GB2207558A - Perforated printed circuit boards - Google Patents

Perforated printed circuit boards Download PDF

Info

Publication number
GB2207558A
GB2207558A GB08716406A GB8716406A GB2207558A GB 2207558 A GB2207558 A GB 2207558A GB 08716406 A GB08716406 A GB 08716406A GB 8716406 A GB8716406 A GB 8716406A GB 2207558 A GB2207558 A GB 2207558A
Authority
GB
United Kingdom
Prior art keywords
board
metal
holes
perforated
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08716406A
Other versions
GB2207558B (en
GB8716406D0 (en
Inventor
Abdul Hamed
Kenneth Mark Grey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB8716406A priority Critical patent/GB2207558B/en
Publication of GB8716406D0 publication Critical patent/GB8716406D0/en
Publication of GB2207558A publication Critical patent/GB2207558A/en
Application granted granted Critical
Publication of GB2207558B publication Critical patent/GB2207558B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Electronic printed circuit wiring board consisting of electrically insulating material (10) bonded on one or both sides with copper or other electrically conducting material. The board is perforated with a matrix of hole (13). The unwanted conducting material can be removed by etching chemically. The connecting tracks can be run down (14) or along (15) hole lines or between them (16). Through connections can be made using pins (17) and components mounted on either side (18). <IMAGE>

Description

Description PRE-DRILLED PRINTED CIRCUIT BORRDS This invention relates to electronic printed circuit boards which are drilled, bored or punched with the holes necessary for mounting components.
Electronic components are most frequently assembled on copper clad insulating boards. On these boards, the interconnections between components are made by chemical etching, or otherwise, removing the unwanted conducting material , leaving behind a conducting track. The insulating board is machined to allow components to be mounted. Solder is applied to make the connection between the conductive track and the component. The location of the holes needs to be particularly accurate when integrated circuit components have to be mounted. In large scale production and manufacture this is achieved by expensive punching/ borings drilling equipment. For small volume production, and for hobbyists, manual methods have to be employed. This is a time consuming activity, which does not always yield the quality of hole alignment required, even after considerable effort.
This invention relates to a family of pre-machined circuit boards, which can be laid out and etched using standard methods, but which eliminates entirely, or considerably reduces the problem of producing holes at the correct locations, and with the required alignment.
The invention will be illustrated with reference to the preferred embodiment, which is shown in fig.1. This shows electrically insulating board (10) with copper bonded to both sides (11) and (12). The complete board is perforated with a matrix of holes (13) of about 0.5mum diameter.The hole matrix may be regular or asymmetrical.
The circuit layout for etching can be carried out using standard techniques. The main precaution to be taken, in using this type of board, is to ensure that the layout is on the same size grid as the matrix of prepared holes on the circuit board. The connecting tracks,as shown in fig .5 can be run down (14), or across (15), lines of holes, Description provided the traci-E are wider than the hole diameter, and also in between hole lines ( Both sides of the board may be used with through connections (17) made by inserting pins and soldering as required. Once the board is etched to remove the unwanted conducting material, components(18) can be mounted without any hole punching being necessary.The alignment and quality of the holes is assured for the small volume user of printed circuit boards. Where larger holes are required, the prepared holes may be used as guides.
The alternative embodiments are now described.
For smaller circuits electrically insulating board with conducting material bonded to one surface only may be used. This type of board is shown in Fig.2. The holes are machined throunh the insulating board (20) and the copper(21). Circuit layout and component mounting is similar to the type of board described in fig.t except that conducting tracks will be on one side only.
Components are mounted through the holes (22).
The third version of the board is shown in fig.
Conducting material t8O) is bonded to one side of the electrically insulating board (l) and machined with a matrix of holes (.32) . Conducting material is then bonded to the other side (33). This will allow users to extend only the holes they require through to the second conducting surface, using the part drilled holes as guides for accurate alignment.
The fourth version of the circuit board is shown in fig.4 The electrically insulating board(40) is machined with holes(41) and an electrically conducting material(43) bonded to one side of the insulation board. after etching the board , the required holes are extended through, using the part holes as guides.

