JPS5760097A - Heat resistant silver coated conductor - Google Patents
Heat resistant silver coated conductorInfo
- Publication number
- JPS5760097A JPS5760097A JP13547780A JP13547780A JPS5760097A JP S5760097 A JPS5760097 A JP S5760097A JP 13547780 A JP13547780 A JP 13547780A JP 13547780 A JP13547780 A JP 13547780A JP S5760097 A JPS5760097 A JP S5760097A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- conductor
- alloy
- coated conductor
- silver coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To provide a silver coated conductor of superior heat resistance after deterioration by heating in the atmosphere, peeling resistance, soldering property etc. by providing an intermediate layer consisting of an Ni alloy on the underlying plating of Ni or Co on the conductor of copper oe various alloys and further carrying out a silver coating thereon.
CONSTITUTION: Underlying plating of Ni or Co is carried out on a conductor of copper or various alloys. Next, an intermediate layer of an Ni alloy (e.g.; Ni-Sn alloy) of ≥0.02μ thickness, more particularly around 0.2μ is plated on this underlying plating. This Ni alloy contains preferably 10W98% Ni. Thence, the above-described conductor provided with such intermediate layer is passed through, for example, a low silver concn. bath, whereby it is subjected to silver strike plating after which it is passed through a silver cyanide bath, whereby it is silver plated and the silver coated conductor is made. As a result, the silver coated conductor having the above-described characteristics is obtained inexpensively.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13547780A JPS5760097A (en) | 1980-09-29 | 1980-09-29 | Heat resistant silver coated conductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13547780A JPS5760097A (en) | 1980-09-29 | 1980-09-29 | Heat resistant silver coated conductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5760097A true JPS5760097A (en) | 1982-04-10 |
Family
ID=15152621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13547780A Pending JPS5760097A (en) | 1980-09-29 | 1980-09-29 | Heat resistant silver coated conductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5760097A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6092647A (en) * | 1983-10-27 | 1985-05-24 | Toshiba Corp | External lead for electronic part |
JPS60100695A (en) * | 1983-11-07 | 1985-06-04 | Oki Electric Ind Co Ltd | Method for plating semiconductor device |
US11264546B2 (en) | 2018-09-27 | 2022-03-01 | Nichia Corporation | Metallic structure for optical semiconductor device, method for producing the same, and optical semiconductor device using the same |
-
1980
- 1980-09-29 JP JP13547780A patent/JPS5760097A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6092647A (en) * | 1983-10-27 | 1985-05-24 | Toshiba Corp | External lead for electronic part |
JPS60100695A (en) * | 1983-11-07 | 1985-06-04 | Oki Electric Ind Co Ltd | Method for plating semiconductor device |
US11264546B2 (en) | 2018-09-27 | 2022-03-01 | Nichia Corporation | Metallic structure for optical semiconductor device, method for producing the same, and optical semiconductor device using the same |
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