JPS6459991A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6459991A
JPS6459991A JP21701687A JP21701687A JPS6459991A JP S6459991 A JPS6459991 A JP S6459991A JP 21701687 A JP21701687 A JP 21701687A JP 21701687 A JP21701687 A JP 21701687A JP S6459991 A JPS6459991 A JP S6459991A
Authority
JP
Japan
Prior art keywords
hole
laminated
board
metal
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21701687A
Other languages
Japanese (ja)
Inventor
Yoshiji Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21701687A priority Critical patent/JPS6459991A/en
Publication of JPS6459991A publication Critical patent/JPS6459991A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To obtain a printed wiring board which has improved insulation properties between a metal board and a wiring pattern and is free from short-circuit defects by a method wherein a hole for a through-hole is drilled from the surface of the metal board opposite to the surface on which an insulating layer and a metal foil are laminated and creation of burrs is suppressed by the insulating layer. CONSTITUTION:A hole 12 for a through-hole is formed by a drill or the like from the surface B of the metal plate 9 of a single-sided copper cladded laminated board 8 opposite to the laminated surface A on which an insulating layer 10 is laminated. After that, three laminated prepregs 13 are provided on the surface B opposite to the laminated surface A and a copper metal foil 14 is provided on the prepregs 13 and the laminated prepregs and the metal foil are molded by heat and pressure. By this process, resin of the prepregs 13 is made to flow and fill the hole 12 and forms an insulating layer between the metal board 9 and the through-hole. After that, a through-hole which is approximately coaxial with the hole 12 and has a diameter smaller than the hole 12 is drilled and plating is applied to the through-hole and a circuit pattern is formed. With this constitution, insulation properties between the metal board 9 and the wiring pattern can be improved and abort-circuit defects can be avoided.
JP21701687A 1987-08-31 1987-08-31 Manufacture of printed wiring board Pending JPS6459991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21701687A JPS6459991A (en) 1987-08-31 1987-08-31 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21701687A JPS6459991A (en) 1987-08-31 1987-08-31 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6459991A true JPS6459991A (en) 1989-03-07

Family

ID=16697506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21701687A Pending JPS6459991A (en) 1987-08-31 1987-08-31 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6459991A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7683266B2 (en) 2005-07-29 2010-03-23 Sanyo Electric Co., Ltd. Circuit board and circuit apparatus using the same
JP2010093292A (en) * 2005-07-29 2010-04-22 Sanyo Electric Co Ltd Circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7683266B2 (en) 2005-07-29 2010-03-23 Sanyo Electric Co., Ltd. Circuit board and circuit apparatus using the same
JP2010093292A (en) * 2005-07-29 2010-04-22 Sanyo Electric Co Ltd Circuit device
US8166643B2 (en) 2005-07-29 2012-05-01 Sanyo Electric Co., Ltd. Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device

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