Claims (5)

1. Electronic circuit wiring boards comprising of electrically insulating material bonded on one or both surfaces with copper or other electrically conducting material. The board is then perforated with holes.
2. Electronic circuit wiring board comprising of electrically insulating material bonded on one surface with electrically conducting material. The board is perforated with holes and then bonded with electrically conducting material on the second surface.
Electronic circuit wiring board comprising electrically insulating material perfo ated with holes and then bonded with electrically conducting material on one surface.
Amendments to tne calms have been filed as follows 1. A method of manufacturing a start board for use in the formation of a printed circuit board of the kind comprising a substantially rigid board of which at least the major surfaces are of electrically insulating material, which carries on one or each of its major surfaces a pattern of strips and/or pads of metal or metal alloy of high electrically conductivity, and which has, extending through the board and the overlying metal strips and/or pads, a multiplicity of mutually spaced holes, which method comprises drilling or otherwise forming a multiplicity of mutually spaced holes through a substantially rigid board of which at least the major surfaces are of electrically insulating material, applying over at least a major portion of one or each major surface of the perforated board a continuous coating of metal or metal alloy of high electrical conductivity, and etching away or otherwise removing metal or metal alloy of said one metal coating or of at least one of said metal coatings to leave a pattern of metal strips and/or pads overlying the multiplicity of holes in the underlying perforated board.
2. .A method as claimed in Claim 1, wherein holes are formed through the metal strips and/or pads of said pattern or of at least one of said patterns opening into holes in the underlying perforated board.
3. For use in the manufacture of a printed circuit board of the kind comprising a substantially rigid board of which at least the major surfaces are of electrically insulating material, which carries on one or each of its surfaces a pattern of strips and/or pads of metal or metal alloy of high electrical conductivity, and which has, extending through the board and the overlying metal strips and/or pads, a multiplicity of mutually spaced holes, a start board comprising a substantially rigid board of which at least the major surfaces are of electrically insulating material, which has a multiplicity of mutually spaced holes extending through the board, and which has overlying at least a major portion of one or each major surface of the perforated board a continuous coating of a metal or metal alloy of high electrical conductivity.
4. A start board as claimed in Claim 3, wherein a continuous coating of a metal or metal alloy of high electrical conductivity overlies at least a major portion of one major surface of the perforated board, and a pattern of non-perforated strips and/or pads of metal or metal alloy of high electrical conductivity overlies parts of the other major surface of and holes in the perforated board.
5. A printed circuit board comprising a substantially rigid board of which at least the major surfaces are of electrically insulating material, which has a multiplicity of mutually spaced holes extending through the board, and which has, on one or each of its major surfaces, a pattern of non-perforated strips and/or pads of metal or metal alloy of high electrical conductivity which overlie holes in the underlying perforated board.
GB8716406A 1987-07-11 1987-07-11 Printed circuit boards Expired - Lifetime GB2207558B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8716406A GB2207558B (en) 1987-07-11 1987-07-11 Printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8716406A GB2207558B (en) 1987-07-11 1987-07-11 Printed circuit boards

Publications (3)

Publication Number Publication Date
GB8716406D0 GB8716406D0 (en) 1987-08-19
GB2207558A true GB2207558A (en) 1989-02-01
GB2207558B GB2207558B (en) 1991-10-30

Family

ID=10620537

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8716406A Expired - Lifetime GB2207558B (en) 1987-07-11 1987-07-11 Printed circuit boards

Country Status (1)

Country Link
GB (1) GB2207558B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0399661A2 (en) * 1989-05-22 1990-11-28 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure
DE19900912A1 (en) * 1999-01-13 2000-07-20 Christian Gaertner Board, for electronic circuit board manufacture, comprises a pre-stamped board having holes filled with a soft filler or having an applied thin substrate to eliminate the need for drilling

