printed circuit board
JPS629728Y2 (en) * 1981-05-07 1987-03-06
JPS58150862U (en) * 1982-04-01 1983-10-08 パイオニア株式会社 Chip parts mounting device
JPS60114844U (en) * 1984-01-10 1985-08-03 三菱電機株式会社 thermal head
JPS6181140U (en) * 1984-11-01 1986-05-29

Also Published As

Publication number Publication date
JPS6310550U (en) 1988-01-23
JPH0735389Y2 (en) 1995-08-09
KR920005952Y1 (en) 1992-08-27
KR880003791U (en) 1988-04-14

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