JPS6437083A - Manufacture of multilayer printed wiring board - Google Patents

Manufacture of multilayer printed wiring board

Info

Publication number
JPS6437083A
JPS6437083A JP19336087A JP19336087A JPS6437083A JP S6437083 A JPS6437083 A JP S6437083A JP 19336087 A JP19336087 A JP 19336087A JP 19336087 A JP19336087 A JP 19336087A JP S6437083 A JPS6437083 A JP S6437083A
Authority
JP
Japan
Prior art keywords
hole
blind via
layer substrate
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19336087A
Other languages
Japanese (ja)
Other versions
JPH0671143B2 (en
Inventor
Kunio Setsuda
Katsumi Kosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62193360A priority Critical patent/JPH0671143B2/en
Publication of JPS6437083A publication Critical patent/JPS6437083A/en
Publication of JPH0671143B2 publication Critical patent/JPH0671143B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To facilitate the mass-production of a multilayer printed wiring board with a blind via-hole by a method wherein the blind via-hole is provided at the required position in an outer layer substrate on which an adhesive layer is formed and the blind via-hole is aligned with the required pattern of an inner layer substrate and chemical plating is applied to the inside of the blind via-hole to provide electric connection. CONSTITUTION:After an adhesive layer 4 is formed on an outer layer substrate 3, a hole for a blind via-hole 6 is formed. Further, after the outer layer substrate 3 is bonded to an inner layer substrate 7, plating is applied to the inside of the blind via-hole 6. With this constitution, the working efficiency is improved compared to the conventional method wherein the blind via-hole is formed with a drill, the instability of electric characteristics can be eliminated and, further, as the thickness of an outermost copper layer 1 can be arbitrarily selected, a fine pattern can be formed easily and a multilayer printed wiring board with the blind via-hole 6 can be obtained with a high mass-productivity and at a low cost.
JP62193360A 1987-07-31 1987-07-31 Method for manufacturing multilayer printed wiring board Expired - Lifetime JPH0671143B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62193360A JPH0671143B2 (en) 1987-07-31 1987-07-31 Method for manufacturing multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62193360A JPH0671143B2 (en) 1987-07-31 1987-07-31 Method for manufacturing multilayer printed wiring board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3286094A Division JPH0750487A (en) 1994-02-03 1994-02-03 Multilayer printed wiring board

Publications (2)

Publication Number Publication Date
JPS6437083A true JPS6437083A (en) 1989-02-07
JPH0671143B2 JPH0671143B2 (en) 1994-09-07

Family

ID=16306615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62193360A Expired - Lifetime JPH0671143B2 (en) 1987-07-31 1987-07-31 Method for manufacturing multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPH0671143B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102391666A (en) * 2011-08-11 2012-03-28 太仓市新鹿染整有限公司 Peony haematochrome dye and cloth dyeing process
CN102443278A (en) * 2011-09-21 2012-05-09 常州美胜生物材料有限公司 Natural dye and dyeing method thereof
CN102516803A (en) * 2010-12-14 2012-06-27 常州云卿纺织品有限公司 Camellia oleifera shell dye liquor prepared from camellia oleifera shells, preparation method of the camellia oleifera shell dye liquor, and dyeing method adopting the camellia oleifera shell dye liquor
CN102516804A (en) * 2010-12-14 2012-06-27 常州云卿纺织品有限公司 Dye of walnut green husk prepared by walnut green husk, its preparation method and method for dyeing fabric

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6084899A (en) * 1983-10-15 1985-05-14 松下電工株式会社 Method of producing multilayer circuit board
JPS6196578U (en) * 1984-11-30 1986-06-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6084899A (en) * 1983-10-15 1985-05-14 松下電工株式会社 Method of producing multilayer circuit board
JPS6196578U (en) * 1984-11-30 1986-06-21

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102516803A (en) * 2010-12-14 2012-06-27 常州云卿纺织品有限公司 Camellia oleifera shell dye liquor prepared from camellia oleifera shells, preparation method of the camellia oleifera shell dye liquor, and dyeing method adopting the camellia oleifera shell dye liquor
CN102516804A (en) * 2010-12-14 2012-06-27 常州云卿纺织品有限公司 Dye of walnut green husk prepared by walnut green husk, its preparation method and method for dyeing fabric
CN102391666A (en) * 2011-08-11 2012-03-28 太仓市新鹿染整有限公司 Peony haematochrome dye and cloth dyeing process
CN102443278A (en) * 2011-09-21 2012-05-09 常州美胜生物材料有限公司 Natural dye and dyeing method thereof

Also Published As

Publication number Publication date
JPH0671143B2 (en) 1994-09-07

Similar Documents

Publication Publication Date Title
CA2053448A1 (en) Multilayer printed wiring board and process for manufacturing the same
EP1194022A4 (en) Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
WO2005011343A3 (en) Circuit board with embedded components and method of manufacture
CA2364918A1 (en) Method for manufacturing a multilayer printed circuit board and composite foil for use therein
EP0282625A3 (en) Method for producing rigid-type multilayer printed wiring board
WO2003092045A3 (en) Method for producing an electrical circuit
CA2142178A1 (en) Method for manufacturing of a multilayer microwave board and boards obtained on the basis of this method
EP0265629A3 (en) Printed circuit card fabrication process with nickel overplate
EP1146780A3 (en) Circuit board and method of manufacture
JPS6437083A (en) Manufacture of multilayer printed wiring board
EP1802187A3 (en) Printed circuit board and manufacturing method thereof
WO2000046877A3 (en) Printed circuit boards with solid interconnect and method of producing the same
JPH02266586A (en) Flexible printed wiring board and manufacture thereof
EP1273682A4 (en) Laser hole drilling copper foil
JPS6489591A (en) Manufacture of wiring board and that of multilayer wiring board
JPS6459989A (en) Manufacture of printed wiring board
KR200199631Y1 (en) Multi-layer printed circuit board
JPS6484786A (en) Multilayer printed wiring board
JPH0143877Y2 (en)
JPS6459991A (en) Manufacture of printed wiring board
JPS6480100A (en) Manufacture of multilayered printed circuit board
KR20000058240A (en) Manufacturing method for blind via hole of multi-layer printed circuit board
JPS588600B2 (en) Ryomen Print High Senban no Seizouhouhou
JP2521187B2 (en) Method for manufacturing multilayer wiring board
JPH01215092A (en) Manufacture of printed board

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term