JPS5515235A - Thin film circuit - Google Patents

Thin film circuit

Info

Publication number
JPS5515235A
JPS5515235A JP8811178A JP8811178A JPS5515235A JP S5515235 A JPS5515235 A JP S5515235A JP 8811178 A JP8811178 A JP 8811178A JP 8811178 A JP8811178 A JP 8811178A JP S5515235 A JPS5515235 A JP S5515235A
Authority
JP
Japan
Prior art keywords
solder
thin film
applying
connection
sloder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8811178A
Other languages
Japanese (ja)
Other versions
JPS5850421B2 (en
Inventor
Mitsuhiko Tashiro
Emiko Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP53088111A priority Critical patent/JPS5850421B2/en
Publication of JPS5515235A publication Critical patent/JPS5515235A/en
Publication of JPS5850421B2 publication Critical patent/JPS5850421B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To establish a solder connection with a high reliability by laminating a metallic layer used for a barrier against the solder diffusion and a metallic layer having an excellent solder applying, on an Au thin film.
CONSTITUTION: A Cr 2 and Au 3 are coated on an almina substrat 1 and an etching is provided for a desirable pattern in a reverse order to make a thin film wiring conductor. Successively, A Ni 4 is plated as a solder diffusion barrier by a resist mask on the Au 3. Successively, a Cu 5 with an excellent solder applying and sloder 6 are in turn plated by using the mask on a Ni 4 of the connection terminal to remove a resist. When the solder 6 may be resolved by heating the thin film circuit, the solder 6 remainds in the connection terminal position and is not flown out on the Au 3. This solder connection can be establishe with the Au. The metal for solder diffusion barrier includes Ni, Ti, Mo, W, and Ta effective for it, and Su, Cu, Pb, Zn, Ag are used as the metal with a good sloder applying property.
COPYRIGHT: (C)1980,JPO&Japio
JP53088111A 1978-07-19 1978-07-19 thin film circuit Expired JPS5850421B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53088111A JPS5850421B2 (en) 1978-07-19 1978-07-19 thin film circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53088111A JPS5850421B2 (en) 1978-07-19 1978-07-19 thin film circuit

Publications (2)

Publication Number Publication Date
JPS5515235A true JPS5515235A (en) 1980-02-02
JPS5850421B2 JPS5850421B2 (en) 1983-11-10

Family

ID=13933764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53088111A Expired JPS5850421B2 (en) 1978-07-19 1978-07-19 thin film circuit

Country Status (1)

Country Link
JP (1) JPS5850421B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576659A (en) * 1982-12-02 1986-03-18 International Business Machines Corporation Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures
JPS63114237A (en) * 1986-10-31 1988-05-19 Sony Corp Structure of solder electrode
US4929516A (en) * 1985-03-14 1990-05-29 Olin Corporation Semiconductor die attach system
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
US5021300A (en) * 1989-09-05 1991-06-04 Raytheon Company Solder back contact
US5427983A (en) * 1992-12-29 1995-06-27 International Business Machines Corporation Process for corrosion free multi-layer metal conductors

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576659A (en) * 1982-12-02 1986-03-18 International Business Machines Corporation Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures
US4929516A (en) * 1985-03-14 1990-05-29 Olin Corporation Semiconductor die attach system
JPS63114237A (en) * 1986-10-31 1988-05-19 Sony Corp Structure of solder electrode
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
US5021300A (en) * 1989-09-05 1991-06-04 Raytheon Company Solder back contact
US5427983A (en) * 1992-12-29 1995-06-27 International Business Machines Corporation Process for corrosion free multi-layer metal conductors

Also Published As

Publication number Publication date
JPS5850421B2 (en) 1983-11-10

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