JPS60114844U - thermal head - Google Patents

thermal head

Info

Publication number
JPS60114844U
JPS60114844U JP1984002610U JP261084U JPS60114844U JP S60114844 U JPS60114844 U JP S60114844U JP 1984002610 U JP1984002610 U JP 1984002610U JP 261084 U JP261084 U JP 261084U JP S60114844 U JPS60114844 U JP S60114844U
Authority
JP
Japan
Prior art keywords
thermal head
abstract
conductive
recorded
mounting board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984002610U
Other languages
Japanese (ja)
Inventor
史郎 辻
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1984002610U priority Critical patent/JPS60114844U/en
Publication of JPS60114844U publication Critical patent/JPS60114844U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Electronic Switches (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のサーマルヘッドのＩＣ搭載基板、　　を
示す断面側面図、第２図はこの考案の一実施例によるサ
ーマルヘッドのＩＣ搭載基板を示す断面側面図である。 １・・・ＩＣ搭載基板、２・・・金属導体膜、３・・・
裏面が金属膜のＩＣチップ、４・・・絶縁膜、５・・・
ダイボイド材、６・・・金属ワイヤ、７・・・裏面が非
導電性膜（７）ＩＣｆツブ、８・・・非導電性グイボン
ド材。な１　　お、図中同一符号は同−又は相当部分を
示す。FIG. 1 is a sectional side view showing an IC mounting board of a conventional thermal head, and FIG. 2 is a sectional side view showing an IC mounting board of a thermal head according to an embodiment of the present invention. 1... IC mounting board, 2... Metal conductor film, 3...
IC chip whose back surface is a metal film, 4... insulating film, 5...
Die void material, 6... Metal wire, 7... Back surface is non-conductive film (7) ICf tube, 8... Non-conductive Guibond material. Note 1: The same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣを発熱基板に搭載したサーマルヘッドにおいて、Ｉ
Ｃ裏面を非導通にしたＩＣを搭載したことを特徴とする
ＩＣ搭載形サーマルヘッド。In a thermal head with an IC mounted on a heat generating board, I
An IC-mounted thermal head characterized by being equipped with an IC whose back side is non-conductive.
JP1984002610U 1984-01-10 1984-01-10 thermal head Pending JPS60114844U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984002610U JPS60114844U (en) 1984-01-10 1984-01-10 thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984002610U JPS60114844U (en) 1984-01-10 1984-01-10 thermal head

Publications (1)

Publication Number Publication Date
JPS60114844U true JPS60114844U (en) 1985-08-03

Family

ID=30476447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984002610U Pending JPS60114844U (en) 1984-01-10 1984-01-10 thermal head

Country Status (1)

Country Link
JP (1) JPS60114844U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310550U (en) * 1986-07-09 1988-01-23
JPH08181166A (en) * 1994-12-22 1996-07-12 Ibiden Co Ltd Printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310550U (en) * 1986-07-09 1988-01-23
JPH08181166A (en) * 1994-12-22 1996-07-12 Ibiden Co Ltd Printed wiring board

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