JPS5757886A - Heat resistant silver coated conductor - Google Patents
Heat resistant silver coated conductorInfo
- Publication number
- JPS5757886A JPS5757886A JP13272780A JP13272780A JPS5757886A JP S5757886 A JPS5757886 A JP S5757886A JP 13272780 A JP13272780 A JP 13272780A JP 13272780 A JP13272780 A JP 13272780A JP S5757886 A JPS5757886 A JP S5757886A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- coated
- coated conductor
- heat resistant
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To obtain an inexpensive Ag coated conductor enhancing the adhesion of the Ag coated layer after head deterioration in an oxidizing atmosphere and enabling the reduction of the layer in thickness by forming a Co layer having a prescribed thickness as an under coat metallic layer on a Cu or Cu alloy substrate and coating the Co layer with Ag.
CONSTITUTION: On a Cu or Cu alloy substrate an under coat metallic layer of Co having 0.2W4, especially about 1μm thickness is formed, and the layer is coated with an Ag layer to obtain the desired heat resistant Ag coated conductor. The Ag coated layer may be converted into an Ag alloy layer by adding ≥1 kind of metallic element having an effect of controlling the oxygen permeability of ag, e.g., Sb, Se, Sn, Zn, Ni or Cu. The Ag coated conductor is suitable for use as a lead frame matetrial for electronic parts, especially a semiconductor circuit element.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13272780A JPS5757886A (en) | 1980-09-24 | 1980-09-24 | Heat resistant silver coated conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13272780A JPS5757886A (en) | 1980-09-24 | 1980-09-24 | Heat resistant silver coated conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5757886A true JPS5757886A (en) | 1982-04-07 |
Family
ID=15088168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13272780A Pending JPS5757886A (en) | 1980-09-24 | 1980-09-24 | Heat resistant silver coated conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5757886A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6480111A (en) * | 1987-09-22 | 1989-03-27 | Japan Broadcasting Corp | Matching circuit |
| DE4112416A1 (en) * | 1990-04-16 | 1991-10-17 | Mitsubishi Electric Corp | LADDER FRAME MATERIAL FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE LADDER FRAME MATERIAL |
| WO2002049077A2 (en) * | 2000-12-11 | 2002-06-20 | Handy & Harman | Barrier layer for electrical connectors and methods of applying the layer |
| JP2009079250A (en) * | 2007-09-26 | 2009-04-16 | Dowa Metaltech Kk | Copper or copper alloy member having silver alloy layer formed as outermost surface layer, and manufacturing method therefor |
| JP2011231369A (en) * | 2010-04-27 | 2011-11-17 | Dowa Metaltech Kk | Plated member and method of manufacturing the same |
| JP2014051685A (en) * | 2012-09-04 | 2014-03-20 | Nistec:Kk | Metal component |
| JP2015140469A (en) * | 2014-01-30 | 2015-08-03 | Jx日鉱日石金属株式会社 | ELECTRONIC COMPONENT HAVING Ag-Sb PLATING FILM, Ag-Sb PLATING SOLUTION AND PRODUCTION METHOD OF ELECTRONIC COMPONENT |
-
1980
- 1980-09-24 JP JP13272780A patent/JPS5757886A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6480111A (en) * | 1987-09-22 | 1989-03-27 | Japan Broadcasting Corp | Matching circuit |
| JPH061879B2 (en) * | 1987-09-22 | 1994-01-05 | 日本放送協会 | Matching circuit |
| DE4112416A1 (en) * | 1990-04-16 | 1991-10-17 | Mitsubishi Electric Corp | LADDER FRAME MATERIAL FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE LADDER FRAME MATERIAL |
| US5167794A (en) * | 1990-04-16 | 1992-12-01 | Mitsubishi Denki Kabushiki Kaisha | Method for producing lead frame material |
| WO2002049077A2 (en) * | 2000-12-11 | 2002-06-20 | Handy & Harman | Barrier layer for electrical connectors and methods of applying the layer |
| WO2002049077A3 (en) * | 2000-12-11 | 2002-09-26 | Handy & Harman | Barrier layer for electrical connectors and methods of applying the layer |
| US6755958B2 (en) | 2000-12-11 | 2004-06-29 | Handy & Harman | Barrier layer for electrical connectors and methods of applying the layer |
| JP2009079250A (en) * | 2007-09-26 | 2009-04-16 | Dowa Metaltech Kk | Copper or copper alloy member having silver alloy layer formed as outermost surface layer, and manufacturing method therefor |
| JP2011231369A (en) * | 2010-04-27 | 2011-11-17 | Dowa Metaltech Kk | Plated member and method of manufacturing the same |
| JP2014051685A (en) * | 2012-09-04 | 2014-03-20 | Nistec:Kk | Metal component |
| JP2015140469A (en) * | 2014-01-30 | 2015-08-03 | Jx日鉱日石金属株式会社 | ELECTRONIC COMPONENT HAVING Ag-Sb PLATING FILM, Ag-Sb PLATING SOLUTION AND PRODUCTION METHOD OF ELECTRONIC COMPONENT |
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