GB1410780A - Through-hole plated printed circuits - Google Patents

Through-hole plated printed circuits

Info

Publication number
GB1410780A
GB1410780A GB4515972A GB4515972A GB1410780A GB 1410780 A GB1410780 A GB 1410780A GB 4515972 A GB4515972 A GB 4515972A GB 4515972 A GB4515972 A GB 4515972A GB 1410780 A GB1410780 A GB 1410780A
Authority
GB
United Kingdom
Prior art keywords
layer
hole
alloy
photoresist
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4515972A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EXACTA CIRCUITS Ltd
Original Assignee
EXACTA CIRCUITS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EXACTA CIRCUITS Ltd filed Critical EXACTA CIRCUITS Ltd
Priority to GB4515972A priority Critical patent/GB1410780A/en
Publication of GB1410780A publication Critical patent/GB1410780A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

1410780 Printed circuits EXACTA CIRCUITS Ltd 28 Sept 1973 [29 Sept 1972] 45159/72 Heading H1R A GRP substrate is coated with copper on each exposed face and holes extend through both the layers and the substrate. A second layer of copper is deposited on each first layer and on the walls of the holes, e.g. as a thin electrolessly plated layer, or a similar layer plus a thicker electroplated layer. A layer of positive photoresist is deposited over the first and second layers but not on the hole walls, and discrete portions adjacent to each hole are light exposed over a photomask and removed by development and dissolution to uncover a portion of the layers surrounding the hole. A layer of Cu and of Sn-Pb alloy are electroplated thereon to cover the uncovered portion and the hole walls and then portions of the photoresist are again exposed to light, developed and dissolved; the uncovered parts being etched out where unprotected either by photoresist or Sn-Pb alloy, to define the required printed circuit tracks; with a pad of alloy surrounding each hole. The photoresist is removed, the boards are profiled, cleaned, and coated with an epoxy solder resisting lacquer. The Sn-Pb alloy may be replaced with Au or other noble metal.
GB4515972A 1972-09-29 1972-09-29 Through-hole plated printed circuits Expired GB1410780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4515972A GB1410780A (en) 1972-09-29 1972-09-29 Through-hole plated printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4515972A GB1410780A (en) 1972-09-29 1972-09-29 Through-hole plated printed circuits

Publications (1)

Publication Number Publication Date
GB1410780A true GB1410780A (en) 1975-10-22

Family

ID=10436121

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4515972A Expired GB1410780A (en) 1972-09-29 1972-09-29 Through-hole plated printed circuits

Country Status (1)

Country Link
GB (1) GB1410780A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502444A1 (en) * 1981-03-18 1982-09-24 Licentia Gmbh PROCESS FOR PRODUCING PRINTED CIRCUITS
GB2142478A (en) * 1983-07-01 1985-01-16 Welwyn Electronics Ltd Printed circuit boards
EP0233201A1 (en) * 1985-08-08 1987-08-26 Macdermid Incorporated Method for manufacture of printed circuit boards
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
CN113508458A (en) * 2019-05-08 2021-10-15 Lsr工程与咨询有限公司 Method for structuring a substrate

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502444A1 (en) * 1981-03-18 1982-09-24 Licentia Gmbh PROCESS FOR PRODUCING PRINTED CIRCUITS
GB2142478A (en) * 1983-07-01 1985-01-16 Welwyn Electronics Ltd Printed circuit boards
EP0233201A1 (en) * 1985-08-08 1987-08-26 Macdermid Incorporated Method for manufacture of printed circuit boards
EP0233201A4 (en) * 1985-08-08 1987-11-30 Macdermid Inc Method for manufacture of printed circuit boards.
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
CN113508458A (en) * 2019-05-08 2021-10-15 Lsr工程与咨询有限公司 Method for structuring a substrate
CN113508458B (en) * 2019-05-08 2024-05-31 Lsr工程与咨询有限公司 Method for structuring a substrate

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Legal Events

Date Code Title Description
PS Patent sealed
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee