JPS5757885A - Heat resistant silver coated conductor - Google Patents

Heat resistant silver coated conductor

Info

Publication number
JPS5757885A
JPS5757885A JP13135680A JP13135680A JPS5757885A JP S5757885 A JPS5757885 A JP S5757885A JP 13135680 A JP13135680 A JP 13135680A JP 13135680 A JP13135680 A JP 13135680A JP S5757885 A JPS5757885 A JP S5757885A
Authority
JP
Japan
Prior art keywords
alloy
layer
conductor
coated conductor
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13135680A
Other languages
Japanese (ja)
Inventor
Ryozo Yamagishi
Osamu Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP13135680A priority Critical patent/JPS5757885A/en
Publication of JPS5757885A publication Critical patent/JPS5757885A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To obtain an Ag coated conductor with superior heat resistance, peeling resistance, solderability, etc. after heat deterioration in the air by forming in intermediate layer of Co (alloy) on an under coat metallic layer of Ni or Co formed on a Cu or alloy conductor and coating the intermediate layer with an Ag layer.
CONSTITUTION: On a Cu or alloy conductor an under coat metallic layer of Ni or Co is formed by plating, and on the layer a Co or Co alloy having 0.02W2, especially about 0.2μm thickness is formed as an intermediate layer. When the intermediate layer is made of Co alloy, the Co content of the alloy is adjusted to 10W 100wt%. As the alloying component of the Co alloy ≥1 kind of metallic element having a higher speed of diffusion in Ag than Co, e.g., Sn, In or Bi is added. The itermediate layer is then coated with an Ag layer to obtain the desired heat resistance coated conductor.
COPYRIGHT: (C)1982,JPO&Japio
JP13135680A 1980-09-19 1980-09-19 Heat resistant silver coated conductor Pending JPS5757885A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13135680A JPS5757885A (en) 1980-09-19 1980-09-19 Heat resistant silver coated conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13135680A JPS5757885A (en) 1980-09-19 1980-09-19 Heat resistant silver coated conductor

Publications (1)

Publication Number Publication Date
JPS5757885A true JPS5757885A (en) 1982-04-07

Family

ID=15056002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13135680A Pending JPS5757885A (en) 1980-09-19 1980-09-19 Heat resistant silver coated conductor

Country Status (1)

Country Link
JP (1) JPS5757885A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4112416A1 (en) * 1990-04-16 1991-10-17 Mitsubishi Electric Corp LADDER FRAME MATERIAL FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE LADDER FRAME MATERIAL
JP2017197802A (en) * 2016-04-27 2017-11-02 矢崎総業株式会社 Plated material and terminal using plated terminal

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4112416A1 (en) * 1990-04-16 1991-10-17 Mitsubishi Electric Corp LADDER FRAME MATERIAL FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE LADDER FRAME MATERIAL
US5167794A (en) * 1990-04-16 1992-12-01 Mitsubishi Denki Kabushiki Kaisha Method for producing lead frame material
JP2017197802A (en) * 2016-04-27 2017-11-02 矢崎総業株式会社 Plated material and terminal using plated terminal

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