JPS5760097A - Heat resistant silver coated conductor - Google Patents

Heat resistant silver coated conductor

Info

Publication number
JPS5760097A
JPS5760097A JP13547780A JP13547780A JPS5760097A JP S5760097 A JPS5760097 A JP S5760097A JP 13547780 A JP13547780 A JP 13547780A JP 13547780 A JP13547780 A JP 13547780A JP S5760097 A JPS5760097 A JP S5760097A
Authority
JP
Japan
Prior art keywords
silver
conductor
alloy
coated conductor
silver coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13547780A
Other languages
Japanese (ja)
Inventor
Ryozo Yamagishi
Osamu Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP13547780A priority Critical patent/JPS5760097A/en
Publication of JPS5760097A publication Critical patent/JPS5760097A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To provide a silver coated conductor of superior heat resistance after deterioration by heating in the atmosphere, peeling resistance, soldering property etc. by providing an intermediate layer consisting of an Ni alloy on the underlying plating of Ni or Co on the conductor of copper oe various alloys and further carrying out a silver coating thereon.
CONSTITUTION: Underlying plating of Ni or Co is carried out on a conductor of copper or various alloys. Next, an intermediate layer of an Ni alloy (e.g.; Ni-Sn alloy) of ≥0.02μ thickness, more particularly around 0.2μ is plated on this underlying plating. This Ni alloy contains preferably 10W98% Ni. Thence, the above-described conductor provided with such intermediate layer is passed through, for example, a low silver concn. bath, whereby it is subjected to silver strike plating after which it is passed through a silver cyanide bath, whereby it is silver plated and the silver coated conductor is made. As a result, the silver coated conductor having the above-described characteristics is obtained inexpensively.
COPYRIGHT: (C)1982,JPO&Japio
JP13547780A 1980-09-29 1980-09-29 Heat resistant silver coated conductor Pending JPS5760097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13547780A JPS5760097A (en) 1980-09-29 1980-09-29 Heat resistant silver coated conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13547780A JPS5760097A (en) 1980-09-29 1980-09-29 Heat resistant silver coated conductor

Publications (1)

Publication Number Publication Date
JPS5760097A true JPS5760097A (en) 1982-04-10

Family

ID=15152621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13547780A Pending JPS5760097A (en) 1980-09-29 1980-09-29 Heat resistant silver coated conductor

Country Status (1)

Country Link
JP (1) JPS5760097A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092647A (en) * 1983-10-27 1985-05-24 Toshiba Corp External lead for electronic part
JPS60100695A (en) * 1983-11-07 1985-06-04 Oki Electric Ind Co Ltd Method for plating semiconductor device
US11264546B2 (en) 2018-09-27 2022-03-01 Nichia Corporation Metallic structure for optical semiconductor device, method for producing the same, and optical semiconductor device using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092647A (en) * 1983-10-27 1985-05-24 Toshiba Corp External lead for electronic part
JPS60100695A (en) * 1983-11-07 1985-06-04 Oki Electric Ind Co Ltd Method for plating semiconductor device
US11264546B2 (en) 2018-09-27 2022-03-01 Nichia Corporation Metallic structure for optical semiconductor device, method for producing the same, and optical semiconductor device using the same

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