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB964557A (en) * 1962-07-02 1964-07-22 Marconi Co Ltd Improvements in or relating to printed circuits and methods of manufacturing the same
GB1120583A (en) * 1965-05-19 1968-07-17 British Aircraft Corp Ltd Improvements relating to printed circuits
GB1124298A (en) * 1964-11-04 1968-08-21 Btr Industries Ltd Improvements in or relating to printed circuits
GB1174043A (en) * 1966-03-01 1969-12-10 British Aircraft Corp Ltd Improvements relating to the manufacture of Printed Circuits
GB1396481A (en) * 1973-02-15 1975-06-04 Matsushita Electric Ind Co Ltd Manufacture of printed circuit boards
GB1410780A (en) * 1972-09-29 1975-10-22 Exacta Circuits Ltd Through-hole plated printed circuits

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1468065A (en) * 1973-03-24 1977-03-23 Sumitomo Bakelite Co Electrically insulating board
GB8322474D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
EP0164564A1 (en) * 1984-05-18 1985-12-18 Siemens Aktiengesellschaft Arrangement for the production of blind holes in a laminated construction

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB964557A (en) * 1962-07-02 1964-07-22 Marconi Co Ltd Improvements in or relating to printed circuits and methods of manufacturing the same
GB1124298A (en) * 1964-11-04 1968-08-21 Btr Industries Ltd Improvements in or relating to printed circuits
GB1120583A (en) * 1965-05-19 1968-07-17 British Aircraft Corp Ltd Improvements relating to printed circuits
GB1174043A (en) * 1966-03-01 1969-12-10 British Aircraft Corp Ltd Improvements relating to the manufacture of Printed Circuits
GB1410780A (en) * 1972-09-29 1975-10-22 Exacta Circuits Ltd Through-hole plated printed circuits
GB1396481A (en) * 1973-02-15 1975-06-04 Matsushita Electric Ind Co Ltd Manufacture of printed circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0399661A2 (en) * 1989-05-22 1990-11-28 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure
EP0399661A3 (en) * 1989-05-22 1992-01-08 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure
DE19900912A1 (en) * 1999-01-13 2000-07-20 Christian Gaertner Board, for electronic circuit board manufacture, comprises a pre-stamped board having holes filled with a soft filler or having an applied thin substrate to eliminate the need for drilling

Also Published As

Publication number Publication date
GB2207558B (en) 1991-10-30
GB8716406D0 (en) 1987-08-19

Similar Documents

Publication Publication Date Title
US5404637A (en) Method of manufacturing multilayer printed wiring board
US20020136873A1 (en) Method of making a circuit board
US4064357A (en) Interconnected printed circuits and method of connecting them
DK457688D0 (en) PROCEDURE FOR MANUFACTURING A MULTIPLE PRINTED CIRCUIT CARD
GB2207558A (en) Perforated printed circuit boards
GB2247361A (en) Conductive through-holes in printed wiring boards
US6391211B1 (en) Method for making an electrical circuit board
US3429037A (en) Method of making tubular solder connectors
US4410574A (en) Printed circuit boards and methods for making same
US6740246B2 (en) Circuit board and a method for making the same
JPH06296076A (en) Side face electrode forming method of smd module
US6467161B2 (en) Method for making a circuit board
EP0599476A1 (en) A connection device for a printed wiring board
JPH11126951A (en) Printed circuit board and its manufacture
US7124503B1 (en) Method for forming multilayer circuit board
US6613239B2 (en) Method for making an electrical circuit board
JP3202836B2 (en) Manufacturing method of multilayer printed wiring board
JPS6141272Y2 (en)
JPS6024088A (en) Method of producing testing printed board
JPS62169494A (en) Manufacture of high density printed board
JPS62196896A (en) Manufacture of printed wiring board
JPS584999A (en) Method of producing printed circuit board
JPH0464278A (en) Manufacture of printed wiring board
EP0594408A1 (en) A connection device for a printed wiring board
JP2720853B2 (en) Manufacturing method of printed wiring board

Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950711